AS8202NF

AS8202NF TTP-C2NF Communication Controller D a ta S he e t 1 General Description The AS8202NF communication controller is an integrated device supporting serial communication according to the TTP specification version 1.1. It performs all communication tasks such as reception and transmission of messages in a TTP cluster without interaction of the host CPU. TTP provides mechanisms that allow the deployment in high-dependability distributed real-time systems. It provides the following services: Predictable transmission of messages with minimal jitter Fault-tolerant distributed clock synchronization Consistent membership service with small delay Masking of single faults 40 MHz main clock with support for 10 MHz crystal, 10 MHz oscillator or 40 MHz oscillator 16 MHz bus guardian clock with support for 16 MHz crystal or 16 MHz oscillator Single power supply 3.3V, 0.35µm CMOS process Full automotive temperature range (-40ºC to 125ºC) 16k x 16 SRAM for message, status, control area (communication network interface) and for scheduling information (MEDL) 4k x 16 (plus parity) instruction code RAM for protocol execution code Data sheet conforms to protocol revision 2.04 16k x 16 instruction code ROM containing startup execution code and deprecated protocol code revision 1.00 16 Bit non-multiplexed asynchronous host CPU interface 16 Bit RISC architecture Software tools, design support, development boards available (www.tttech.com) Certification support package according to RTCA/ DO-254 DAL A available (www.tttech.com) 80 pin LQFP80 Package 2 Key Features Dual-channel controller for redundant data transfers Dedicated controller supporting TTP (time-triggered protocol class C) Suited for dependable distributed real-time systems with guaranteed response time Asynchronous data rate up to 5 Mbit/s (MFM/ Manchester) Synchronous data rate 5 to 25 Mbit/s Bus interface (speed, encoding) for each channel selectable independently Figure 1. Block Diagram Host Processor Interface D[15:0] A[11:0] CEB OEB WEB READYB INTB LED[2:0] RAM_CLK_TESTSE USE_RAM_CLK 3 Applications Application fields: automotive (by-wire braking, steering, vehicle dynamics control, drive train control), aerospace (aircraft electronic systems), industrial systems, railway systems. Receiver RxD[1:0] RXCLK[1:0] RxDV[1:0] RXER[1:0] XIN1 XOUT1 TTP Bus Media Drivers Communication network interface (CNI) TTP Protocol processor core Bus guardian AS8202NF Transmitter TxD[1:0] CTS[1:0] TxCLK[1:0] RAM_CLK_TESTSE FTEST Test STEST Interface FIDIS TTEST Quartz or Oscillator XIN0 XOUT0 PLLOFF RESETB Instruction memory RAM & ROM Test Interface www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 1 - 20 AS8202NF TTP-C2NF Data Sheet - A p p l i c a t i o n s Contents 1 General Description ............................................................................................................................... 1 2 Key Features ........................................................................................................................................... 1 3 Applications ............................................................................................................................................ 1 4 Pin Assignments .................................................................................................................................... 3 4.1 Pin Descriptions ................................................................................................................................................3 5 Absolute Maximum Ratings .................................................................................................................. 6 6 Electrical Characteristics....................................................................................................................... 7 7 Detailed Description ............................................................................................................................... 9 7.1 Host CPU Interface ........................................................................................................................................... 