NHQM221B310T5

NTC Type SMD Thermometrics Surface Mount Devices EIA Style 1206 Nickel barrier solder coated 3 sided wrap around 0.5 mm (0.02 in) typical 1.27 mm (0.05 in) maximum 1.6 mm ±0.2 mm (0.063 mm ±0.008 in) 3.2 mm ±0.2 mm (0.126 in ±0.008 in) Features • Nickel barrier tin plated terminations for soldering • Suitable for standard soldering techniques • High sensitivity to changes in temperature • Excellent solderability without “tombstoning” • Wide operating temperature range -40°F to 257°F (-40°C to 125°C) • Ceramic between electrodes glass coated for improved stability • Rugged construction • Supplied in tape-and-reel packaging • Available in other material systems • Intended for temperature measurement, control and compensation Amphenol Advanced Sensors Type NHQ Specification 0.5 mm ±0.2 mm (0.0197 in ±0.008 in) 1.6 mm ±0.2 mm (0.063 in ±0.008 in) Surface mount chip 1206 size Description 1.2 mm (0.0472 in) maximum A range of 1206 size surface mount NTC chip thermistors.The terminations are nickel barrier with tin plating. General 3.2 mm ±0.2 mm (0.126 in ±0.008 in) Soldering Recommendations • Maximum storage time in closed package: One year • Maximum storage time exposed to ambient conditions of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30 days • Drying prior to soldering: Not to exceed 48h at 176°F (80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C) • Flux type: R or RMA Code R25 W B (25/85) NHQ202B410T5 2000 4100 NHQ222B410T5 2200 4100 NHQ252B410T5 2500 4100 NHQ302B410T5 3000 4100 Flow Soldering Conditions NHQ472B355T5 4700 3550 • Preheat temperature: 176°F to 302°F (80°C to 150°C) • Maximum rate of temperature change: 4.5°F/s or 2.5°C/s • Maximum solder temperature: 509°F (265°C) • Maximum dwell time: 10 seconds • Cooling in ambient or air flow of 5m/s NHQ502B355T5 5000 3550 NHQ103B375T5 10000 3750 NHQ153B400T5 15000 4000 NHQ203B400T5 20000 4000 NHQ223B400T5 22000 4000 NHQ303B400T5 30000 4000 NHQ333B400T5 33000 4000 Reflow Soldering Conditions NHQ473B400T5 47000 4000 NHQ503B400T5 50000 4000 NHQ104B425T5 100000 4250 NHQ154B425T5 150000 4250 NHQ304B435T5 300000 4350 NHQ474B435T5 470000 4350 NHQ504B435T5 500000 4350 • Method infrared, hot gas, vapor • Maximum rate of preheat temperature change: 4.5°F/s or 2.5°C/s • Maximum temperature: 437°F (225°C) • Maximum time above: 392°F (200°C) 30 seconds • Maximum radiant flux: (0.1 to 100 W µ) 5 W/ cm2 • Maximum hot air temperature: 527°F (275°C) at 4 m/s • Maximum vapor temperature: 419°F (215°C) • Maximum rate of cooling: 4.5°F/s or 2.5°C/s Cleaning Ultrasonic cleaning in methanol or isopropanol not exceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158°F (70°C) for 7 minutes (recommended). 2 NTC Type NHQ Outline Drawing Data • Resistance tolerance at 77°F (25°C) ±5%; for ±10% replace T5 by T10 in code. • Tolerance on B value ±200 K • Minimum temperature: -40°F (-40°C) • Maximum temperature: 257°F (125°C) • Dissipation factor: 3 mW/K • Time constant: 8 seconds maximum Surface mount chip 0805 size Description General 1.2 mm (0.0472 in) maximum A range of 0805 size surface mount NTC chip thermistors.The terminations are nickel barrier with tin plating. 