BACKPLANE: 16 Position Right End Backplane
4.9±0.13
HOUSING
0.65 REF
72 PLC
1.8
7.2 REF
C
L OF DAUGHTERCARD
WAFER #1 SLOT
CONNECTOR
KEEPOUT AREA
PIN “i16”
16.2
Z
C
L OF
Z
18.6±0.13
2.1 REF
TOP OF
DAUGHTERCARD
(CONNECTOR SIDE)
14.4 REF
8 SPACES AT
1.8 = 14.4
CONTACT
4.4±0.13
0.73±0.1
31.22±0.1
1.7 REF
2.40 TYP
4.50
2.1 REF
1.8
8 PLC
28.27±0.1
1.8
13.25 REF
CENTERLINE OF V
PIN “a1”
1.8
15 PLC
3.33 REF
0.89 REF
2.39
15 SPACES AT 1.8 = 27.00
PC BOARD LAYOUT
(CONNECTOR SIDE)
SCALE 4/1
10.5±0.13
C
L OF WAFER SLOT #1
0.65 REF
27 REF
PLATING THICKNESS AND MATERIAL BY PART NUMBER
Part Number
RVPX-J16EM1
RVPX-J16EM2
RVPX-J16EC1
RVPX-J16EC2
Gold In Contact Area
50 µ-Inch min.
30 µ-Inch min.
Compliant Contact
Termination Finish
Nickel Overall
Tin
Tin-lead
Tin
50 µ-Inch Min.
Tin-lead
Cat Brandas • Office: +1 (607) 563-5129 • Mobile: +1 (607) 643-5071 • Email: cbrandas@amphenol-aao.com
amphenol-aerospace.com • amphenolmao.com
15
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