9 7.1.1 Synchronous READYB Generation.......................................................................................................12 7.2 Reset and Oscillator ........................................................................................................................................13 7.2.1 7.2.2 7.2.3 7.2.4 External Reset Signal............................................................................................................................13 Integrated Power-On Reset ..................................................................................................................13 Oscillator Circuitry .................................................................................................................................13 Build-up Characteristics ........................................................................................................................14 7.3 TTP Bus Interface ........................................................................................................................................... 15 7.4 TTP Asynchronous Bus Interface.................................................................................................................... 15 7.5 TTP Synchronous Bus Interface ..................................................................................................................... 16 7.6 Test Interface ...................................................................................................................................................16 7.7 LED Signals.....................................................................................................................................................17 8 Package Drawings and Markings........................................................................................................ 18 9 Ordering Information............................................................................................................................ 19 www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 2 - 20 AS8202NF TTP-C2NF Data Sheet - P i n A s s i g n m e n t s 4 Pin Assignments Figure 2. Pin Assignments LQFP80 Package VSSPLL READYB WEB OEB CEB VSS VDD VSSBG XIN1 XOUT1 VDDBG D15 D14 D13 D12 D11 D10 D9 D8 TTEST 80 1 nc XIN0 XOUT0 VDDPLL TXD0 CTS0 TXCLK0 RXER0 RXCLK0 RXDV0 RXD0 VDD VSS TXD1 CTS1 TXCLK1 RXER1 RXCLK1 RXDV1 RXD1 20 21 61 60 VSS VDD D7 D6 D5 D4 D3 D2 D1 D0 VSS VDD A11 A10 A9 A8 A7 A6 A5 VSS 41 RAM_CLK_TESTSE STEST PLLOFF FTEST FIDIS RESETB nc INTB VDD VSS LED0 LED1 LED2 USE_RAM_CLK A0 A1 A2 A3 A4 nc 40 AS8202NF TTP Communications Controller (TOP VIEW) Pin Descriptions Table 1. Pin Descriptions Pin Name VDD VSS VDDBG VSSBG VDDPLL VSSPLL RAM_CLK_T ESTSE STEST FTEST FIDIS TTEST USE_RAM_C LK Pin Number 12,29,49,59, 74 13,30,41,50, 60,75 70 73 4 80 21 22 24 25 61 34 Dir P P P P P P IPD IPD IPD IPD IPU IPD Description Positive Power Supply Negative Power Supply Positive Power Supply for Bus Guardian (connect to VDD) Negative Power Supply for Bus Guardian (connect to VSS) Positive Power Supply for Main Clock PLL (connect to VDD) Negative Power Supply for Main Clock PLL (connect to VSS) RAM_CLK when STEST=0 and USE_RAM_CLK=1, else Test Input, connect to VSS if not used Test Input, connect to VSS Test Input, connect to VSS Test Input, connect to VSS Test Input, connect to VDD RAM_CLK Pin Enable, connect to VSS if not used www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 3 - 20 AS8202NF TTP-C2NF Data Sheet - P i n A s s i g n m e n t s Table 1. Pin Descriptions Pin Name XIN0 XOUT0 PLLOFF XIN1 XOUT1 RESETB TxD0 CTS0 RxD0 TxCLK0 RxER0 RxCLK0 RxDV0 TxD1 CTS1 RxD1 TxCLK1 RXER1 RXCLK1 RxDV1 A[11:0] D[15:0] CEB OEB WEB READYB INTB LED[2:0] nc Pin Number 2 3 23 72 71 26 5 6 11 7 8 9 10 14 15 20 16 17 18 19 48-42, 39-35 69-62, 58-51 76 77 78 79 28 33-31 1, 27, 40 Dir A A IPD A A IPU OPU OPD IPU IPD IPU IPD IPU OPU OPD IPU IPD IPU IPD IPU I I/O IPU IPU IPU OPU OPU OPD Description Main Clock: Analog CMOS Oscillator Input, use as input when providing external clock Main Clock: Analog CMOS Oscillator Output, leave open when providing external clock Main Clock PLL Disable Pin, connect to VSS when providing 10 MHz crystal for enabling the internal PLL Bus Guardian Clock: Analog CMOS Oscillator Input, use as input when providing external clock Bus Guardian Clock: Analog CMOS Oscillator Output, leave open when providing external clock Main Reset Input, active low TTP Bus Channel 0: Transmit Data TTP Bus Channel 0: Transmit Enable TTP Bus Channel 0: Receive Data TTP Bus Channel 0: Transmit Clock (MII mode) TTP Bus Channel 0: Receive Error (MII mode) TTP Bus Channel 0: Receive Clock (MII mode) TTP Bus Channel 0: Receive Data