AS7000
Biosensor
General Description
The AS7000 device provides a flexible analog front end for light
sensing applications. The photodiode input circuit can be
configured in different ways to guarantee best tradeoff
between speed and sensitivity for a large number of different
sensing applications.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits and Features
The benefits and features of AS7000, Biosensor are listed below:
Figure 1:
Added Value of Using AS7000
Benefits
Features
• Allows smallest application size e.g. narrow HRM
measurement band
• Single device integrated optical solution
• Integrated 32bit Cortex-M0 processor
• Good HRM measurement quality
• Low noise analog optical front end
• Additional information for end user
• Analog electrical front end (e.g. for NTC or GSR)
• Long operating time
• Hardware sequencer to offload processor
• Adjustable LED driver with current control
• Works reliably with ambient light
• Synchronous detector
Applications
The device is suitable for optical sensor platform.
ams Datasheet
[v1-12] 2018-Feb-26
Page 1
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AS7000 − General Description
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
Application Schematic AS7000-AA
LED
Supply
VD1
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
CLDO
2.2µF
VDD
V_LDO
GND
ON=0,
off by sotftware
UART, SPI, I2C
LDO
Optical
Frontend
14 bit ADC
Biasing
SIGREF
AGND
VD2
VD3
AS7000-AA
Page 2
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GPIO8
GPIO7
GPIO6
GPIO5
Cortex M0
4kByte RAM
32kByte EEPROM
Electrical
Frontend
VDD
2.6V-3.6V
CVDD
2.2µF
VD4
if not used
connect to GND
Optical barrier
CSIGREF
2.2µF
LED
Supply
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Pin Assignments
Pin Assignments
Figure 3:
Optical Module Pinout (Top View) – AS7000-AA
Optical Module Pinout:
This drawing is not to scale
GND 10
9 VDD
VD1
GPIO0 11
8 GPIO8
GPIO1 12
7 GPIO7
GPIO2 13
6 GPIO6
GPIO3 14
Sensor
5 V_LDO
GPIO4 15
4 AGND
GPIO5 16
3 SIGREF
VD1 17
2 VD4
VD2
VD3 18
1 VD2
Figure 4:
Pin Description
Pin Number
Pin Name
Description
1
VD2
Supply voltage for LED D2 – connect unused current sinks to GND
2
VD4
Supply voltage for LED D4 – connect unused current sinks to GND
3
SIGREF
Analog reference output. Connect 2.2μF capacitor to GND
(e.g. 0402 sized capacitor GRM153R60J225ME95 from Murata – needs to
have >1μF specified for 1.0V voltage bias); do not load externally
The typical operating voltage on this pin is 0.6V (sigref_en=1)
4
AGND
Analog ground. Connect to low noise GND
5
V_LDO
1.9V output voltage. Connect 2.2μF capacitor to GND
(e.g. 0402 sized capacitor GRM153R60J225ME95 from Murata – needs to
have >1μF with 1.0V voltage bias); do not load externally
6
GPIO6
General purpose input/output
7
GPIO7
General purpose input/output
8
GPIO8
General purpose input/output
9
VDD
Supply voltage.
10
GND
Power supply ground. All voltages are referenced to GND.
ams Datasheet
[v1-12] 2018-Feb-26
Page 3
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AS7000 − Pin Assignments
Pin Number
Pin Name
11
GPIO0
General purpose input/output
12
GPIO1
General purpose input/output
13
GPIO2
General purpose input/output
14
GPIO3
General purpose input/output
15
GPIO4
General purpose input/output
16
GPIO5
General purpose input/output
17
VD1
Supply voltage for LED D1 – connect unused current sinks to GND
18
VD3
Supply voltage for LED D3 – connect unused current sinks to GND
Page 4
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Description
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions beyond
those indicated in Electrical Characteristics is not implied.
Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
Figure 5:
Absolute Maximum Ratings (1)
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD
Supply voltage to ground
3.63V
V
V_LDO
Supply voltage to ground
1.98V max.
