AS1334-SAMPLE

austriamicrosystems AG is now ams AG The technical content of this austriamicrosystems datasheet is still valid. Contact information: Headquarters: ams AG Tobelbaderstrasse 30 8141 Unterpremstaetten, Austria Tel: +43 (0) 3136 500 0 e-Mail: ams_sales@ams.com Please visit our website at www.ams.com Datasheet AS1334 650mA, Ultra low Ripple Step Down DC/DC Converter 1 General Description 2 Key Features Output Voltage Ripple: 2mV The AS1334 is a step-down DC-DC converter designed to power portable applications from a single Li-Ion battery. The device also achieves high-performance in mobile phones and other applications requiring low dropout voltage. al id PWM Switching Frequency: 2MHz Single Lithium-Ion Cell Operation Fixed-frequency PWM operation minimizes RF interference. Shutdown function turns the device off and reduces battery consumption to 0.01µA (typ). lv Output Voltage Range: 1.2V to 3.4V (available in 100mV steps, see Ordering Information on page 17) Fixed Output Voltages: - 1.2V, 1.5V, 1.8V, 2.5V, 3.0V, 3.3V The AS1334 operates from an input voltage range of 2.7 to 5.5V while providing output voltages of 1.2, 1.5, 1.8, 2.5, 3.0 and 3.3V. Maximum Load Capability of 650mA The AS1334 is available in a TDFN(3x3) 8-pin package. A high switching frequency (2 MHz) allows use of tiny surface-mount components. Only three small external surface-mount components, an inductor and two ceramic capacitors are required. 97% High Efficiency, 94% Average Efficiency am lc s on A te G nt st il Current Overload Protection Thermal Overload Protection Power-OK Soft Start Low Dropout Voltage (140 mΩ Typ PFET) TDFN(3x3) 8-pin 3 Applications The AS1334 is an ideal solution to supply noise sensitive applications as cellular phones, hand-held radios, RF PC cards, battery powered RF devices, RFID chipsets, A/D Converter, Sensors and OpAmps. PVIN ni VIN ca Figure 1. AS1334 - Typical Application Circuit SW 3.3 µH VOUT VDD FB AS1334 10 µF ON OFF EN Te ch 10 µF www.austriamicrosystems.com/DC-DC_Step-Down/AS1334 POK PGND Revision 1.09 SGND 1 - 18 AS1334 Datasheet - P i n A s s i g n m e n t s 4 Pin Assignments 8 PGND POK 2 7 SW AS1334 EN 3 SGND 9 5 SGND am lc s on A te G nt st il VDD 4 6 PVIN lv FB 1 al id Figure 2. Pin Configuration 4.1 Pin Descriptions Table 1. Pin Descriptions Pin Number 1 Pin Name FB 2 POK 3 4 5, 9 6 ca PGND Te ch 8 SW ni 7 EN VDD SGND PVIN Description Feedback Pin. Connect to the output at the output filter capacitor. Power-OK. 0 = VOUT < 90% of VOUTNOM. 1 = VOUT > 90% of VOUTNOM. Enable Input. Set this digital input high for normal operation. For shutdown, set low. +2.7V to +5.5V Power Supply Voltage. Analog Supply Input. Analog and Control Ground. Connect these pins with low resistance to PGND. +2.7V to +5.5V Power Supply Voltage. Input to the internal PFET switch. Switch Pin. Switch node connection to the internal PFET switch and NFET synchronous rectifier. Connect to an inductor with a saturation current rating that exceeds the maximum switch peak current limit specification of the AS1334. Power Ground. Connect this pin with low resistance to SGND. www.austriamicrosystems.com/DC-DC_Step-Down/AS1334 Revision 1.09 2 - 18 AS1334 Datasheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Min Max Units VDD, PVIN to SGND -0.3 +7.0 V PGND to SGND -0.3 +0.3 V POK, EN, FB SGND - 0.3 VDD + 0.3 V SW PGND - 0.3 PVIN + 0.3 V PVIN to VDD -0.3 +0.3 V Input Voltage Range 2.7 5.5 V Notes Electrical Parameters am lc s on A te G nt st il lv 7.0V max al id Parameter Recommended Load Current Ambient Temperature (TA) Range Electrostatic Discharge 650 -40 Human Body Model mA +85 ºC In applications where high power dissipation and/ or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). 