Valid (MII mode) TTP Bus Channel 1: Transmit Data TTP Bus Channel 1: Transmit Enable TTP Bus Channel 1: Receive Data TTP Bus Channel 1: Transmit Clock (MII mode) TTP Bus Channel 1: Receive Error (MII mode) TTP Bus Channel 1: Receive Clock (MII mode) TTP Bus Channel 1: Receive Data Valid (MII mode) Host Interface (CNI) Address Bus Host Interface (CNI) Data Bus, tristate Host Interface (CNI) Chip Enable, active low Host interface (CNI) output enable, active low Host interface (CNI) write enable, active low Host interface (CNI) transfer finish signal, active low, open drain Host interface (CNI) time signal (interrupt), active low, open drain Configurable generic output port Not connected, leave open 2 1 1. The device is addressed at 16-bit data word boundaries. If the device is connected to a CPU with a bytegranular address bus, remember that A[11:0] of the AS8202NF device has to be connected to A[12:1] of the CPU (considering a little endian CPU address bus) 2. At de-assertion READYB is driven to the inactive value (high) for a configurable time. Table 2. Pin Directions Dir I IPU IPD I/O OPU Description TTL Input TTL Input with Internal Weak Pull-Up TTL Input with Internal Weak Pull-Down TTL Input/Output with Tristate TTL Output with Internal Weak Pull-Up at Tristate www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 4 - 20 AS8202NF TTP-C2NF Data Sheet - P i n A s s i g n m e n t s Table 2. Pin Directions Dir OPD A P Description TTL Output with Internal Weak Pull-Down at Tristate Analog CMOS Pin Power Pin www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 5 - 20 AS8202NF TTP-C2NF Data Sheet - A b s o l u t e M a x i m u m Ratings 5 Absolute Maximum Ratings Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 7 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute Maximum Ratings Parameter DC Supply Voltage (VDD) Input Voltage (VIN) Input Current (lIN) Storage Temperature (TSTRG) Soldering Temperature (TSOLD) Package body temperature (Tbody) Humidity (H) Electrostatic Discharge (ESD) 5 1000 Min -0.3 -0.3 -100 -55 Max 5.0 VDD+0.3 100 150 235 240 85 Units V V mA ºC ºC ºC % V HBM: 1KV Mil.std.883, Method 3015.7 t=10 sec, Reflow and Wave 1 Notes any pin any pin, TAMB=25ºC 1. The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD020C “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for packages is (85%/15% Sn/Pb). www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 6 - 20 AS8202NF T TP-C2NF Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s 6 Electrical Characteristics TAMB = -40 to +125 ºC, VDD = 3V to +3.6V, VSS = 0V unless otherwise specified. Table 4. Electrical Characteristics Symbol Operating Conditions IDDs Static Supply Current all inputs tied to VDD/VSS, clocks stopped, exclusive of I/O drive requirements, VDD=3.6V 1 Parameter Conditions Min Typ Max Units 5 900 µA IDD CLK0_EXT_PLL CLK0_EXT CLK1 Operating Supply Current VDD=3.3V, PLL active, exclusive of I/O drive requirements PLL active 2 100 100 25 62.5 mA ns ns ns Clock Period of Main Clock (external) 1 PLL inactive 1 Clock Period of Bus Guardian Clock TTL Input Pins and TTL Bidirectional Pins in Input/Tristate Model VIL VIH IINleak Input Low Voltage Input High Voltage Input Leakage Current Pins without pad resistors, VDD=3.6V Pins with pulldown resistors VDD=3.0V Pins with pull-up resistors Pins with pulldown resistors IIH Input High Current Pins with pull-up resistors VDD=3.0V VIN=0.4V VIN=0.8V VDD=3.6V VIN=0V VDD=3.6V VIN=3.6V VIN=2.0V VIN=2.5V 2.0 -1 4.9 3 3 0.8 V V 1 µA IIL Input Low Current 8.8 µA -75 75 3 -15 15 -10.7 -6 3 µA CIN RxD Pin tASYM_Rx t(VIN=0.5*VDD) Input Capacitance 4.5 4 pF Asymmetric Receiver Delay RxD T = 125 ºC, VDD=3.0V, CLOAD=35pF RxD[1,0] -2 4 2 4 ns CMOS Inputs (XIN), drive from external clock generator Drive at XIN (XOUT = open) CXIN IXIN VIL_XIN VIH_XIN Input Capacitance Input Current Input Low Voltage Input High Voltage 0 0.7* VDD 1.9 2.5 ±1 4 pF µA V V 0.3* VDD VDD www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 7 - 20 AS8202NF T TP-C2NF Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s Table 4. Electrical Characteristics Symbol Parameter Conditions Min Typ Max Units Outputs and TTL Bidirectional Pins in Output Mode IOL IOH IOZ tRISE t(VOUT=0.1*VDD) to t(VOUT=0.9*VDD) Output Low Current Output High Current Output Tristate Current VDD=3.0V, Vo = 0.4V VDD=3.0V, Vo = 2.5V VDD=3.6V T = 125 ºC, VDD=3.0V, CLOAD=35pF CTS[1,0], LED[2:0], INTB D[15:0], READYB CTS[1,0], LED[2:0], INTB D[15:0], READYB -4 4 ±10 8.1 8.9 6 7 3 4 mA mA µA 3 Transition Time – Rise ns 3 tFALL t(VOUT=0.9*VDD) to t(VOUT=0.1*VDD) TxD Pins Transition Time – Fall T = 125 ºC, VDD=3.0V, CLOAD=35pF ns 3 tRISE t(VOUT=0.3*VDD) to Transition Time – Rise TxD t(VOUT=0.7*VDD) tFALL t(VOUT=0.7*VDD) to t(VOUT=0.3*VDD) tASYM_Rx t(VOUT=0.5*VDD) 1. 