VDD+0.3V
V
Input pin voltage to
ground, all pins except
VD1/VD2/VD3/VD4
-0.3
VDD+0.3V
max. 3.8V
V
VIN-VD1-4
Input pin voltage to
ground, pins
VD1/VD2/VD3/VD4
-0.3
5.5
V
VINLDO
Input pin voltage to
ground, pin SIGREF
-0.3
V_LDO+0.3V
max. 1.98V
V
ISCR
Input current
(latch-up immunity)
-100
100
mA
JEDEC JESD78
Electrostatic discharge HBM:
JEDEC JESD22-A114F
VIN
Electrostatic Discharge
ESDHBM
All pins except
VD1/VD2/VD3 and VD4
±1.0
kV
Pins VD1/VD2/VD3 and VD4
±350
V
ams Datasheet
[v1-12] 2018-Feb-26
Page 5
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AS7000 − Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Temperature Ranges and Storage Conditions
TAMB
Operating temperature
-30
70
°C
TSTRG
Storage temperature range
-40
85
°C
TBODY
Package body temperature
RHNC
Relative humidity
non-condensing
MSL
Moisture sensitivity level
5
260
°C
85
%
3
IPC/JEDEC J-STD-020
The reflow peak soldering
temperature (body
temperature) is specified
according to IPC/JEDEC
J-STD-020 “Moisture/Reflow
Sensitivity Classification for
Non-hermetic Solid State
Surface Mount Devices.”
Maximum floor life time of 168h
Note(s):
1. All optical customer designs shall be reviewed by ams before production.
Page 6
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Electrical Characteristics
Electrical Characteristics
VDD=2.6 to 3.6V, typ. values are at TAMB=25°C (unless otherwise
specified).
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Figure 6:
Operating Conditions
Symbol
Parameter
Conditions
VDD
Supply voltage
VLED
LED Supply voltage
VD1, VD2, VD3, VD4 if a
LED is used
VLDO
LDO voltage, generated by
AS7000
Pin V_LDO
TAMB
Operating free-air temperature
Min
Typ
Max
Unit
2.6
3.3
3.6
V
5.0
V
1.9
−30
Supply current
70
°C
CPU + EEPROM running at
16MHz;
from 1.8V supply; all
periphery blocks off
1.4
mA
CPU in sleep mode,
16MHz oscillator running;
all periphery blocks off
360
μA
2
mA
Photodiode amplifier and
Optical front end
430
μA
Electrical front end
180
μA
LED current sink per
channel 25mA range
210
μA
LED current sink per
channel 50mA and
100mA range
340
μA
Deep sleep mode (1), (2)
512Hz oscillator running,
LDO operating, processor
powered
25
μA
Power down (3)
GPIO8=VDD.
0.8
μA
ADC 14bit; only during
conversion
IDD
V
VOL
GPIO0-8 output low voltage
With 3 mA load
With 6 mA load
0
0
0.4
0.8
V
VOH
GPIO0-8 output high voltage
With 6 mA load,
VDD>3.0V
2.4
VDD
V
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Electrical Characteristics
Symbol
Parameter
VIH
GPIO0-8 input high voltage
VIL
GPIO0-8 input low voltage
RPULLUP
RPULLDOWN
Conditions
Min
Typ
Max
1.25
Unit
V
0.54
V
Pullup Resistor to VDD
On GPIO0…8 if bit gpioX_
pd=1 where X=0…8
75
kΩ
Pulldown Resistor to GND
On GPIO0…8 if bit gpioX_
pd=2 where X=0…8
75
kΩ
ILEAK1
GPIO0-8
−1
ILEAK2
VD1-4 pins
At 5.0 V, TAMB=25ºC
E_f16M
Tolerance of internal 16MHz
oscillator
TAMB>0ºC
E_f3k2
Tolerance of internal 512Hz
oscillator
1
μA
2
μA
-2
+2
%
-35
+25
%
EEPROM
nCYCLES
tRETENTION
Number of write cycles
Data retention time
100
cycles
At maximum 65ºC
10
years
I²C Mode Timings (SCL / SDA Programmable to GPIO Pins – See I²C Mode)
fSCLK
SCL clock frequency
tBUF
Bus free time between a STOP and
START condition
1.3
kHz
Hold time (repeated) START
condition(3)
0.6
μs
tLOW
LOW period of SCL clock
1.3
μs
tHIGH
HIGH period of SCL clock
0.6
μs
tSU:STA
Setup time for a repeated START
condition
0.6
μs
tHD:DAT
Data hold time (4)
tSU:DAT
Data Setup Time (5)
100
tR
Rise time of both SDA and SCL
signals
20
300
ns
tF
Fall time of both SDA and SCL
signals
20
300
ns
tSU:STO
Setup time for STOP condition
0.6
tHD:STA
CB
Capacitive load for each bus Line
Page 8
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0
0
CB — total capacitance of
one bus line in pF
400
0.9
μs
ns
μs
400
pF
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Electrical Characteristics
Symbol
CI/O
Parameter
Conditions
Min
I/O capacitance (SDA, SCL)
Typ
Max
Unit
10
pF
Note(s):
1. Deep sleep mode. Use ams SDK (software development kit) to enter deep sleep, wakeup with low on GPIO8 pin (if gpio8_wakeup_
en=1) or high on GPIO7 (if gpio7_wakeup_en=1) or 512Hz oscillator sleep_timer.
