NTC Type SMD
Thermometrics Surface
Mount Devices
EIA Style 1206
Nickel barrier solder coated
3 sided wrap around
0.5 mm (0.02 in)
typical
1.27 mm
(0.05 in)
maximum
1.6 mm ±0.2 mm
(0.063 mm ±0.008 in)
3.2 mm ±0.2 mm
(0.126 in ±0.008 in)
Features
• Nickel barrier tin plated terminations for
soldering
• Suitable for standard soldering techniques
• High sensitivity to changes in temperature
• Excellent solderability without
“tombstoning”
• Wide operating temperature range -40°F to
257°F (-40°C to 125°C)
• Ceramic between electrodes glass coated
for improved stability
• Rugged construction
• Supplied in tape-and-reel packaging
• Available in other material systems
• Intended for temperature measurement,
control and compensation
Amphenol
Advanced Sensors
Type NHQ
Specification
0.5 mm ±0.2 mm
(0.0197 in ±0.008 in)
1.6 mm ±0.2 mm
(0.063 in ±0.008 in)
Surface mount chip 1206 size
Description
1.2 mm (0.0472 in)
maximum
A range of 1206 size surface mount NTC chip
thermistors.The terminations are nickel barrier
with tin plating.
General
3.2 mm ±0.2 mm
(0.126 in ±0.008 in)
Soldering Recommendations
• Maximum storage time in closed package:
One year
• Maximum storage time exposed to ambient
conditions of 59°F to 86°F (15°C to 30°C),
15% to 70% RH: 30 days
• Drying prior to soldering: Not to exceed 48h
at 176°F (80°C) or 16h at 212°F (100°C) or 8h
at 257°F (125°C)
• Flux type: R or RMA
Code
R25 W
B (25/85)
NHQ202B410T5
2000
4100
NHQ222B410T5
2200
4100
NHQ252B410T5
2500
4100
NHQ302B410T5
3000
4100
Flow Soldering Conditions
NHQ472B355T5
4700
3550
• Preheat temperature: 176°F to 302°F (80°C to
150°C)
• Maximum rate of temperature change:
4.5°F/s or 2.5°C/s
• Maximum solder temperature: 509°F (265°C)
• Maximum dwell time: 10 seconds
• Cooling in ambient or air flow of 5m/s
NHQ502B355T5
5000
3550
NHQ103B375T5
10000
3750
NHQ153B400T5
15000
4000
NHQ203B400T5
20000
4000
NHQ223B400T5
22000
4000
NHQ303B400T5
30000
4000
NHQ333B400T5
33000
4000
Reflow Soldering Conditions
NHQ473B400T5
47000
4000
NHQ503B400T5
50000
4000
NHQ104B425T5
100000
4250
NHQ154B425T5
150000
4250
NHQ304B435T5
300000
4350
NHQ474B435T5
470000
4350
NHQ504B435T5
500000
4350
• Method infrared, hot gas, vapor
• Maximum rate of preheat temperature
change: 4.5°F/s or 2.5°C/s
• Maximum temperature: 437°F (225°C)
• Maximum time above: 392°F (200°C) 30
seconds
• Maximum radiant flux: (0.1 to 100 W µ) 5 W/
cm2
• Maximum hot air temperature: 527°F (275°C)
at 4 m/s
• Maximum vapor temperature: 419°F (215°C)
• Maximum rate of cooling: 4.5°F/s or 2.5°C/s
Cleaning
Ultrasonic cleaning in methanol or isopropanol
not exceeding 40 kHz for 5 minutes, or
aqueous cleaning not exceeding 158°F (70°C)
for 7 minutes (recommended).
2
NTC Type NHQ Outline Drawing
Data
• Resistance tolerance at 77°F (25°C) ±5%;
for ±10% replace T5 by T10 in code.
• Tolerance on B value ±200 K
• Minimum temperature: -40°F (-40°C)
• Maximum temperature: 257°F (125°C)
• Dissipation factor: 3 mW/K
• Time constant: 8 seconds maximum
Surface mount chip 0805 size
Description
General
1.2 mm (0.0472 in)
maximum
A range of 0805 size surface mount NTC chip
thermistors.The terminations are nickel barrier with tin
plating.