2. 3. 4. Transition Time – Fall TxD T = 125 ºC, VDD=3.0V, CLOAD=35pF T = 125 ºC, VDD=3.0V, CLOAD=35pF T = 125 ºC, VDD=3.0V, CLOAD=35pF TxD[1,0] 4.5 4 ns TxD[1,0] 3 4 ns Asymmetric Driver Delay TxD TxD[1,0] -3 4 3 4 ns Typical values: CLK0=40 MHz, CLK1=16 MHz Using the internal PLL multiplies the main clock frequency by 4 Implicitly tested. Guaranteed by design; not tested during production Note: If Min/Max values are both negative, they are ordered according to their absolute value. www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 8 - 20 AS8202NF TTP-C2NF Data Sheet - D e t a i l e d D e s c r i p t i o n 7 Detailed Description The AS8202NF is the first TTP controller to support both MFM and Manchester coding. Manchester coding is important for DC-free data transmission, which allows the use of transformers in the data stream. The AS8202NF is pin-compatible with its predecessor, the AS8202. The AS8202NF provides support for fault-tolerant, high-speed bus systems in a single device. The communication controller is qualified for the full temperature range required for automotive applications and is certifiable according to RTCA standards. It offers superior reliability and supports data transfer rates of 25 Mbit/s with MII and up to 5 Mbit/s with MFM/Manchester. The CNI (communication network interface) forms a temporal firewall. It decouples the controller network from the host subsystem by use of a dual ported RAM (CNI). This prevents the propagation of control errors. The interface to the host CPU is implemented as a 16-bit wide non-multiplexed asynchronous bus interface. The TTP follows a conflict-free media access strategy called time division multiple access (TDMA). This means, TTP deploys a time slot technique based on a global time that is permanently synchronized. Each node is assigned a time slot in which it is allowed to perform transmit operation. The sequence of time slots is called TDMA round, a set of TDMA rounds forms a cluster cycle. The operation of the network is repeated after one cluster cycle. The sequence of interactions forming the cluster cycle is defined in a static time schedule, called message descriptor list (MEDL). The definition of the MEDL in conjunction with the global time determines the response time for a service request. The membership of all nodes in the network is evaluated by the communications controller. This information is presented to all correct cluster members in a consistent fashion. During operation, the status of all other nodes is propagated within one TDMA round. Please read more about TTP and request the TTP specification at www.tttech.com. Host CPU Interface The host CPU interface, also referred to as CNI (Communication Network Interface), connects the application circuitry to the AS8202NF TTP controller. All related signal pins provide an asynchronous read/write access to a dual ported RAM located in the AS8202NF. There are no setup/hold constraints referring to the microtick (main clock “CLK0”). All accesses have to be executed on a granularity of 16 bit (2 byte), the device does not support byte-wide accesses. The pin A0 (LSB) of the device differentiates even and odd 16 bit word addresses and is typically connected to A1 of a little-endian host CPU. The A0 of host CPU is not connected to the device, and the application/driver on the host CPU should force all accesses to be 16 bit. For efficiency reasons, the host CPU application/driver may access some memory locations of the AS8202NF using wider accesses (e.g. 32 bit), and the bus interface of the host CPU will automatically split the access into two consecutive 16-bit wide accesses to the TTP controller. Note that particularly in such a setup all timing parameters of the host CPU interface must be met, especially the inactivity timeouts described as symbols 16–19. The host interface features an interrupt or time signal INTB to notify the application circuitry of programmed and protocol-specific, synchronous and asynchronous events. The host CPU interface allows access to the internal instruction code memory. This