A S 11 0 9
C o n s ta n t - C u r r e n t , 8 - B i t L E D D r i v e r w i t h D i a g n o s t i c s
D a ta S he e t
1 General Description
The AS1109 is designed to drive up to 8 LEDs through a fast serial interface and features 8 output constant current drivers and an on-chip diagnostic read-back function. The high clock-frequency (up to 50MHz), adjustable output current, and flexible serial interface makes the device perfectly suited for high-volume transmission applications. Output current is adjustable (up to 100mA/channel) using an external resistor (REXT). The serial interface with Schmitt trigger inputs includes an integrated shift register. Additionally, an internal data register stores the currently displayed data. The device features integrated diagnostics for overtemperature, open-LED, and shorted-LED conditions. Integrated registers store global fault status information during load as well as the detailed temperature/openLED/shorted-LED diagnostics results. The AS1109 also features a low-current diagnostic mode to minimize display flicker during fault testing. With an operating temperature range from -40 to +125°C the AS1109 is also ideal for industrial applications. The AS1109 is available in a 16-pin SOIC-150, a 16-pin QFN (4x4mm) and the 16-pin SSOP-150 package.
2 Key Features
! !
8 Constant-Current Output Channels Excellent Output Current Accuracy - Between Channels: ±2% - Between AS1109 Devices: ±2%
! ! !
Output Current Per Channel: 0.5 to 100mA Controlled In-Rush Current Over-Temperature, Open-LED, Shorted-LED Diagnostics Functions Low-Current Test Mode Global Fault Monitoring Low Shutdown Mode Current: 3µA Fast Serial Interface: up to 50MHz Cascaded Configuration Fast Output Drivers Suitable for PWM 16-pin SOIC-150, 16-pin QFN (4x4mm) and 16-pin SSOP-150 Package
! ! ! ! ! ! !
3 Applications
The device is ideal for fixed- or slow-rolling displays using static or multiplexed LED matrix and dimming functions, large LED matrix displays, mixed LED display and switch monitoring, displays in elevators, public transports (underground, trains, buses, taxis, airplanes, etc.), large displays in stadiums and public areas, price indicators in retail stores, promotional panels, bar-graph displays, industrial controller displays, white good panels, emergency light indicators, and traffic signs.
Figure 1. Main Diagram and Pin Assignments
+VLED
GND 1 OUTN0 OUTN1 OUTN2 OUTN3 OUTN4 OUTN5 OUTN6 OUTN7 SDI 2 CLK 3 SDI
16 VDD 15 REXT 14 SDO
AS1109
LD 4 SDO OUTN0 5 OUTN1 6
AS1109
13 OEN 12 OUTN7 11 OUTN6 10 OUTN5 9 OUTN4
CLK
LD
OEN
REXT
GND
VDD
OUTN2 7 OUTN3 8
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AS1109
Data Sheet
Contents
1 General Description 2 Key Features 3 Applications 4 Pinout ............................................................................................................................. 1
........................................................................................................................................ 1 .......................................................................................................................................... 1
................................................................................................................................................. 3 ................................................................................................................................................... 3
................................................................................................................................................... 3
Pin Assignments Pin Descriptions
5 Absolute Maximum Ratings 6 Electrical Characteristics
Switching Characteristics
................................................................................................................. 4
...................................................................................................................... 5
..................................................................................................................................... 6
7 Typical Operating Characteristics 8 Detailed Description
Serial Interface Timing Diagrams Global Error Mode
........................................................................................................ 7
............................................................................................................................. 8
..................................................................................................................................................... 9 .................................................................................................................................................. 9 ........................................................................................................................................ 11 .................................................................................................................................. 12 ............................................................................................................................................. 11
Error-Detection Mode
Error Detection Functions