0.4 mm ±0.2 mm
(0.0157 in ±0.008 in)
1.25 mm ±0.2 mm
(0.0492 in ±0.008 in)
Type NHQM
Specification
2 mm ±0.2 mm
(0.0787 in ±0.008 in)
Soldering Recommendations
• Maximum storage time in closed package: One year
• Maximum storage time exposed to ambient conditions
of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30
days
• Drying prior to soldering: Not to exceed 48h at 176°F
(80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C)
• Flux type: R or RMA
Flow Soldering Conditions
•
•
•
•
•
Preheat temperature: 176°F to 302°F (80°C to 150°C)
Maximum rate of temperature change: 4.5°F/s or
2.5°C/s
Maximum solder temperature: 509°F (265°C)
Maximum dwell time: 10 seconds
Cooling in ambient or air flow of 5m/s
Reflow Soldering Conditions
• Method infrared, hot gas, vapor
• Maximum rate of preheat temperature change: 4.5°F/s
or 2.5°C/s
• Maximum temperature: 437°F (225°C)
• Maximum time above: 392°F (200°C) 30 seconds
• Maximum radiant flux: (0.1 to 100 Wµ) 5 W µ/cm2
• Maximum hot air temperature: 527°F (275°C) at 4 m/s
• Maximum vapor temperature: 419°F (215°C)
• Maximum rate of cooling: 4.5°F/s or 2.5°Cs
Cleaning
Ultrasonic cleaning in methanol or isopropanol not
exceeding 40 kHz for 5 minutes, or aqueous cleaning not
exceeding 158°F (70°C) for 7 minutes (recommended).
NTC Type NHQM Outline Drawing
Code
R25 W
B (25/85°C)
NHQM202B410T5
2000
4100
NHQM252B410T5
2500
4100
NHQM272B410T5
2700
4100
NHQM302B410T5
3000
4100
NHQM472B355T5
4700
3550
NHQM502B355T5
5000
3550
NHQM682B375T5
6800
3750
NHQM103B375T5
10000
3750
NHQM153B400T5
15000
4000
NHQM203B400T5
20000
4000
NHQM223B400T5
22000
4000
NHQM273B400T5
27000
4000
NHQM303B400T5
30000
4000
NHQM333B400T5
33000
4000
NHQM473B415T5
47000
4150
NHQM503B415T5
50000
4150
NHQM104B425T5
100000
4250
NHQM154B425T5
150000
4250
NHQM304B425T5
300000
4250
NHQM474B435T5
470000
4350
NHQM504B435T5
500000
4350
Data
• Resistance tolerance at 77°F (25°C) ±5%; for
±10% replace T5 by T10 in code.
• Tolerance on B value ±200 K
• Minimum temperature: -40°F (-40°C)
• Maximum temperature: 257°F (125°C)
• Dissipation factor: 1.5 mW/K
• Time constant: 5 seconds maximum
3
Surface mount chip 0603 size
Description
General
1 mm max
(0.039 in max)
A range of 0603 size surface mount NTC chip
thermistors.The terminations are nickel barrier
with tin plating.
0.3 mm ± 0.2 mm
(0.012 in ± 0.008 in)
0.8 mm ± 2 mm
(0.031 in ± 0.08 in)
Type NHQMM
Specification
1.6 mm ± 0.2 mm
(0.063 in ± 0.008 in)
Soldering Recommendations
• Maximum storage time in closed package:
One year
• Maximum storage time exposed to ambient
conditions of 59°F to 86°F (15°C to 30°C),
15% to 70% RH: 30 days
• Drying prior to soldering: Not to exceed 48h
at 176°F (80°C) or 16h at 212°F (100°C) or
8h at 257°F (125°C)
• Flux type: R or RMA
Flow Soldering Conditions
• Preheat temperature: 176°F to 302°F (80°C
to 150°C)
• Maximum rate of temperature change:
4.5°F/s or 2.5°C/s
• Maximum solder temperature: 509°F
(265°C)
• Maximum dwell time: 10 seconds
• Cooling in ambient or air flow of 5m/s
Reflow Soldering Conditions
• Method infrared, hot gas, vapor
• Maximum rate of preheat temperature
change: 4.5°F/s or 2.5°C/s
• Maximum temperature: 437°F (225°C)
• Maximum time above: 392°F (200°C) 30
seconds
• Maximum radiant flux: (0.1 to 100 Wµ) 5
Wµ/cm2
• Maximum hot air temperature: 527°F
(275°C) at 4 m/s
• Maximum vapor temperature: 419°F (215°C)
• Maximum rate of cooling: 4.5°F/s or 2.5°C/s
Cleaning
Ultrasonic cleaning in methanol or
isopropanol not exceeding 40 kHz for 5
minutes, or aqueous cleaning not exceeding
158°F (70°C) for 7 minutes (recommended).