is required for proper loading of the protocol execution code into the internal instruction code RAM, for extensive testing of the instruction code RAM and for verifying the instruction code ROM contents. INTB is an open-drain output, i.e. the output is only driven to '0' and is weak-pull-up at any other time, so external pullup resistors or transistors may be necessary depending on the application. READYB is also an open-drain output, but with a possibility to be driven to ‘1’ for a defined time (selectable by register) before weak-pull-up at any other time. The LED port is software-configurable to automatically show some protocol-related states and events, see below for the LED port configuration. Table 5. Host Interface Ports Pin Name A[11:0] D[15:0] CEB WEB Mode in inout (tri) in in Width 12 16 1 1 Comment CNI address bus, 12 bit (A0 is LSB) CNI data bus, 16 bit (D0 is LSB) CNI chip enable, active low CNI write enable, active low www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 9 - 20 AS8202NF TTP-C2NF Data Sheet - D e t a i l e d D e s c r i p t i o n Table 5. Host Interface Ports Pin Name OEB READYB INTB RAM_CLK_TESTSE USE_RAM_CLK Mode In out (open drain) out (open drain) in in Width 1 1 1 1 1 Comment CNI output enable, active low CNI ready, active low CNI interrupt, time signal, active low HOST clock HOST clock pin enable Asynchronous READYB permits the shortest possible bus cycle but eventually requires signal synchronization in the application. Connect USE_RAM_CLK to VSS to enable this mode of operation. Synchronous READYB uses an external clock (usually the host processor’s bus clock) for synchronization of the signal, eliminating external synchronization logic. Connect USE_RAM_CLK to VDD and RAM_CLK_TESTSE to the host processor's bus clock to enable this mode of operation. Note: Due to possible metastability occurrence, it is not recommended to be used in safety critical systems. Table 6. Asynchronous DPRAM interface Symbol Tc 1a 2a 1b 2b 3 4 5 6 7a 7b 8 9 10 11a 11b 11c 12 13 Parameter Controller Cycle Time Input Valid to CEB, WEB (Setup Time) CEB, WEB to Input Invalid (Hold Time) Input Rising to CEB, WEB Falling CEB, WEB Rising to Input Falling Write Access Time (CEB, WEB to READYB) CEB, WEB de-asserted to READYB de-asserted Input Valid to CEB, OEB (Setup Time) CEB, OEB to Input Invalid (Hold Time) Input Rising to CEB, OEB Falling CEB, OEB Rising to Input Falling Read Access Time (CEB, OEB to READYB) CEB, OEB asserted to signal asserted CEB, OEB de-asserted to signal de-asserted READYB, D skew RAM_CLK_TESTSE Rising to READYB Falling USE_RAM_CLK=1 3.7 A[11:0] A[11:0] CEB, WEB, OEB CEB, WEB, OEB min = 1.5 Tc, max = 8 Tc D[15:0] D[15:0] READYB 5 2 5 1 Conditions Min Typ 25 Max Units ns ns A[11:0] D[15:0] A[11:0] D[15:0] CEB, WEB, OEB CEB, WEB, OEB min = 1 Tc, max = 4 Tc 5 3 4 5 5 1 ns ns ns 100 9.4 ns ns ns ns ns ns 200 8.4 8 8.8 ±2 13.5 ns ns ns ns ns 1,2 25 5 1 37.5 4.0 3.8 www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 10 - 20 AS8202NF TTP-C2NF Data Sheet - D e t a i l e d D e s c r i p t i o n Table 6. Asynchronous DPRAM interface Symbol 14 Parameter RAM_CLK_TESTSE Rising to READYB Rising Conditions USE_RAM_CLK=1 Ready delay='00' RAM_CLK_TESTSE Rising to READYB Deactivated 1->Z USE_RAM_CLK =1 Ready delay=01 Ready delay=10 Ready delay=11 16 Read to Read Access Inactivity Time (CEB, OEB low to CEB, OEB low) Read to Write Access Inactivity Time (CEB, OEB low to CEB, WEB low) Write to Write Access Inactivity Time (CEB, WEB low to CEB, WEB low) Write to Read Access Inactivity Time (CEB, WEB low to CEB, OEB low) min = 1.5 Tc Min 3 3.6 4.5 5.4 6.4 1 Typ Max 9.7 12.9 15.4 Units ns 15 ns 18.8 22.2 ns 37.5 1 17 5 ns 18 5 1,2 ns 19 5 1,2 ns 1. Prior to starting a read or write access, CEB, WEB and OEB have to be stable for at least 5 ns (see symbol 3, 4, 8, 9). In addition the designer has to consider the minimum inactivity time according to symbols 16, 17, 18, 19. For more information on the inactivity times (see Figure 3). 