Open-LED Detection ..................................................................................................................................... 12 Shorted-LED ................................................................................................................................................. 12 Overtemperature ........................................................................................................................................... 12 Detailed Error Reports ....................................................................................................................................... 13 13 14 15 15 Detailed Temperature Warning Report ......................................................................................................... Detailed Open-LED Error Report .................................................................................................................. Detailed Shorted-LED Error Report .............................................................................................................. Low-Current Diagnostic Mode....................................................................................................................... Shutdown Mode Error Detection
................................................................................................................................................. 16
9 Application Information
...................................................................................................................... 17
................................................................................................................................................... 17
Error Detection On-The-Fly ........................................................................................................................... 17 Error Detection with Low-Current Diagnosis Mode ....................................................................................... 17 Cascading Devices Constant Current ............................................................................................................................................ 18 ................................................................................................................................................ 19 ................................................................................................................................... 19 ............................................................................................................................... 19 ................................................................................................................................ 19
Adjusting Output Current Package Power Dissipation Delayed Outputs Switching-Noise Reduction Load Supply Voltage
................................................................................................................................................ 19 .......................................................................................................................................... 19
10 Package Drawings and Markings 11 Ordering Information
.................................................................................................... 21
........................................................................................................................ 25
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AS1109
Data Sheet - P i n o u t
4 Pinout
Pin Assignments
Figure 2. Pin Assignments (Top View)
SDI GND 1 SDI 2 CLK 3 LD 4 OUTN0 5 OUTN1 6 OUTN2 7 OUTN3 8 16-pin SSOP-150 16-pin SOIC-150 16 VDD 15 REXT 14 SDO CLK 1 LD 2 OUTN0 3 OUTN1 4 5 OUTN2 6 OUTN3 7 OUTN4 8 OUTN5 16 GND VDD REXT 15 14 13 12 SDO 11 OEN 10 OUTN7 9 OUTN6
AS1109
13 OEN 12 OUTN7 11 OUTN6 10 OUTN5 9 OUTN4
AS1109
16-pin QFN (4x4mm)
Pin Descriptions
Table 1. Pin Descriptions Pin Number
16-pin SSOP-150 16-pin SOIC-150 16-pin QFN (4x4mm)
Pin Name GND SDI CLK LD OUTN0:7 Ground Serial Data Input
Description
1 2 3 4 5:12
15 16 1 2 3:10
Serial Data Clock. The rising edge of the CLK signal is used to clock data into and at the falling edge out of the AS1109 shift register. In error mode, the rising edge of the CLK signal is used to switch error modes. Serial Data Load. Data is transferred to the data register at the rising edge of this pin. Output Current Drivers. These pins are used as LED drivers or for input sense for diagnostic modes. Output Enable. The active-low pin OEN signal can always enable output drivers to sink current independent of the AS1109 mode. 0 = Output drivers are enabled. 1 = Output drivers are disabled. Serial Data Output. In normal mode SDO is clocked out 8.5 clock cycles after SDI is clocked in. In global error detection mode this pin indicates the occurrence of a global error. 0 = Global error mode returned an error. 1 = No errors. External Resistor Connection. This pin connects through the external resistor (REXT) to GND, to setup the load current. Positive Supply Voltage
13
11
OEN
14
12
SDO
15 16
13 14
REXT VDD
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AS1109
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter VDD to GND Input Voltage Output Voltage GND Pin Current 83 Thermal Resistance ΘJA Operating Temperature Range Storage Temperature Humidity Electrostatic Discharge Digital Outputs All Other Pins -100 (INOM x 0.5) -40 -55 5 113 32 +85 150 86 2000 2000 +100 + INOM Min 0 -0.4 -0.4 Max 7 VDD +0.4 15 1000 Units V V V mA ºC/W ºC/W ºC/W ºC ºC % V mA Non-condensing Norm: MIL 833 E method 3015 on PCB, 16-pin SOIC-150 package on PCB, 16-pin SSOP-150 package on PCB, 16-pin QFN (4x4mm) package Device fully functional up to 125°C Comments
Latch-Up Immunity