4
NTC Type NHQMM Outline Drawing
Code
R25 W
B (25/85)
NHQMM202B410T5
2000
4100
NHQMM222B410T5
2200
4100
NHQMM302B410T5
3000
4100
NHQMM332B410T5
3300
4100
NHQMM472B355T5
4700
3550
NHQMM502B355T5
5000
3550
NHQMM682B355T5
6800
3550
NHQMM103B375T5
10000
3750
NHQMM153B380T5
15000
3800
NHQMM203B380T5
20000
3800
NHQMM223B380T5
22000
3800
NHQMM303B400T5
30000
4000
NHQMM333B400T5
33000
4000
NHQMM473B400T5
47000
4000
NHQMM503B400T5
50000
4000
NHQMM683B400T5
68000
4000
NHQMM104B415T5
100000
4150
NHQMM154B425T5
150000
4250
NHQMM204B425T5
200000
4250
Data
• Resistance tolerance at 77°F (25°C) ±5%;
for ±10% replace T5 by T10 in code
• Tolerance on B value ±200 K
• Minimum temperature: -40°F (-40°C)
• Maximum temperature: 257°F (125°C)
• Dissipation factor: 1.2 mW/K
• Time constant: 4 seconds maximum
Surface mount chip 0402 size
Description
General
0.45 mm ±0.15 mm
(0.0177 in ±0.006 in)
A range of 0402 size surface mount NTC
chip thermistors.The terminations are nickel
barrier with tin plating.
0.2 mm ±0.1 mm
(0.078 in ±0.004 in)
0.5 mm ±0.15 mm
(0.0196 in ±0.006 in)
Type NHQT
Specification
Soldering Recommendations
• Maximum storage time in closed package:
One year
• Maximum storage time exposed to
ambient conditions of 59°F to 86°F (15°C
to 30°C), 15% to 70% RH: 30 days
• Drying prior to soldering: Not to exceed
48h at 176°F (80°C) or 16h at 212°F
(100°C) or 8h at 257°F (125°C)
• Flux type: R or RMA
1 mm ±0.15 mm
(0.0394 in ±0.006 in)
NTC Type NHQT Outline Drawing
Code
R25 W
B (25/85)
NHQT500B285T5
50
2850
NHQT202B410T5
2000
4100
NHQT252B410T5
2500
4100
NHQT332B410T5
3300
4100
NHQT352B410T5
3500
4100
NHQT402B410T5
4000
4100
NHQT652B410T5
6500
4100
NHQT153B380T5
15000
3800
NHQT203B380T5
20000
3800
NHQT223B380T5
22000
3800
NHQT303B400T5
30000
4000
NHQT473B400T5
47000
4000
Reflow Soldering Conditions
NHQT683B400T5
68000
4000
• Method infrared, hot gas, vapor
• Maximum rate of preheat temperature
change: 4.5°F/s or 2.5°C/s
• Maximum temperature: 437°F (225°C)
• Maximum time above: 392°F (200°C) 30
seconds
• Maximum radiant flux: (0.1 to 100 Wµ) 5
Wµ/cm2
• Maximum hot air temperature: 527°F
(275°C) at 4 m/s
• Maximum vapor temperature: 419°F
(215°C)
• Maximum rate of cooling: 4.5°F/s or
2.5°C/s
NHQT154B425T5
150000
4250
Flow Soldering Conditions
• Preheat temperature: 176°F to 302°F (80°C
to 150°C)
• Maximum rate of temperature change:
4.5°F/s or 2.5°C/s
• Maximum solder temperature: 509°F
(265°C)
• Maximum dwell time: 10 seconds
• Cooling in ambient or air flow of 5m/s
Data
• Resistance tolerance at 77°F (25°C) ±5%;
for ±10% replace T5 by T10 in code
• Tolerance on B value ±200 K
• Minimum temperature: -40°F (-40°C)
• Maximum temperature: 257°F (125°C)
• Dissipation factor: 1.5 mW/K
• Time constant: 4 seconds maximum
Cleaning
Ultrasonic cleaning in methanol or
isopropanol notexceeding 40 kHz for 5
minutes, or aqueous cleaning not exceeding
158°F (70°C) for 7 minutes (recommended).
5
6
7
Amphenol
Advanced Sensors
www.amphenol-sensors.com
© 2017 Amphenol Corporation. All Rights Reserved. Specifications are subject to change without notice.
Other company names and product names used in this document are the registered trademarks or
trademarks of their respective owners.
AAS-920-324F - 03/2017
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