2. To allow proper internal initialization, after finishing any write access (CEB or WEB is high) to the internal CONTROLLER_ON register, CEB OEB and WEB have to be stable high within 200 ns (min = 8 Tc). Note: All values not tested during production, guaranteed by design. Figure 3. Read/Write Access Inactivity Time Read 16 Read 17 Write 18 Write 19 Read CEB OEB WEB www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 11 - 20 AS8202NF TTP-C2NF Data Sheet - D e t a i l e d D e s c r i p t i o n Figure 4. Write Access Timing (CEB Controlled) 1a 1b Figure 5. Write Access Timing (WEB Controlled) 1a 1b A Valid A Valid CEB CEB WEB 2a 2b WEB 2a 2b D Valid D Valid OEB 3 5 6 4 OEB 3 5 6 4 READYB READYB Figure 6. Read Access Timing (CEB Controlled) 7a 7b Figure 7. Read Access Timing (OEB Controlled) 7a 7b A Valid A Valid CEB CEB WEB 11a WEB 12 11b 11a 11b 12 D 8 Invalid Valid 9 D 8 Invalid Valid 9 OEB 10 11c OEB 10 11c READYB READYB Synchronous READYB Generation Figure 8. Synchronous READYB Timing asynchronous READYB RAM_CLK_TESTSE 15 synchronous READYB 13 14 Synchronous READYB is aligned to host clock (with pulse duration of one host clock cycle) to fulfill the required host timing constraints for input setup and input hold time to/after host clock rising edge. Note: Connect USE_RAM_CLK to VDD and RAM_CLK_TESTSE to the host processor's bus clock to enable this mode of operation. Due to possible metastability occurrence, it is not recommended to be used in safety critical systems. www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 12 - 20 AS8202NF TTP-C2NF Data Sheet - D e ta i l e d D e s c r i p t i o n Reset and Oscillator Table 7. Pin mode Pin Name XIN0 XOUT0 XIN1 XOUT1 PLLOFF RESETB Mode analog analog analog analog in in Comment main oscillator input (external clock input) main oscillator output bus guardian oscillator input (external clock input) bus guardian oscillator output PLL disable external reset External Reset Signal To issue a reset of the chip the RESETB port has to be driven low for at least 1 us. Pulses under 50 ns duration are discarded. At power-up the reset must overlap the build-up time of the power supply. Integrated Power-On Reset The Device has an internal Power-On Reset generator. When supply voltage ramps up, the internal reset signal is kept active (low) for 33 µs typical. Table 8. Parameters Symbol dV/dt tpores Parameter supply voltage slope power on reset active time after VDD > 1,0V Min 551 25 Typ 33 Max 49 Unit V/ms µs Note: In case of non-compliance keep the external reset (RESETB) active for min. 5 ms after supply voltage is valid and oscillator inputs active. Oscillator Circuitry The internal oscillators for main and bus guardian clock require external quartzes or external oscillators. The main clock features a PLL multiplying a 10 MHz XIN0/XOUT0 oscillation to an internal frequency of 40 MHz when enabled. Figure 9. Main clock setup Enabled PLL, external quartz Enabled PLL, external oscillator Disabled PLL, external oscillator Cext 10 M Hz Cext 10 MHz square wave VSS 40 MHz square wave VDD Rf XOUT0 XIN0 Rd VSS PLLOFF XOUT0 XIN0 Rf will normally not be soldered, it is only provided to get maximum flexibility. Cext, typ = 15/18 pF. Rd has to be calculated, if the measured drive level will be too high; if drive level is ok, Rd = 0. www.austriamicrosystems.com and TTTech Computertechnik AG PLLOFF Revision 2.1 PLLOFF 13 - 20 XOUT0 XIN0 AS8202NF TTP-C2NF Data Sheet - D e ta i l e d D e s c r i p t i o n If using an external oscillator at 10 MHz with enabled internal PLL, the oscillator must have a period of 100 ns with low jitter. Note that a crystal-based clock is recommended over a derived clock (i.e., PLL-based) to allow best internal PLL performance. Table 9. Parameters Parameter R_osc10 R_osc16 R_osc20 Condition Oscillation margin @ 10 MHz, CLOAD = 18 pF Oscillation margin @ 16 MHz, CLOAD = 18 pF Oscillation margin @ 20 MHz, CLOAD = 18 pF Min 0.95 1 1 1 Typ 1.62 0.64 0.41 1 1 1 Max Unit kΩ kΩ kΩ 0.37 0.24 1. Not tested during production. Note: CLOAD is the value of the external load capacitors towards ground. The total load capacitance seen by the quartz will be CLOAD_tot = (CLOAD + Cpar)/2. Cpar is the equivalent parasitic capacitance of the oscillator cell inputs and the PCB and is derived from measurements to be about 3.5 … 4.0 pF. Figure 10. Bus Guardian clock setup External quartz External oscillator C ext 16 M H z C ext 16 M H z s q u a re w ave Rf XOUT1 XIN1 Rd Both the XIN0/XOUT0 (main clock) and the XIN1/XOUT1 (bus guardian clock) cells support driving a quartz crystal oscillation as well as clock input by an external oscillator. Build-up Characteristics Table 10. Characteristics Symbol Tosc_startup0 Tosc_startup1 Tpll_startup0 Pin XIN0/ XOUT0 XIN1/ XOUT1 XIN0/ XOUT0 Parameter Oscillator startup time (Main clock) Oscillator startup time (Bus Guardian