EIA/JESD78 The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD020C “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn).
Package Body Temperature
+260
ºC
* Min/max values are load dependent.
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AS1109
Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
VDD = +3.0 to +5.5V, TAMB = -40 to +85°C (unless otherwise specified). Typical values measured at VDD = 5V, TAMB = 25°C. Table 3. Electrical Characteristics Symbol VDD VDS IOUT IOH IOL VIH Input Voltage VIL IDS(OFF) VOL VOH IAV(LC1) ΔIAV(LC1) IAV(LC2) ΔIAV(LC2) IAV(LC3) ΔIAV(LC3) ILC IPD %/ΔVDS %/ΔVDD RIN(UP) RIN(DOWN) VTHL
*
Parameter Supply Voltage Output Voltage
Condition
Min 3.0
Typ
Max 5.5 15.0 100
Unit V V
OUTN0:7 OUTN0:7, VDD = 5V (see Figure 8)
0 0.5 -1.0 1.0 0.7 x VDD -0.3
Output Current
SDO SDO
mA
High Level CLK, OEN, LD, SDI Low Level Output Leakage Current Output Voltage SDO OEN = 1, VDS = 15.0V IOL = +1.0mA IOH = -1.0mA VDS = 0.5V, VDD = Const., REXT = 744Ω VDS ≥ 0.5V, VDD = Const., REXT = 744Ω VDS = 0.6V, VDD > 3.3V, REXT = 372Ω VDS ≥ 0.6V, VDD = Const., REXT = 372Ω VDS = 0.8V, VDD = 5.0V, REXT = 186Ω VDS ≥ 0.8V, VDD = Const., REXT = 186Ω VDS = 0.8V, VDD = 5.0V VDS = 0.8V, VDD = 5.0V, REXT = 372Ω, OUTN0:7 = On VDS within 1.0 and 3.0V VDD within 3.0 and 5.0V OEN LD No load VDD = 3.0V, no load VDD = 5.0V, no load
VDD + 0.3 0.3 x VDD 0.5 0.4
V
µA V
VDD 0.4V 24.5 25.26 ±0.9 26 ±3
Device-to-Device Average Output Current from OUTN0 to OUTN7 Current Skew (Between Channels) Device-to-Device Average Output Current from OUTN0 to OUTN7 Current Skew (Between Channels) Device-to-Device Average Output Current from OUTN0 to OUTN7 Current Skew (Between Channels) Low-Current Diagnosis Mode Power Down Supply Current Output Current vs. Output Voltage Regulation Output Current vs. Supply Voltage Regulation Pullup Resistance Pulldown Resistance Open Error Detection Threshold Voltage Short Error Detection Threshold Voltage Overtemperature Threshold Flag
mA % mA % mA % mA µA %/V %/V
49.50 50.52 51.55 ±0.8 98 101 ±0.5 0.4 0.6 3 ±0.1 ±1 250 250 0.25 1.2 2.0 500 500 0.35 1.3 2.2 150 800 800 0.45 1.4 2.4 ±2 104 ±2 0.8 20
kΩ kΩ V V ºC
VTHH
*
TOV1
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AS1109
Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 3. Electrical Characteristics (Continued) Symbol IDD(OFF)0 IDD(OFF)1 IDD(OFF)2 IDD(OFF)3 IDD(ON)1 IDD(ON)2 IDD(ON)3 On Supply Current Off Parameter Condition REXT = Open‚ OUTN0:7 = Off REXT = 744Ω‚ OUTN0:7 = Off REXT = 372Ω‚ OUTN0:7 = Off REXT = 186Ω, OUTN0:7 = Off REXT = 744Ω‚ OUTN0:7 = On REXT = 372Ω‚ OUTN0:7 = On REXT = 186Ω‚ OUTN0:7 = On Min Typ 1.3 3.0 4.7 8.1 4.5 7.5 13.7 Max 2 3.68 5.37 8.73 5 8 15 mA Unit
Switching Characteristics
VDD = 3.0 to 5.5V, VDS = 0.8V, VIH = VDD, VIL = GND, REXT = 372Ω, VLOAD = 4.0V, RLOAD = 64Ω, CLOAD = 10pF; guaranteed by design. Table 4. Switching Characteristics Symbol tP1 tP2 tP3 tP4 tW(CLK) tW(L) tW(OE) tR
* *
Parameter Propagation Delay Time Propagation Delay Time (Without Staggered Output Delay) Propagation Delay Time Pulse Width Maximum CLK Rise Time Maximum CLK Fall Time Output Rise Time of VOUT (Turn Off) Output Fall Time of VOUT (Turn On) Setup Time for SDI Hold Time for SDI Setup Time for LD Hold Time for LD Minimum OEN Time for Error Detection Staggered Output Delay Output Enable Setup Time Global Error Switching Setup Time Global Error Detection Setup Time Propagation Delay Global Error Flag Switching Time Global Error Flag Maximum Clock Frequency (Cascade Operation) Low-Current Test Mode Propagation Delay Time External Resistor Reaction Time External Resistor Reaction Time
Conditions CLK - SDO LD - OUTNn OEN - OUTNn CLK LD OEN (@IOUT < 60mA)
Min
Typ 5 100 100
Max 10 200 200 10
Unit ns ns ns
15 15 200 500 500 100 100 5 5 5 5 2000 20 20 10 10 5 10 30 50 3 0.05 0.5 0.5 5 0.1 1 1 40 200 300
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns MHz µs µs µs µs
tF tOR tOF tSU(D) tH(D) tSU(L) tH(L) tTESTING tSTAG tSU(OE) tGSW(ERROR) tSU(ERROR) tP(I/O) tSW(ERROR) fCLK tP3,ON tTP3,OFF tREXT2,1 tREXT2,1
*
Turn ON Turn OFF Change from REXT1 = 372Ω, IOUT1 = 50.52mA to REXT2 = 37.2kΩ, IOUT2 < 1mA Change from REXT1 = 37.2kΩ, IOUT1 = 0.5mA to REXT2 = 372Ω, IOUT2 > 25mA
If multiple AS1109 devices are cascaded and tr or tf is large, it may be critical to achieve the timing required for data transfer between two cascaded LED drivers.
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AS1109
Data Sheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
Figure 3. Output Current vs. REXT, VDD = 5V; VOUT = 0.8V, TAMB = 25°C
100
Figure 4. Relative Output Current Error vs. VDD, Iout/Iout@VDD = 5V - 1, TAMB = 25°C
2
Relative Output Current Error (%) .
1.5 1
REXT = 744Ω; VDS = 0.5V REXT = 186Ω; VDS = 0.8V
IOUT (mA) .
0.5 0
10
-0.5 -1
REXT = 372Ω; VDS = 0.6V
-1.5 -2 3 3.5 4 4.5 5 5.5
1 100
1000 REXT (Ohm)
10000
VDD (V)
Figure 5. Output Current vs. VDS; VDD = 5V, TAMB = 25°C
160 140 120
REXT = 127Ω REXT = 150Ω
Figure 6. Output Current vs. VDS; VDD = 5V, TAMB = 25°C
160 140 120
REXT = 127Ω REXT = 150Ω REXT = 186Ω REXT = 251Ω
IOUT (mA) .
100 80 60 40 20 0 0 2 4 6 8
IOUT (mA) .
REXT = 186Ω REXT = 251Ω REXT = 372Ω REXT = 744Ω
100 80 60 40 20 0
REXT = 372Ω REXT = 744Ω
10
12
14
0
0.2
0.4
0.6
0.8
1
1.2
1.4
VDS (V)
VDS (V)
Figure 7. Relative IOUT Error vs. Temperature VDD = 5V, Iout/Iout@25°C - 1, TAMB = 25°C
1
Figure 8. Output Current vs. VDD
160
Relative Output Current Error (%) .
REXT = 372Ω; VDS = 0.6V
140 120
VDS = 1V
0.5
VDS = 0.9V VDS = 0.8V
IOUT (mA) .