2. GPIO0-8 configured to draw minimum current (software dependent).
3. Power down mode. Entered by setting enter_powerdown=1; No oscillator running. Wakeup with low on GPIO8 pin (always) or high
on GPIO7 (if gpio7_wakeup_en=1).
4. A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIHMIN of the SCL signal) to bridge
the undefined region of the falling edge of SCL.
5. A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT = to 250ns must then be met. This is
automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period
of the SCL signal, it must output the next data bit to the SDA line t R max + tSU:DAT = 1000 + 250 = 1250ns before the SCL line is released.
Figure 7:
I²C Mode Timing Diagram
SDA
tBUF
tLOW
tR
tHD:STA
tF
SCLK
tHD:STA
tSU:STA
tHD:DAT
STOP
tHIGH
tSU:STO
tSU:DAT
REPEATED
START
START
I²C Mode Timing Diagram: This figure shows the different timings required for I²C communication.
Note(s):
1. SCL / SDA Programmable to GPIO Pins – See I²C
ams Datasheet
[v1-12] 2018-Feb-26
Mode .
Page 9
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AS7000 − Detailed Description
Detailed Description
Optical Analog Front End
Figure 8:
Optical Analog Front End – AS7000-AA Configuration
pdoffx
pd_ampres
pd1
pd_ampcap
Synchronous Demodulator
sd_en
sd_byp
pd2
*
pd_amp_en
pdi_0
aa_freq
adc_sel=0
pd4
sd_bw
200Hz
TIA
ADC
gain_g gain_byp
gain_en
Gain Stage
-1/0/+1
High Pass Filter
sample
hp_freq hp_byp
hp_en
adc_sel=1
pdi_1
reset
VD1 VD2 GPIO7 GPIO6
pd3
VD4 VD3
Sequencer
Note(s):
1. Dual Green LED Configuration is shown.
The number of LEDs inside the module depends on the
application – Figure 8 shows 2 LEDs. If a LED is not populated,
the current sink is connected directly to the pin (VD3 and VD4
in above figure).
Page 10
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
LEDs
AS7000-AA Dual Green LED Configuration
Two green LEDs are used (pins VD1/VD2). The other two current
sinks are available on pins VD3 and VD4.
LED Characteristics
Figure 9:
LED Characteristics at TAMB =25°C
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
50
mA
100
mA
Green LED (AS7000-AA)
Allowed operating LED current
range (1)
Continuous
VFLED_GREEN
Forward voltage (2)
ILED=20mA
VFLED+DRIVER
Voltage on VD1/VD2 where
operation of the LED and current
source is guaranteed
ILED= 10mA
3.6
ILED= 50mA
4.5
ILED_GREEN
_GREEN
λp_GREEN
Δλ½_GREEN
0
1/10 duty cycle @ 1 kHz
2.9
3.2
V
V
Dominant wavelength
527
nm
Spectral halfwidth
35
nm
Note(s):
1. The maximum allowed LED current (DC and peak) is specified for 25°C. Lower values apply for higher temperatures.
2. Add 280mV and use LED current range ≤100mA for designing the VD1/VD2 LED supply (DC-DC converter).
ams Datasheet
[v1-12] 2018-Feb-26
Page 11
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AS7000 − Detailed Description
LED-Driver
The four LED-driver outputs can be controlled manually or by
the built in sequencer. See Optical Front End Operating Modes
Figure 10:
LED Drivers
VD1
VD2
D1
D2
VD3
D3
max.