clock) PLL startup time (Main clock) Min Typ Max 20 20 ms 20 ms Unit ms ms ms Note Quartz frequency: 10 MHz Quartz frequency: 16 MHz Quartz frequency: 10 MHz www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 XOUT1 XIN1 14 - 20 AS8202NF TTP-C2NF Data Sheet - D e ta i l e d D e s c r i p t i o n TTP Bus Interface The AS8202NF contains two TTP bus units, one for each TTP channel, building the TTP bus interface. Each TTP bus channel contains a transmitter and a receiver and can be configured to be either in the asynchronous or synchronous mode of operation. Note that the two channels (channel 0 and channel 1) can be configured independently for either of these modes. The drivers of the TxD and CTS pins are actively driven only during a transmission window, all the other time the drivers are switched off and the weak pull resistors are active. External pull resistors must be used to define the signal levels during idle phases. Note: The transmission window may be different for each channel. Table 11. Bus Interface Connections Pin Name TxD[0] CTS[0] TxD[1] CTS[1] Tx inactive weak pull-up weak pull-down weak pull-up weak pull-down TTP Asynchronous Bus Interface When in asynchronous mode of operation the channel's bus unit uses a self-clocking transmission encoding which can be either MFM or Manchester at a maximum data rate of 5 Mbit/s on a shared media (physical bus). The pins can either be connected to drivers using recessive/dominant states on the wire as well as drivers using active push/pull functionality. The RxD signal uses '1' as the inactivity level. In the so-called RS485 compatible mode longer periods of '0' are treated as inactivity. If the RS485 compatible mode is not used, the application must care to drive RxD to '1' during inactivity on the bus. Table 12. Asynchronous Bus Interface Connections Pin Name TxD[0] CTS[0] TxCLK[0] RXER[0] RXCLK[0] RxDV[0] RxD[0] TxD[1] CTS[1] TxCLK[1] RXER[1] RXCLK[1] RxDV[1] RxD[1] Mode out out in in in in in out out in in in in in RxD RxD TxD CTS Connect to PHY TxD CTS Note Transmit data channel 0 Transmit enable channel 0 No function (do not connect) No function (do not connect) No function (do not connect) No function (do not connect) Receive data channel 0 Transmit data channel 1 Transmit enable channel 1 No function (do not connect) No function (do not connect) No function (do not connect) No function (do not connect) Receive data channel 1 www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 15 - 20 AS8202NF TTP-C2NF Data Sheet - D e ta i l e d D e s c r i p t i o n TTP Synchronous Bus Interface When in synchronous mode of operation, the bus unit uses a synchronous transfer method to transfer data at a rate between 5 and 25 Mbit/s. The interface is designed to run at 25 Mbit/s and to be gluelessly compatible with the commercial 100 Mbit/s Ethernet MII (Media Independent Interface) according to IEEE standard 802.3 (Ethernet CSMA/ CD). Connecting the synchronous TTP bus unit to a 100 Mbit/s Ethernet PHY is done by connecting TxD, CTS, TxCLK, RXER, RXCLK, RxDV and RxD of any channel to TxD0TxD0, TxEN, TxCLK, RXER, RXCLK, RxDV and RxD0 of the PHY's MII. The pins TxD1, TxD2 and TxD3 of the PHY's MII should be linked to VSS. The signals RxD1, RxD2, RxD3, COL and CRS as well as the MMII (Management Interface) should be left open or can be used for diagnostic purposes by the application. Note that the frames sent by the AS8202NF are not Ethernet compatible and that an Ethernet Hub (not a Switch) can be used as a 'star coupler' for proper operation. Also note that the Ethernet PHY must be configured for Full Duplex operation (even though the Hub does not support full duplex), because TTP has its own collision management that should not interfere with the PHY's Half-Duplex collision management. In general, the PHY must not be configured for automatic configuration ('Auto negotiation') but be hard-configured for 100 Mbit/s, Full Duplex operation. Note: To run the interface at a rate other than 25 Mbit/s other transceiver PHY components have to be used. Table 13. Synchronous Bus Interface Connections Pin Name TxD[0] CTS[0] TxCLK[0] RXER[0] RXCLK[0] RxDV[0] RxD[0] TxD[1] CTS[1] TxCLK[1] RXER[1] RXCLK[1] RxDV[1] RxD[1] Mode out out in in in in in out out in in in in in Connect to PHY TxD0TxD0 TxEN TxCLK RXER RXCLK RxDV RxD0 TxD0 TxEN TxCLK RXER RXCLK RxDV RxD0 Note Transmit data channel 0 Transmit enable channel 0 Transmit clock