0
REXT = 186Ω; VDS = 0.8V
100 80
VDS = 0.7V
60 40 20
VDS = 0.6V VDS = 0.5V
-0.5
REXT = 744Ω; VDS = 0.5V
-1 -50
0 -25 0 25 50 75 100 3 3.5 4 4.5 5 5.5
Temperature (°C)
VDD (V)
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
The AS1109 is designed to drive up to 8 LEDs through a fast serial interface and 8 constant-current output drivers. Furthermore, the AS1109 provides diagnostics for detecting open- or shorted-LEDs, as well as over-temperature conditions for LED display systems, especially LED traffic sign applications. The AS1109 contains an 8-bit shift register and an 8-bit data register, which convert serial input data into parallel output format. At AS1109 output stages, eight regulated current sinks are designed to provide uniform and constant current with excellent matching between ports for driving LEDs within a wide range of forward voltage variations. External output current is adjustable from 0.5 to 100mA using an external resistor for flexibility in controlling the brightness intensity of LEDs. The AS1109 guarantees to endure 15V maximum at the outputs. The serial interface is capable of operating at a minimum of 30 MHz, satisfying the requirements of high-volume data transmission. Using a multiplexed input/output technique, the AS1109 adds additional functionality to pins SDO, LD and OEN. These pins provide highly useful functions (open- and shorted-LED detection, over-temperature detection), thus reducing pin count. Over-temperature detection will work on-the-run, whereas the open- and shorted-LED detection can be used on-the-run or in low-current diagnostic mode (see page 15). Figure 9. Block Diagram
+VLED
OUTN0
OUTN1
OUTN2
OUTN3
OUTN4
OUTN5
OUTN6
OUTN7
REXT Current Generators OEN LD
Temperature Detection
8-Bit Open Detection & Error Register
8-Bit Short Detection & Error Register
AS1109
8-Bit Data Register
Detailed Error Detection
Global Error Detection
CLK SDI
8-Bit Shift Register Control Logic
SDO
Indicates 8 Bit Path
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Serial Interface
Data accesses are made serially via pins SDI and SDO. At each CLK rising edge, the signal present at pin SDI is shifted into the first bit of the internal shift register and the other bits are shifted ahead of the first bit. The MSB is the first bit to be clocked in. In error-detection mode the shift register will latch-in the corresponding error data of temperature-, open-, and short-error register with each falling edge of LD. The 8-bit data register will latch the data of the shift register at each rising edge of LD. This data is then used to drive the current generator output drivers to switch on the corresponding LEDs as OEN goes low.
Timing Diagrams
This section contains timing diagrams referenced in other sections of this data sheet. Figure 10. Normal Mode Timing Diagram
tW(CLK) CLK 50% 50% 50%
tSU(D) SDI 50%
tH(D) 50%
SDO
50% tP1
tW(L) LD 50% tSU(L) 50% tH(L)
OEN
OEN Low = Output Enabled OUTNx High = Output Off OUTNx Low = Output On
OUTNx
50%
tP2
Figure 11. Output Delay Timing Diagram
tW(OE) OEN 50% tP3 90% OUTN0 50% tOF tSTAG OUTN1 50% 10% 50% tP3 90% 10% tOR tSTAG 50% 50%
7XtSTAG OUTN7 50%
7XtSTAG 50%
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Figure 12. Data Input Timing Diagram
OEN tSU(L tSU(OE)
tW(OE)
LD
8 CLK Pulses
tW(L)
CLK tSU(D) SDI0 Data Bit 7 Data Bit 6 Data Bit 5 Data Bit 4 Data Bit 3 Data Bit 2 Data Bit 1 Data Bit 0 tH(D) SDO0 Old Data Old Data Old Data Old Data Old Data Old Data Old Data Old Data Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 tP1 Don’t Care Don’t Care
Figure 13. Data Input Example Timing Diagram
Time = 0 CLK 1 2 3 4 5 6 7
SDI LD
D7
D6
D5
D4
D3
D2
D1
D0
OEN Off On Off On Off On Off On Off On Off On Off On Off On
OUTN0
OUTN1
OUTN2
OUTN3
OUTN4
OUTN5
OUTN6
OUTN7
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Figure 14. Switching Global Error Mode Timing Diagram
OEN tTESTING tGSW(ERROR) tSU(ERROR) tP(I/O) tP(I/O) tP(I/O) tGSW(ERROR)
LD
CLK
tGSW(ERROR)
SDI
TFLAG(IN)
OFLAG(IN)
SFLAG(IN)
SDO
Don’t Care tP4
TFLAG
Don’t Care
OFLAG
Don’t Care
SFLAG
Acquisition of Error Status
tSW(ERROR)
tSW(ERROR)
Error-Detection Mode
Acquisition of the error status occurs at the rising edge of OEN. Error-detection mode is started on the rising edge of LD when OEN is high. The CLK signal must be low when entering error detection mode. Error detection for open- and shorted-LEDs can only be performed for LEDs that are switched on during test time. To switch between error-detection modes clock pulses are needed (see Table 5). Note: To test all LEDs, a test pattern that turns on all LEDs must be input to the AS1109.
Global Error Mode
Global error mode is entered when error-detection mode is started. Clock pulses during this period are used to select between temperature, open-LED, and shorted-LED tests, as well as low-current diagnostic mode and shutdown mode (see Table 5). In global error mode, an error flag (TFLAG, OFLAG, SFLAG) is delivered to pin SDO if any errors are encountered. Table 5. Global Error Mode Selections Clock Pulses Output Port 0 1 2 3 4 Don't Care Enabled Enabled Don't Care Don't Care Error-Detection Mode Over-Temperature Detection Open-LED Detection Shorted-LED Detection Low-Current Diagnostic Mode Shutdown Mode SDI = 1: Wakeup SDI = 0: Shutdown Global Error Flag/Shutdown Condition TFLAG = SDO = 1: No over-temperature warning. TFLAG = SDO = 0: Over-temperature warning. OFLAG = SDO = 1: No open-LED error. OFLAG = SDO = 0: Open-LED error. SFLAG = SDO = 1: No shorted-LED error. SFLAG = SDO = 0: Shorted-LED error.
Note: For a valid result SDI must be 1 for the first device.
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
If there are multiple AS1109s in a chain, the error flag will be gated through all devices. To get a valid result at the end of the chain, a logic 1 must be applied to the SDI input of the first device of the chain. If one device produces an error this error will show up after n*tP(I/O) + tSW(ERROR) at pin SDO of the last device in the chain. This means it is not possible to identify which device in the chain produced the error. Therefore, if a global error occurs, the detailed error report can be run to identify which AS1109, or LED produced the error. Note: When no error has occurred, the detailed error report can be skipped, setting LD and subsequently OEN low.