compliance
ledX_en
man_mode
VD4
D4
R
S
SET
CLR
Q
Q
ledX_supply
_low
write ‘1’ to register
ledX_supply_low
currX
imaxX (set currX range)
man_sw_ledX
Sequencer
ledX_mode
X=1
X=2
X=3
X=4
Note(s):
1. Dual Green LED Configuration.
Figure 11:
Operating Characteristics of Each LED Current Sink, VDD=3V, TAMB=25°C (unless otherwise noted)
Symbol
Parameter
LED output current range
ILED1/2/3/4
Tolerance
Conditions
Min
Typ
Max
Unit
mA
mA
mA
imax1/2/3/4 = 00
imax1/2/3/4 = 01
imax1/2/3/4 = 10
0
0
0
25
50
100
25mA range
imax1/2/3/4 = 00
-5
5
50mA range
imax1/2/3/4 = 01
-10
10
100mA range (1)
imax1/2/3/4 = 10
-10
10
V_Dmin
Output voltage
compliance
Voltage compliance of current
sinks D1,D2,D3,D4
V_Dmax
Output voltage maximum
Pins VD1, VD2, VD3 and VD4
0.28
5
%
V
5.5
V
Note(s):
1. Not production tested. Only guaranteed by lab characterization.
Page 12
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
LED Configuration Registers
For ledX_supply_low registers see register AFE_PD_CFG.
Figure 12:
AFE_LED_CFG
0x00: AFE_LED_CFG
Field
Name
Rst
Type
Description
18
sigref_en
0
RW
Signal reference: Is required for all analog blocks
0...Disable signal reference
1...Enable signal reference
11
led4_en
0
RW
0...Disables LED4 output source.
1...Enables LED4 output source.
10
led3_en
0
RW
0...Disables LED3 output source.
1...Enables LED3 output source.
9
led2_en
0
RW
0...Disables LED2 output source.
1...Enables LED2 output source.
8
led1_en
0
RW
0...Disables LED1 output source.
1...Enables LED1 output source.
Defines IMAX of LED4.
7:6
imax4
1
Setting
IMAX
0
25mA
1
50mA
2
100mA
3
Do not use
RW
5:4
imax3
1
RW
Defines IMAX of LED3. same encoding as imax4
3:2
imax2
1
RW
Defines IMAX of LED2. same encoding as imax4
1:0
imax1
1
RW
Defines IMAX of LED1. same encoding as imax4
The LED_CFG register is used to configure the operating mode
of the LED outputs.
ams Datasheet
[v1-12] 2018-Feb-26
Page 13
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AS7000 − Detailed Description
AFE_LED_CURR Register (Addr: 0x04)
The AFE_LED_CURR defines the LED output current.
Figure 13:
AFE_LED_CURR Register
Addr: 0x04
AFE_LED_CURR
Bit
Bit Name
Default
Access
31:24
curr4
0x00
R/W
LED4 output current – do not use code=0 (will generate
no output current)
ILED4 = (curr4 + 1) * imax4 / 256
23:16
curr3
0x00
R/W
LED3 output current – do not use code=0 (will generate
no output current)
ILED3 = (curr3 + 1) * imax3 / 256
15:8
curr2
0x00
R/W
LED2 output current – do not use code=0 (will generate
no output current)
ILED2 = (curr2 + 1) * imax2 / 256
7:0
curr1
0x00
R/W
LED1 output current – do not use code=0 (will generate
no output current)
ILED1 = (curr1 + 1) * imax1 / 256
Page 14
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Description
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Figure 14:
AFE_MAN_SEQ_CFG
0x20: AFE_MAN_SEQ_CFG
Field
Name
Rst
Type
Description
26
man_mode
0
RW
0...Enables Sequencer
1...Enables Manual control of optical front end
23
man_sw_itg
0
RW
If man_mode=1
0...All integrator capacitors are shorted. Integrator is reset
1...Integrator capacitors are charging up. Integrator is
running
22
man_sw_led4
0
RW
If man_mode=1
0...LED output D4 disabled. (High impedance)
1...LED output D4 enabled
21
man_sw_led3
0
RW
If man_mode=1
0...LED output D3 disabled. (High impedance)
1...LED output D3 enabled
20
man_sw_led2
0
RW
If man_mode=1
0...LED output D2 disabled. (High impedance)
1...LED output D2 enabled
19
man_sw_led1
0
RW
If man_mode=1
0...LED output D1 disabled. (High impedance)
1...LED output D1 enabled
18:17
diode_ctrl
ams Datasheet
[v1-12] 2018-Feb-26
0
RW
Connection of Photodiodes PD1, PD2, PD3, PD4 to the
photodiode amplifier.