2 kV Norm: MIL 883 E method 3015 +150 ºC +150 ºC Temperature Ranges and Storage Conditions Junction Temperature (TJ-MAX) -55 ca Storage Temperature Range ni Package Body Temperature ch Humidity 5 ºC 86 % Non-condensing 1 Represents a max. floor life time of unlimited Te Moisture Sensitive Level +260 The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/ JEDEC J-STD-020“Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). www.austriamicrosystems.com/DC-DC_Step-Down/AS1334 Revision 1.09 3 - 18 AS1334 Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s 6 Electrical Characteristics TA = TJ = -40ºC to +85ºC; PVIN = VDD = EN = 3.6V, unless otherwise noted. Typical values are at TA=25°C. Table 3. Electrical Characteristics VOUT Operating Temperature Range Output Voltage Shutdown supply current IQ DC bias current into VDD RDSON(P) Pin-Pin Resistance for PFET RDSON(N) Pin-Pin Resistance for NFET ILIM,PFET Switch peak current limit POK Output PVIN = 3.6V EN = SW = 0V 1 FB = 0V, No Switching Max Units +85 °C 1.224 V 1.53 V 1.836 V 2.55 V 3.06 V 1.176 1.2 1.47 1.5 1.764 1.8 2.45 2.5 2.94 3.0 3.234 3.3 3.366 V 0.01 2 µA 2 ISW = 200mA; TA = +25°C Falling edge, referenced to VOUT(NOM) 415 485 87 ca Internal oscillator frequency 1.8 mA mΩ mΩ 1100 1200 mA 0.05 0.2 V 500 nA 93 % 90 1.2 Pin pull down current Oscillator 200 300 935 POK Threshold Logic low input threshold 140 ISW = -200mA POK = 3.6V VIL,EN 1.4 230 ISW = -200mA; TA = +25°C POK Output High Leakage Current Logic high input threshold 1 ISW = 200mA POK sinking 0.1mA VIH,EN FOSC Typ -40 POK Output Low Voltage Enable Input IPIN,ENABLE Min am lc s on A te G nt st il ISHDN VOL Conditions lv TA Parameter al id Symbol V 0.5 V 5 10 µA 2 2.2 MHz Te ch ni 1. Shutdown current includes leakage current of PFET. 2. IQ specified here is when the part is operating at 100% duty cycle. www.austriamicrosystems.com/DC-DC_Step-Down/AS1334 Revision 1.09 4 - 18 AS1334 Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s 6.1 System Characteristics TA = 25ºC; PVIN = VDD = EN = 3.6V, unless otherwise noted. The following parameters are verified by characterisation and are not production tested. Table 4. System Characteristics Symbol Parameter Conditions Min Typ Max Units 350 µs Turn on time (from Enable low to high transition) EN = Low to High, VIN = 4.2V, COUT = 10µF, IOUT ≤ 1mA 210 η Efficiency (L = 3.3µH, DCR ≤ 100mΩ) VIN = 3.6V, IOUT = 400mA 96 VIN = 4.2V, IOUT = 10mA to 400mA 5 Line_tr Line transient response VIN = 600mV perturbance, over VIN range 3.4V to 5.5V; TRISE = TFALL = 10µs, VOUT = 3.0V, IOUT = 100mA 50 Load_tr Load transient response VIN = 4.2V, VOUT = 3.0V, transients up to 100mA, TRISE = TFALL = 10µs % mVp-p lv mVpk 50 mVpk am lc s on A te G nt st il VOUT_ripple Ripple voltage, PWM mode 1 al id T_ON 1. Ripple voltage should measured at COUT electrode on good layout PC board and under condition using suggested inductors and capacitors. Te ch ni ca Note: All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. www.austriamicrosystems.com/DC-DC_Step-Down/AS1334 Revision 1.09 5 - 18 AS1334 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s 7 Typical Operating Characteristics Circuit in Figure 23 on page 11, PVIN = VDD = EN = 3.6V, L = 3.3µH (LPS4018-332ML_), CIN = COUT = 10µF (GRM21BR61C106KA01) unless otherwise noted. Figure 3. Quiescent Current vs. VIN Figure 4. Shutdown Current vs. Temperature 0.3 0.55 Vi n=3.25V 0.45 0.4 al id 0.5 Vi n=4.2V Vi n=5.5V 0.2 0.15 lv Shutdown Current (µA) Quiescent Current (mA) Vi n=3.6V 0.25 0.1 0.05 am lc s on A te G nt st il - 45°C + 25°C + 85°C 0.35 2.5 3 3.5 4 4.5 5 0 -40 5.5 -15 10 Supply Voltage (V) 3 85 Figure 6. Output Voltage vs. Supply Voltage 3.04 Output Voltage (V) 2 1 0 -1 -2 3.02 3 2.98 2.96 Vi n=3.6V -3 Vi n=4.2V -15 10 35 60 Iout=50mA Iout=300mA Vi n=5.5V -4 -40 60 3.06 ca Switching Frequency Variation (%) Figure 5. Switching Frequency Variation vs. Temperature 4 35 Temperature (°C) Iout=650mA 85 2.94 3.25 Temperature (°C) 3.75 4.25 4.75 5.25 Te ch ni Supply Voltage (V) www.austriamicrosystems.com/DC-DC_Step-Down/AS1334 Revision 1.09 6 - 18 AS1334 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s Figure 8. Efficiency vs. Output Current 3.06 100 3.04 95 3 2.98 90 85 al id 3.02 Efficiency (%) Output Voltage (V) Figure 7. Output Voltage vs. Temperature 80 Vi n=3.25V Vi n=3.6V Vi n=3.9V 75 Iout=50mA Vi n=4.2V Iout=300mA Vi n=5.5V 70 35 60 85 0 300 400 500 600 am lc s on A te G nt st il VOUT 1.1 1.05 IOUT Vi n=2.7V Vi n=3.6V Vi n=5.5V 1 -40 -15 10 35 700 Figure 10. Load Transient Response; VOUT = 3.0V, VIN = 4.2V IL Peak Current Limit (A) 1.15 200 Output Current (mA) Figure 9. Switch Peak Current Limit vs. Temperature; closed loop 1.2 100 60 85 10µs/Div 200mV/Div 10 Temperature (°C) 200mA/Div -15 400mA 2.94 -40 lv Vi n=4.5V Iout=650mA 100mA 2.96 ca Temperature (°C) www.austriamicrosystems.com/DC-DC_Step-Down/AS1334 5V/Div 2V/Div 500mA/DIV VSW VOUT IL EN 50µs/Div 1V/Div 5V/Div 2V/Div 500mA/DIV Figure 12. Startup; VIN = 4.2V, VOUT = 3.0V, IOUT