Error Detection Functions
Open-LED Detection
The AS1109 open-LED detection is based on the comparison between VDS and VTHL. The open LED status is aquired at the rising edge of OEN and stored internally. While detecting open-LEDs the output port must be turned on. Open LED detection can be started with 1 clock pulse during error detection mode while the output port is turned on. Note: LEDs which are turned off at test time cannot be tested. Table 6. Open LED Detection Modes Output Port State On On Effective Output Point Conditions VDS < VTHL VDS > VTHL Detected Open-LED Error Status Code 0 1 Meaning Open Circuit Normal
Shorted-LED
The AS1109 shorted-LED detection is based on the comparison between VDS and VTHH. The shortened LED status is aquired at the rising edge of OEN and stored internally. While detecting shorted-LEDs the output port must be turned on. Shorted-LED detection can be started with 2 clock pulses during error detection mode while the output port is turned on. For valid results, the voltage at OUTN0:OUTN7 must be lower then VTHH under low-current diagnostic mode operating conditions. This can be achieved by reducing the VLED voltage or by adding additional diodes, resistors or LED’s. Note: LEDs which are turned off at test time cannot be tested. Table 7. Shorted LED Detection Modes Output Port State On On Effective Output Point Conditions VDS > VTHH VDS < VTHH Detected Shorted-LED Error Status Code 0 1 Meaning Short Circuit Normal
Overtemperature
Thermal protection for the AS1109 is provided by continuously monitoring the device’s core temperature. The overtemperature status is aquired at the rising edge of OEN and stored internally. Table 8. Overtemperature Modes Output Port State Don’t Care Don’t Care Effective Output Point Conditions Temperature > TOV1 Temperature < TOV1 Detected Overtemperature Status Code 0 1 Meaning Overtemperature Condition Normal
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Detailed Error Reports
The detailed error report can be read out after global error mode has been run. On the falling edge of LD, the detailed error report of the selected test is latched into the shift register and can be clocked out with n*8 clock cycles (n is the number of AS1109s in a chain) via pin SDO. At the same time new data can be written into the shift register, which will load on the next rising edge of pin LD. This data will show at the output drivers, at the falling edge of OEN.
Detailed Temperature Warning Report
The detailed temperature warning report can be read out immediately after global error mode has been run. Bit0 of the 8bit data word represents the temperature flag of the chip. Figure 15. Detailed Temperature Warning Report Timing Diagram
Global Flag Readout OEN tGSW(ERROR) LD t(SU)ERROR CLK tP4 tH(L) Detailed Error Report Readout
SDI
DBit7
DBit6
DBit5
DBit4
DBit3
DBit2
DBit1
DBit0
Don’t Care Don’t Care
New Data Input SDO TFLAG Undefined Temperature Error Report Output
TBit0
tP4 For detailed timing information see Timing Diagrams on page 9.
tP1
Detailed Temperature Warning Report Example Consider a case where five AS1109s are cascaded in one chain. The detailed error report lists the temperatures for each device in the chain: IC1:[70°] IC2:[85°] IC3:[66°] IC4:[160°] IC5:[76°] In this case, IC4 is overheated and will generate a global error, and therefore 5*8 clock cycles are needed to write out the detailed temperature warning report, and optionally read in new data. The detailed temperature warning report would look like this: XXXXXXX1 XXXXXXX1 XXXXXXX1 XXXXXXX0 XXXXXXX1 The 0 in the detailed temperature warning report indicates that IC4 is the device with the over-temperature condition. Note: In an actual report there are no spaces in the output.
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Detailed Open-LED Error Report
The detailed open-LED error report can be read out immediately after global error mode has been run. Figure 16. Detailed Open-LED Error Report Timing Diagram
Global Flag Readout OEN tTESTING LD tSU(ERROR) tGSW(ERROR) CLK tGSW(ERROR)
Acquisition of Error Status
Detailed Error Report Readout
tH(L)
tP4
tGSW(ERROR)
SDI
tSW(ERROR)
DBit7
DBit6
DBit5
DBit4
DBit3
DBit2
DBit1
DBit0
Don’t Care
New Data Input TFlag tP4 OFlag
OBit7 OBit6 OBit5 OBit4 OBit3 OBit2 OBit1 OBit0
SDO
Don’t Care
Open Error Report Output
tP1
For detailed timing information see Timing Diagrams on page 9.
Detailed Open-LED Error Report Example Consider a case where five AS1109s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off, and an X indicates an open LED. The open-LED test is only applied to LEDs that are turned on. This test is used with a test pattern where all LEDs are on at test time. IC1:[11111111] IC2:[111XX111] IC3:[11111111] IC4:[1X111111] IC5:[11111111] IC2 has two open LEDs and IC4 has one open LED switched on due to input. 5*8 clock cycles are needed to write the entire error code out. The detailed error report would look like this: Input Data: 1 1 1 1 1 1 1 1 LED Status: 1 1 1 1 1 1 1 1 Failure Code: 1 1 1 1 1 1 1 1 11111111 1 1 1 XX1 1 1 11100111 11111111 11111111 11111111 11111111 1 X1 1 1 1 1 1 10111111 11111111 11111111 11111111
Comparing this report with the input data indicates that IC2 is the device with two open LEDs at position 4 and 5 and IC4 with an open LED at second position. For such a test it is recommended to enter low-current diagnostic mode first (see Low-Current Diagnostic Mode on page 15) to reduce onscreen flickering. Note: In an actual report there are no spaces in the output. LEDs turned off during test time cannot be tested.