0.4 mm ±0.2 mm (0.0157 in ±0.008 in) 1.25 mm ±0.2 mm (0.0492 in ±0.008 in) Type NHQM Specification 2 mm ±0.2 mm (0.0787 in ±0.008 in) Soldering Recommendations • Maximum storage time in closed package: One year • Maximum storage time exposed to ambient conditions of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30 days • Drying prior to soldering: Not to exceed 48h at 176°F (80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C) • Flux type: R or RMA Flow Soldering Conditions • • • • • Preheat temperature: 176°F to 302°F (80°C to 150°C) Maximum rate of temperature change: 4.5°F/s or 2.5°C/s Maximum solder temperature: 509°F (265°C) Maximum dwell time: 10 seconds Cooling in ambient or air flow of 5m/s Reflow Soldering Conditions • Method infrared, hot gas, vapor • Maximum rate of preheat temperature change: 4.5°F/s or 2.5°C/s • Maximum temperature: 437°F (225°C) • Maximum time above: 392°F (200°C) 30 seconds • Maximum radiant flux: (0.1 to 100 Wµ) 5 W µ/cm2 • Maximum hot air temperature: 527°F (275°C) at 4 m/s • Maximum vapor temperature: 419°F (215°C) • Maximum rate of cooling: 4.5°F/s or 2.5°Cs Cleaning Ultrasonic cleaning in methanol or isopropanol not exceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158°F (70°C) for 7 minutes (recommended). NTC Type NHQM Outline Drawing Code R25 W B (25/85°C) NHQM202B410T5 2000 4100 NHQM252B410T5 2500 4100 NHQM272B410T5 2700 4100 NHQM302B410T5 3000 4100 NHQM472B355T5 4700 3550 NHQM502B355T5 5000 3550 NHQM682B375T5 6800 3750 NHQM103B375T5 10000 3750 NHQM153B400T5 15000 4000 NHQM203B400T5 20000 4000 NHQM223B400T5 22000 4000 NHQM273B400T5 27000 4000 NHQM303B400T5 30000 4000 NHQM333B400T5 33000 4000 NHQM473B415T5 47000 4150 NHQM503B415T5 50000 4150 NHQM104B425T5 100000 4250 NHQM154B425T5 150000 4250 NHQM304B425T5 300000 4250 NHQM474B435T5 470000 4350 NHQM504B435T5 500000 4350 Data • Resistance tolerance at 77°F (25°C) ±5%; for ±10% replace T5 by T10 in code. • Tolerance on B value ±200 K • Minimum temperature: -40°F (-40°C) • Maximum temperature: 257°F (125°C) • Dissipation factor: 1.5 mW/K • Time constant: 5 seconds maximum 3 Surface mount chip 0603 size Description General 1 mm max (0.039 in max) A range of 0603 size surface mount NTC chip thermistors.The terminations are nickel barrier with tin plating. 0.3 mm ± 0.2 mm (0.012 in ± 0.008 in) 0.8 mm ± 2 mm (0.031 in ± 0.08 in) Type NHQMM Specification 1.6 mm ± 0.2 mm (0.063 in ± 0.008 in) Soldering Recommendations • Maximum storage time in closed package: One year • Maximum storage time exposed to ambient conditions of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30 days • Drying prior to soldering: Not to exceed 48h at 176°F (80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C) • Flux type: R or RMA Flow Soldering Conditions • Preheat temperature: 176°F to 302°F (80°C to 150°C) • Maximum rate of temperature change: 4.5°F/s or 2.5°C/s • Maximum solder temperature: 509°F (265°C) • Maximum dwell time: 10 seconds • Cooling in ambient or air flow of 5m/s Reflow Soldering Conditions • Method infrared, hot gas, vapor • Maximum rate of preheat temperature change: 4.5°F/s or 2.5°C/s • Maximum temperature: 437°F (225°C) • Maximum time above: 392°F (200°C) 30 seconds • Maximum radiant flux: (0.1 to 100 Wµ) 5 Wµ/cm2 • Maximum hot air temperature: 527°F (275°C) at 4 m/s • Maximum vapor temperature: 419°F (215°C) • Maximum rate of cooling: 4.5°F/s or 2.5°C/s Cleaning Ultrasonic cleaning in methanol or isopropanol not exceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158°F (70°C) for 7 minutes (recommended). 