U95-T1Y1-100A

UltraPort™ QSFP+ QSFP28 with Stamped and Formed Contact Design Amphenol ICC’s UltraPort™ QSFP+ interconnect system comprises of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost optimized solutions. The UltraPort™ QSFP+ connector supports next generation 100G+ applications and transmits up to 28Gb/s per channel. It features a stamped and formed contact design providing improved mechanical durability. The resonance dampening features of the design allows superior signal integrity. The design minimizes crosstalk and transmission line impedance discontinuity across the connector interface. TARGET MARKETS §§Electrical interface employs 4 lanes that operates up to 28 Gb/s per channel §§Passive copper and optical solutions §§Stamped and formed contact design provides improved mechanical durability §§The resonance dampening features minimize crosstalk and transmission line impedance discontinuity across the connector interface FEATURES BENEFITS §§Electrical interface employs 4 lanes that operate up to 28 §§100Gb/s aggregated bandwidth solution Gb/s per channel §§Passive copper and optical solutions §§Support various application requirements §§Stamped and formed contact design §§Improved mechanical durability §§Resonance dampening features §§Minimizes crosstalk and transmission line impedance discontinuity and provides enhanced signal integrity www.amphenol-icc.com Amphenol Information Communications and Commercial Products UltraPort™ QSFP+ TECHNICAL INFORMATION MATERIAL ELECTRICAL PERFORMANCE §§ Housing: Black color, Glass reinforced, Lead §§ Operating Voltage: 30 VDC per contact Free Solder Reflow Process Compatible Thermo Plastic §§ Contacts Base Material: Phosphor Bronze §§ Plating Solder Tails: Matte tin or Gold flash options §§ Plating Mating Area: Gold §§ Resonance Dampening Feature: Conductive Polymer MECHANICAL PERFORMANCE §§ Durability: 250 mating cycles §§ Mating Force: 60 N max. §§ Contact Normal Force: 0.5 N min./PIN §§ PCB Thickness Single Side (Cage): 1.44 mm (0.057in.) min. §§ Operating Current: 0.5 A per contact §§ Differential Impedance: 100Ω +/- 10Ω ENVIRONMENTAL §§ Operating and (Storage) Temperature: -20° to +85° C §§ RoHS & Halogen-Free TOOLING INFORMATION §§ Heat Sinks and Light Pipes: Available §§ Configurations: §§ 1XN (N=1,2,3,4,6) §§ 2XN (N=1,2,3) TARGET MARKETS/APPLICATIONS §§ PCB Thickness Belly to Belly (Cage): 2.35 mm (0.093in.) min. Cellular Infrastructure Network Interface Cards §§780 N for 1 port Hubs Switch Servers Storage §§ 1000 N for 2 Ports Test and Measurement Equipment §§ Unmating Force (Cage): 30 N max. §§ Insertion Force to PCB (Cage): §§ 1700 N for 4 Ports §§ 2400 N for 6 Ports www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice. UltraPort™ QSFP+ UltraPort™ QSFP+ Connector FS1 Z38 Style Z38 X 0 Z 6 38 Position Option 3 6 Plating Option 2 3 Special Option Resonance Dampening, No Hold 60 Down Tabs 60 30 μ” (0.76 μm) Gold Plating on Mating Area; 100 μ” (2.54 μm) Matte Tin on Tails Over Nickel Underplate 15 μ” (0.38 μm) Gold Plating on Mating Area; 100 μ” (2.54 μm) Matte Tin on Tails Over Nickel Underplate Standard Option 2 Z Option 1 0 Standard Standard UltraPort™ QSFP+ Cages U95 X X X 1 1 X X Packaging X Tray (Light Pipe and/or Heat Sink Shipped Unassembled if Ordered) Tray (Light Pipe and/or Heat Sink Shipped Assembled) 1 Style A 0°, One Rear Pin (1X1 Only) through the bezel L 0°, No Rear Pin through the bezel 0°, Two Rear Pin (1XN: One Rear Pin, 1X1: Two Rear Pin) through T the bezel W 1°, No Rear Pin (1X1 Only) through the bezel A Light Pipe Option 0 No Light Pipe 1 Dual Barrel Light Pipe - Round Outlet 4 Quad Barrel Light Pipe - Round Outlet 7 Single Barrel Light Pipe - Round Outlet F Quad Barrel Light Pipe -Square Outlet Number of Ports in row 1 1X1 2 1X2 3 1X3 4 1X4 6 1X6 Dust Cover Option 0 Without Dust Cover D With Dust Cover (Shipped Loose) Heat Sink Option 0 No Heat Sink or Clip Shipped, Closed Top With Vent Holes 1 No Heat Sink or Clip Shipped Round Pin Style (Nickel Plated) Heat Sink & Clip (H = 6.5mm) - N/A with Quad 5 Light Pipe Round Pin Style (Nickel Plated) Heat Sink & Clip (H = 4.2mm) - N/A with Quad 6 Light Pipe Round Pin Style (Nickel Plated) Heat Sink & Clip (H =13.5mm)- N/A with Quad 7 Light Pipe A Square Pin Style (Nickel Plated) Heat Sink & Clip (H = 6.5mm) B Square Pin Style (Nickel Plated) Heat Sink & Clip (H = 4.2mm) C Square Pin Style (Nickel Plated) Heat Sink & Clip (H = 13.5mm) N Pin-Fin Style (Nickel Plated) Heat Sink & Clip (H = 6.5mm) P Pin-Fin Style (Nickel Plated) Heat Sink & Clip (H = 4.2mm) R Pin-Fin Style (Nickel Plated) Heat Sink & Clip (H = 13.5mm) Extruded Custom Heat Sink for Front to Back Air Flow (Nickel Plated) & Clip Y (H = 6.94mm) Extruded Custom Heat Sink for Front to Back Air Flow (Nickel Plated) & Clip W (H = 8.72mm) Plating 1 Nickel Application 1 Press-Fit Pins UltraPort™ Stacked QSFP+ Z X 0 5 4 X X 1 X X 1 Style Z Standard Connector Footprint 1 Standard Vent Holes 0 Large Vent Holes 2 Small Vent Holes 4 Rectangular Vent Holes Number of Ports in row 1 2X1 2 2X2 3 2X3 EMI Gasket Option 1 Chomerics 1273 Conductive Elastomer 2 Chomerics S6305 Conductive Elastomer 3 Through the Bezel L Longer Spring Finger Heat Sink Option 0 No Heat Sink or Clip Shipped Application 5 Press-Fit Pins (2mm Long) Packaging 1 Tray Cage & Connector Contact Plating 30 μ” (0.76 μm) Gold over 50 μ” (1.27 μm) to 3.81 μm of Nickel; 15 μ” (0.38 μm) to1.52 4 μm of Matte Tin over 50 μ” (1.27 μm) to 3.81 μm of Nickel on Press-Fit Tail Area; Nickel Plating for Cage Light Pipe Option Light Pipes (Triangular Outlet); Left Arrow Pointing Bot6 tom Outlet & Right Arrow Pointing Top Port Dust Cover Option 0 Without Dust Cover D With Dust Cover www.amphenol-icc.com 7 Without Light Pipes 8 With Light Pipes; Left Arrow Pointing Top Port & Right Arrow Pointing Bottom Port Disclaimer Please note that the above information is subject to change without notice. HSIOULTRAPORTQSFP1118EA4 U95