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Detailed Shorted-LED Error Report
The detailed shorted-LED error report can be read out immediately after global error mode has been run (see Global Error Mode on page 11). Figure 17. Detailed Shorted-LED Error Report Timing Diagram
Global Flag Readout OEN tTESTING LD tSU(ERROR) tGSW(ERROR) CLK tGSW(ERROR)
Acquisition of Error Status
Detailed Error Report Readout
tH(L) tP4 tGSW(ERROR)
SDI
DBit7
DBit6
DBit5
DBit4
DBit3
DBit2
DBit1
DBit0
Don’t Care
tSW(ERROR)
New Data Input
SBit7 SBit6 SBit5 SBit4 SBit3 SBit2 SBit1 SBit0
SDO
TFLAG OFLAG TFLAG
SFLAG
Don’t Care
tP4 For detailed timing information see Timing Diagrams on page 9.
Shorted-LED Error Report Output
tP1
Detailed Shorted-LED Error Report Example Consider a case where five AS1109s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off, and an X indicates a shorted LED. This test is used with a test pattern where all LEDs are on at test time. Additionally, this test should be run after starting low-current diagnostic mode (see Low-Current Diagnostic Mode on page 15). IC1:[11111XX1] IC2:[11111111] IC3:[11111111] IC4:[111X1111] IC5:[11111111] IC2 has two shorted LEDs and IC4 has one shorted LED switched on due to input. 5*8 clock cycles are needed to write the entire error code out. The detailed error report would look like this: Input Data: 1 1 1 1 1 1 1 1 LED Status: 1 1 1 1 1 X X 1 Failure Code: 1 1 1 1 1 0 0 1 11111111 11111111 11111111 11111111 11111111 11111111 11111111 1 1 1 X1 1 1 1 11101111 11111111 11111111 11111111
Showing IC1 as the device with two shorted LEDs at position 6 and 7, and IC4 with one shorted LED at position 4. Note: In an actual report there are no spaces in the output. LEDs turned off during test time cannot be tested.
Low-Current Diagnostic Mode
To run the open- or shorted-LED test, a test pattern must be used that will turn on each LED to be tested. This test pattern will cause a short flicker on the screen while the test is being performed. The low-current diagnostic mode can be initiated prior to running a detailed error report to reduce this on-screen flickering. Note: Normally, displays using such a diagnosis mode require additional cables, resistors, and other components to reduce the current. The AS1109 has this current-reduction capability built-in, thereby minimizing the number of external components required. Low-current diagnostic mode can be initiated via 3 clock pulses during error-detection mode. After the falling edge of LD, a test pattern displaying all 1s can be written to the shift register which will be used for the next error-detection test. On the next falling edge of OEN, current is reduced to ILC. With the next rising edge of OEN the current will immediately increase to normal levels and the detailed error report can be read out entering error-detection mode.
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Figure 18. Switching into Low-Current Diagnostic Mode Timing Diagram
Global Flag Readout OEN Load Internal all 1s Test Pattern (optional) tSU(ERROR) tH(L) 2µs Low-Current Diagnosis Mode
tTESTING
LD
tGSW(ERROR) CLK tGSW(ERROR) tSW(ERROR) SDI tGSW(ERROR)
tP4
tH(L)
Re-entering Error Detection Mode
TFLAG OFLAG SFLAG
SDO
Don’t Care Normal Operation Current
tP1 For detailed timing information see Timing Diagrams on page 9.
Shutdown Mode
The AS1109 features a shutdown mode which can be entered via 4 clock pulses during error-detection mode. To enable the shutdown mode a 0 must be placed at SDI after the rising edge of the 3rd clock pulse. To disable shutdown mode a 1 must be placed at SDI after the 3rd clock pulse. The shutdown/wakeup information will be latched through if multiple AS1109 devices are in a chain. At the rising edge of the 4th clock pulse the shutdown bit will be read out and the AS1109 will shutdown or wakeup. Note: In shutdown mode the supply current drops down to typically 3µA. Figure 19. Shutdown Mode Timing Diagram
OEN
LD
tSU(ERROR)
CLK
1 = Wakeup SDI 0 = Shutdown
1 = Wakeup SDO TFLAG OFLAG SFLAG 0 = Shutdown tSU(D)
tP4
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AS1109
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
9 Application Information
Error Detection
The AS1109 features two types of error detection. The error detection can be used on-the-fly, for active LEDs, without any delay, or by entering into low-current diagnosis mode.