4 NTC Type NHQMM Outline Drawing Code R25 W B (25/85) NHQMM202B410T5 2000 4100 NHQMM222B410T5 2200 4100 NHQMM302B410T5 3000 4100 NHQMM332B410T5 3300 4100 NHQMM472B355T5 4700 3550 NHQMM502B355T5 5000 3550 NHQMM682B355T5 6800 3550 NHQMM103B375T5 10000 3750 NHQMM153B380T5 15000 3800 NHQMM203B380T5 20000 3800 NHQMM223B380T5 22000 3800 NHQMM303B400T5 30000 4000 NHQMM333B400T5 33000 4000 NHQMM473B400T5 47000 4000 NHQMM503B400T5 50000 4000 NHQMM683B400T5 68000 4000 NHQMM104B415T5 100000 4150 NHQMM154B425T5 150000 4250 NHQMM204B425T5 200000 4250 Data • Resistance tolerance at 77°F (25°C) ±5%; for ±10% replace T5 by T10 in code • Tolerance on B value ±200 K • Minimum temperature: -40°F (-40°C) • Maximum temperature: 257°F (125°C) • Dissipation factor: 1.2 mW/K • Time constant: 4 seconds maximum Surface mount chip 0402 size Description General 0.45 mm ±0.15 mm (0.0177 in ±0.006 in) A range of 0402 size surface mount NTC chip thermistors.The terminations are nickel barrier with tin plating. 0.2 mm ±0.1 mm (0.078 in ±0.004 in) 0.5 mm ±0.15 mm (0.0196 in ±0.006 in) Type NHQT Specification Soldering Recommendations • Maximum storage time in closed package: One year • Maximum storage time exposed to ambient conditions of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30 days • Drying prior to soldering: Not to exceed 48h at 176°F (80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C) • Flux type: R or RMA 1 mm ±0.15 mm (0.0394 in ±0.006 in) NTC Type NHQT Outline Drawing Code R25 W B (25/85) NHQT500B285T5 50 2850 NHQT202B410T5 2000 4100 NHQT252B410T5 2500 4100 NHQT332B410T5 3300 4100 NHQT352B410T5 3500 4100 NHQT402B410T5 4000 4100 NHQT652B410T5 6500 4100 NHQT153B380T5 15000 3800 NHQT203B380T5 20000 3800 NHQT223B380T5 22000 3800 NHQT303B400T5 30000 4000 NHQT473B400T5 47000 4000 Reflow Soldering Conditions NHQT683B400T5 68000 4000 • Method infrared, hot gas, vapor • Maximum rate of preheat temperature change: 4.5°F/s or 2.5°C/s • Maximum temperature: 437°F (225°C) • Maximum time above: 392°F (200°C) 30 seconds • Maximum radiant flux: (0.1 to 100 Wµ) 5 Wµ/cm2 • Maximum hot air temperature: 527°F (275°C) at 4 m/s • Maximum vapor temperature: 419°F (215°C) • Maximum rate of cooling: 4.5°F/s or 2.5°C/s NHQT154B425T5 150000 4250 Flow Soldering Conditions • Preheat temperature: 176°F to 302°F (80°C to 150°C) • Maximum rate of temperature change: 4.5°F/s or 2.5°C/s • Maximum solder temperature: 509°F (265°C) • Maximum dwell time: 10 seconds • Cooling in ambient or air flow of 5m/s Data • Resistance tolerance at 77°F (25°C) ±5%; for ±10% replace T5 by T10 in code • Tolerance on B value ±200 K • Minimum temperature: -40°F (-40°C) • Maximum temperature: 257°F (125°C) • Dissipation factor: 1.5 mW/K • Time constant: 4 seconds maximum Cleaning Ultrasonic cleaning in methanol or isopropanol notexceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158°F (70°C) for 7 minutes (recommended). 5 6 7 Amphenol Advanced Sensors www.amphenol-sensors.com © 2017 Amphenol Corporation. All Rights Reserved. Specifications are subject to change without notice. Other company names and product names used in this document are the registered trademarks or trademarks of their respective owners. AAS-920-324F - 03/2017