channel 0 Receive error channel 0 Receive clock channel 0 Receive data valid channel 0 Receive data channel 0 Transmit data channel 1 Transmit enable channel 1 Transmit clock channel 1 Receive error channel 1 Receive clock channel 1 Receive data valid channel 1 Receive data channel 1 Test Interface The Test Interface supports the manufacturing test and characterization of the chip. In the application environment test pins have to be connected as following: STEST, FTEST, FIDIS: connect to VSS TTEST: connect to VDD Warning: Any other connection of these pins may cause permanent damage to the device and to additional devices of the application. www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 16 - 20 AS8202NF TTP-C2NF Data Sheet - D e ta i l e d D e s c r i p t i o n LED Signals The LED port consists of three pins. Via the MEDL each of these pins can be independently configured for any of the three modes of operation. At Power-Up and after Reset the LED port is inactive and only weak pull-down resistors are connected. After the controller is switched on by the host and when it is processing its initialization, the LED port is initialized to the selected mode of operation. Table 14. LED Signals Pin Name LED2 LED1 LED0 Protocol Mode RPV or Protocol activity7 Sync Valid 6 4 7 1 Timing Mode Time Overflow Time Tick Microtick 2 Bus Guardian Mode Action Time BDE1 5 5 2 3 Protocol activity or RPV 8 BDE0 1. RPV is Remote Pin Voting. RPV is a network-wide agreed signal used typically for agreed power-up or powerdown of the application's external drivers. 2. Time Overflow is active for one clock cycle at the event of an overflow of the internal 16-bit time counter. Time Tick is active for one clock cycle when the internal time is counted up. Time Overflow and Time Tick can be used to externally clone the internal time control unit (TCU). With this information the application can precisely sample and trigger events, for example. 3. Action Time signals the start of a bus access cycle. 4. The controller sets this output when cluster synchronization is achieved (after integration from the LISTEN state, after acknowledge in the COLDSTART state). 5. BDE0 and BDE1 show the Bus Guardian's activity, '1' signals an activated transmitter gate on the respective channel. 6. Protocol activity is typically connected to an optical LED. The flashing frequency and rhythm give a simple view to the internal TTP protocol state. 7. LED2's RPV mode and LED0's Protocol activity mode can be swapped with a MEDL parameter. 8. Microtick is the internal main clock signal. Each LED pin can be configured to be either a push/pull driver (drives both LOW and HIGH) or to be only an opendrain output (drives only LOW). www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 17 - 20 AS8202NF TTP-C2NF Data Sheet - P a c k a g e D r a w i n g s and Markings 8 Package Drawings and Markings The product is available in LQFP80 package. Figure 11. package Diagram Table 15. package Dimensions Symbol Min D 15.8 D1 13.9 E 15.8 E1 13.9 b 0.22 b1 0.22 c 0.09 Typ 16 14 16 14 0.32 0.3 Max 16.2 14.1 16.2 14.1 0.38 0.33 0.2 Symbol c1 e ccc ddd N N/2 N/4 Min 0.09 Typ 0.65 0.10 0.13 80 40 20 Max 0.16 Note: 1. All dimensions are in millimeters, angle is in degrees. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Dimensioning and tolerancing conform to JEDEC MS-026 Rev A. 4. The top package body size may be smaller than the bottom body size by as much as 0.15 mm. www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 18 - 20 AS8202NF TTP-C2NF Data Sheet - O r d e r i n g I n f o r m a t i o n 9 Ordering Information Table 16. Ordering Information Type AS8202NF-ALQR AS8202NF-ALQT AS8202NF-ALQU Marking AS8202NF AS8202NF AS8202NF Description TTP communication controller TTP communication controller TTP communication controller Delivery Form Tray Tape&Reel Tube Package LQFP80 LQFP80 LQFP80 www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 19 - 20 AS8202NF TTP-C2NF Data Sheet - O r d e r i n g I n f o r m a t i o n Copyrights Copyright © 1997-2009, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. 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Contact Information Headquarters austriamicrosystems AG A-8141 Schloss Premstaetten, Austria Tel: +43 (0) 3136 500 0 Fax: +43 (0) 3136 525 01 For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact B Revision 2.1 20 - 20 www.austriamicrosystems.com and TTTech Computertechnik AG