Error Detection On-The-Fly
Error detection on-the-fly will output the status of active LEDs during operation. Without choosing an error mode this will output the temperature flag at every input/output cycle. Triggering one clock pulse for open or two clock pulses for short detection during error detection mode outputs the detailed open- or short-error report with the next input/output cycle (see Figure 20). LEDs that are turned off cannot be tested and their digits at the error output must be ignored. Figure 20. Normal Operation with Error Detection During Operation – 128 Cascaded AS1109s
Display Data1 Data2 Data3
SDI
Data2
Data3
Data4
SDO
T/O or S Error Code Data0
GEF
Clock for Error Mode 0x/1x/2x
T/O or S Error Code Data1
GEF
Clock for Error Mode 0x/1x/2x
T/O or S Error Code Data2
CLK
1024x Rising Edge of OEN Acquisition of Error Status
1024x Rising Edge of OEN Acquisition of Error Status Falling Edge of LD; Error Register is copied into Shift Register ≤ 100mA
1024x
OEN
LD
Falling Edge of LD; Error Register is copied into Shift Register
Current
GEF = Global Error Flag
Error Detection with Low-Current Diagnosis Mode
This unique feature of the AS1109 uses an internal all 1s test pattern for a flicker free diagnosis of all LEDs. This error detection mode can be started anytime, and does not require any SDI input (see Figure 21). Figure 21. Low-Current Diagnosis Mode with Internal All 1s Test Pattern – 128 Cascaded AS1109s
2µs Low-Current Diagnosis Mode Display Data0 Data1
SDI
Data1 O or S Error Code of All 1s Test Patern
Data2
SDO
3x Clocks LowCurrent Mode
GEF
Clock for Error Mode 1x/2x
GEF
Temperature Error Code
CLK OEN
1024x Rising Edge of OEN Acquisition of Error Status Falling Edge of LD; Error Register is copied into Shift Register Load Internal All 1s Test Pattern
1024x
LD
Current
≤ 100mA ≤ 0.8mA
≤ 100mA GEF = Global Error Flag
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AS1109
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
Low-current diagnosis mode is started with 3 clock pulses during error detection mode. After the three pulses of CLK, a pulse of LD loads the internal all 1s test pattern. Then OEN should be enabled for 2µs for testing. With the rising edge of OEN the test of the LEDs is stopped and while LD is high the desired error mode can be selected with the corresponding clock pulses. With the next data input the detailed error code will be clocked out at SDO. Note: See Figure 22 for the use of an external test pattern. Figure 22. Low-Current Diagnosis Mode with External Test Pattern – 128 Cascaded AS1109s
2µs Low-Current Diagnosis Mode Display Data1 Data2
SDI
External all 1s Test Pattern T/O or S Error Code Data0
Data2 O or S Error Code from Test Pattern
Data3
SDO
GEF
3x Clocks Low-Current Mode Clock for Error Mode 1x/2x
GEF
Temperature Error Code
CLK OEN
1024x
1024x Rising Edge of OEN Acquisition of Error Status Falling Edge of LD; Error Register is copied into Shift Register
1024x
LD
Current
≤ 100mA ≤ 0.8mA
≤ 100mA
GEF = Global Error Flag
Cascading Devices
To cascade multiple AS1109 devices, pin SDO must be connected to pin SDI of the next AS1109 (see Figure 23). At each rising edge of CLK the LSB of the shift register will be written into the shift register SDI of the next AS1109 in the chain. Data at the SDI pin is clocked in at the rising edge of the CLK pulse and is clocked out at the SDO pin 8.5 clock cycles later at the falling edge of the CLK pulse. Note: When n*AS1109 devices are in one chain, n*8 clock pulses are needed to latch-in the input data. Figure 23. Cascading AS1109 Devices
SDI SDI
AS1109 #1
SDO
SDI
AS1109 #2
SDO
SDI
AS1109 #n-1
SDO
CLK CLK LD OEN
LD
OEN
CLK
LD
OEN
CLK
LD
OEN
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AS1109
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
Constant Current
In LED display applications, the AS1109 provides virtually no current variations from channel-to-channel and from AS1109-to-AS1109. This is mostly due to 2 factors:
!
While IOUT ≥ 50mA, the maximum current skew is less than ±2% between channels and less than ±2% between AS1109 devices. In the saturation region, the characteristics curve of the output stage is flat (see Figure 5 on page 7). Thus, the output current can be kept constant regardless of the variations of LED forward voltages (VF).
!
Adjusting Output Current
The AS1109 scales up the reference current (IREF) set by external resistor (REXT) to sink a current (IOUT) at each output port. As shown in Figure 3 on page 7 the output current in the saturation region is extremely flat so that it is possible to define it as target current (IOUT TARGET). IOUT TARGET can be calculated by: VREXT = 1.253V IREF = VREXT/REXT (if the other end of REXT is connected to ground) IOUT TARGET = IREF*15 = (1.253V/REXT)*15 Where: REXT is the resistance of the external resistor connected to pin REXT. VREXT is the voltage on pin REXT. The magnitude of current (as a function of REXT) is around 100mA at 186Ω, 50.52mA at 372Ω and 25.26mA at 744Ω. Figure 3 on page 7 shows the relationship curve between the IOUT TARGET of each channel and the corresponding external resistor (REXT). (EQ 1) (EQ 2) (EQ 3)
Package Power Dissipation
The maximum allowable package power dissipation (PD) is determined as: PD(MAX) = (TJ-TAMB)/RTH(J-A) When 8 output channels are turned on simultaneously, the actual package power dissipation is: PD(ACT) = (IDD*VDD) + (IOUT*Duty*VDS*8) Therefore, to keep PD(ACT) ≤ PD(MAX), the allowable maximum output current as a function of duty cycle is: IOUT = {[(TJ-TAMB)/RTH(J-A)]-(IDD*VDD)}/VDS/Duty/8 Where: TJ = 150ºC (EQ 6) (EQ 4) (EQ 5)
Delayed Outputs
The AS1109 has graduated delay circuits between outputs. These delay circuits can be found between OUTNn and constant current block. The fixed delay time is 20 ns (typ) where OUTN0 has no delay, OUTN1 has 20ns delay, OUTN2 has 40ns delay ... OUTN7 has 140ns delay. This delay prevents large inrush currents, which reduce power supply bypass capacitor requirements when the outputs turn on (see Figure 12 on page 10)
Switching-Noise Reduction
LED drivers are frequently used in switch-mode applications which normally exhibit switching noise due to parasitic inductance on the PCB.
Load Supply Voltage
Considering the package power dissipation limits (see EQ 4:6), the AS1109 should be operated within the range of VDS = 0.4 to 1.0V. For example, if VLED is higher than 5V, VDS may be so high that PD(ACT) > PD(MAX) where VDS = VLED - VF. In this case, the lowest possible supply voltage or a voltage reducer (VDROP) should be used. The voltage reducer allows VDS = (VLED -VF) - VDROP. Note: Resistors or zener diodes can be used as a voltage reducer as shown in Figure 24.
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AS1109
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 24. Voltage Reducer using Resistor (Left) and Zener Diode (Right)
Voltage Supply Voltage Supply
VLED VF
}
VDROP
VDROP
{
VF VDS
VLED
VDS
AS1109
AS1109
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AS1109
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The device is available in an 16-pin SOIC-150 package. Figure 25. 16-pin SOIC-150 Package
Notes: 1. Lead coplanarity should be 0 to 0.10mm (.004”) max. 2. Package surfacing: a. Top: matte (charmilles #18- 30). b. All sides: matte (charmilles #18- 30). c. Bottom: smooth or matte (charmilles #18- 30). 3. All dimensions excluding mold flashes and end flash from the package body shall not exceed 0.25mm (.010”) per side (D). 4. Detail of pin #1 identifier are optional but must be located within the zone indicated. 5. Dimensions are in millimeters.
Symbol A1 B C D E e H h L A α ZD A2
Min Max 0.10 0.25 0.36 0.46 0.19 0.25 9.80 9.98 3.81 3.99 1.27 BSC 5.80 6.20 0.25 0.50 0.41 1.27 1.52 1.72 0º 8º 0.51 REF 1.37 1.57
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AS1109
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Figure 26. 16-pin SSOP-150 Package
Symbol A A1 A2 b C D E E1 e h L θ ZD N
Min Max 1.35 1.75 0.10 0.25 1.37 1.57 0.20 0.30 0.19 0.25 4.80 4.98 5.79 6.20 3.81 3.99 0.635 BSC 0.22 0.49 0.40 1.27 0º 8º 0.230 REF 16 pins
Notes: 1. Lead coplanarity should be 0 to 0.10mm (.004”) max. 2. Package surfacing: a. Top: matte (charmilles #18- 30). b. All sides: matte (charmilles #18- 30). c. Bottom: smooth or matte (charmilles #18- 30). 3. All dimensions excluding mold flashes and end flash from the package body shall not exceed 0.25mm (.010”) per side (D). 4. Dimensions “b” does not include dambar protrusion/intrusion but solder coverage. 5. Dimensions are in millimeters.
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AS1109
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Figure 27. 16-pin QFN 4x4mm Packages
-AD2 D2/2
D D/2
Index Area (D/2 xE/2) 4
-BNXL E2/2
E/2
e
-B-
aaa C 2x
See Detail B Pin 1 Marker
Index Area (D/2 xE/2)
E
2 1
-A-
N N-1 6 SEE Detail B
NXb bbb ddd
5 CAB C
aaa C 2x
4
Top View
ccc C
Bottom View
8
9
11
NX
0.08 C
A
Seating Plane
-C-
A1
A3
Side View
16-pin QFN 4x4mm A or B Datum Dimensions Symbol aaa bbb ccc ddd b e A A1 A3
e
Datum A or B
Min
Nom 0.15 0.10 0.10 0.05
Max
12 L1
Notes 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2
Terminal Tip 1, 2
12 L1
0.25 0.70 0.00
0.30 0.65 0.75 e/2 0.02 0.20 REF
0.35 0.80 0.05
e
Terminal Tip
5 1, 2
5
Odd Terminal Side
L1 Even Terminal Side 0.03 D BSC E BSC D2 E2 L N ND NE 2.00 2.00 0.45 4.00 4.00 2.15 2.15 0.55 16 4 4
0.15
1, 2 Detail B 1, 2, 10 1, 2, 10 1, 2, 10 1, 2, 10 1, 2, 10 1, 2, 10 1, 2, 10 1, 2, 10
2.25 2.25 0.65
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E2
AS1109
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Notes: 1. 2. 3. 4. Dimensioning and tolerancing conform to ASME Y14.5M-1994. All dimensions are in millimeters; angles in degrees. N is the total number of terminals. The terminal #1 identifier and terminal numbering convention shall conform to JEDEC 95 SPP-012. Details of terminal #1 identifier are optional but must be located within the zone indicated. The terminal #1 identifier may be either a mold or marked feature. 5. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip. If one end of the terminal has the optional radius, the b dimension should not be measured in that radius area. 6. Dimensions ND and NE refer to the number of terminals on each D and E side, respectively. 7. Depopulation is possible in a symmetrical fashion. 8. Figure 27 is shown for illustration only and does not represent any specific variation. 9. All variations may be constructed per Figure 27, however variations may alternately be constructed between square or rectangle shape per dimensions D and E. 10. Refer to the Dimensions Table for a complete set of dimensions. 11. Bilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals. 12. Depending on the method of lead termination at the edge of the package, pullback (L1) may be present. L minus L1 to be ≥ 0.33mm.
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AS1109
Data Sheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The device is available as the standard products shown in Table 9. Table 9. Ordering Information Type AS1109-BSOU AS1109-BSOT AS1109-BSSU AS1109-BSST AS1109-BQFR AS1109-BQFT Description Constant-Current, 8-Bit LED Driver with Diagnostics Constant-Current, 8-Bit LED Driver with Diagnostics Constant-Current, 8-Bit LED Driver with Diagnostics Constant-Current, 8-Bit LED Driver with Diagnostics Constant-Current, 8-Bit LED Driver with Diagnostics Constant-Current, 8-Bit LED Driver with Diagnostics Delivery Form Tubes Tape and Reel Tubes Tape and Reel Tray Tape and Reel Package 16-pin SOIC-150 16-pin SOIC-150 16-pin SSOP-150 16-pin SSOP-150 16-pin QFN (4x4mm) 16-pin QFN (4x4mm)
All devices are RoHS compliant and free of halogene substances.
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AS1109
Data Sheet
Copyrights
Copyright © 1997-2009, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or lifesustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters austriamicrosystems AG A-8141 Schloss Premstaetten, Austria Tel: +43 (0) 3136 500 0 Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact-us
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