0...PD1-PD4 are connected
1...PD1 synchronous to LED1, PD2 sync/to LED2, PD3
sync/to LED3, PD4 sync/to LED4
2...PD1 synchronous to LED1, PD2 sync/to LED1, PD3
sync/to LED2, PD4 sync/to LED2
3...PD1 synchronous to LED1, PD2 sync/to LED1, PD3
sync/to LED4, PD4 sync/to LED4
Note that AFE_PD_CFG.pdX takes precedence - to turn
OFF one photo diode, the respective bit (pd1…pd4) has to
be de-asserted in the AFE_PD_CFG register.
AFE_PD_
CFG.pdX
diode_
ctrl
Photo
Diode1
Photo
Diode2
Photo
Diode3
Photo
Diode4
0
xx
OFF
OFF
OFF
OFF
1
00
ON
ON
ON
ON
1
01
LED1
LED2
LED3
LED4
1
10
LED1
LED1
LED2
LED2
1
11
LED1
LED1
LED4
LED4
Page 15
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AS7000 − Detailed Description
0x20: AFE_MAN_SEQ_CFG
Field
Name
Rst
Type
13
dma_disable
0
RW
Description
ADC DMA disable
1...ADC result has to be read from adc_data
0...ADC result(s) is/are written to memory
LED4 mode
Setting
12:10
led4_mode
0
RW
Behavior
0
Always OFF
1
Always ON when sequencer is active
2
Controlled by sequencer
3
Controlled by sequencer, only ON in even
iterations: 0, 2, 4 etc.
4
Controlled by sequencer, only ON in odd
iterations: 1, 3, 5 etc.
5
Controlled by sequencer, only ON in every
fourth iteration, starting at 3: 3, 7, 11 etc.
LED3 mode
Setting
9:7
led3_mode
Page 16
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0
RW
Behavior
0
Always OFF
1
Always ON when sequencer is active
2
Controlled by sequencer
3
Controlled by sequencer, only ON in even
iterations: 0, 2, 4 etc.
4
Controlled by sequencer, only ON in odd
iterations: 1, 3, 5 etc.
5
Controlled by sequencer, only on in every
fourth iteration, starting at 2: 2, 6, 10 etc.
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
0x20: AFE_MAN_SEQ_CFG
Field
Name
Rst
Type
Description
LED2 mode
Setting
6:4
led2_mode
0
RW
Behavior
0
Always OFF
1
Always ON when sequencer is active
2
Controlled by sequencer
3
Controlled by sequencer, only ON in even
iterations: 0, 2, 4 etc.
4
Controlled by sequencer, only ON in odd
iterations: 1, 3, 5 etc.
5
Controlled by sequencer, only ON in every
fourth iteration, starting at 1: 1, 5, 9 etc.
LED1 mode
Setting
3:1
0
led1_mode
seq_en
ams Datasheet
[v1-12] 2018-Feb-26
0
0
RW
RW
Behavior
0
Always OFF
1
Always ON when sequencer is active
2
Controlled by sequencer
3
Controlled by sequencer, only ON in even
iterations: 0, 2, 4 etc.
4
Controlled by sequencer, only ON in odd
iterations: 1, 3, 5 etc.
5
Controlled by sequencer, only ON in every
fourth iteration, starting at 0: 0, 4, 8 etc.
0...Disables sequencer
1...Enables sequencer
Page 17
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AS7000 − Detailed Description
Photodiode Selection
In order to have flexible arrangement of the use photodiodes,
PD1-PD4 can be individually connected to the photodiode
amplifier input. The optional offset current allows cancellation
of constant light sources like sunlight. In case of an external
photodiode or any other sensor with (low) current output, the
pins GPIO6 and GPIO7 can be used as input.
Additionally the sequencer can control the diodes – see diode_
ctrl described in register AFE_MAN_SEQ_CFG .
Figure 15:
Photodiode Selection
pdoffx
pd1
pd2
pd3
to TIA
(Trans-Impedance-Amplifier)
pd4
GPIO6
GPIO7
Page 18
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pdi_0
pdi_1
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
AFE_PD_CFG Register (Addr: 0x08)
The AFE_PD_CFG register is used to configure the input to the
photo amplifier.
Figure 16:
AFE_PD_CFG Register
Addr: 0x08
Bit
Bit Name
AFE_PD_CFG
Default
Access
Description
25
sd_hld
0
R/W
SD hold
0 …Output of synchronous demodulator is forced to
SIGREF if not set to +1 or -1
1… Output of synchronous demodulator is tristated if not
set to +1 or -1
23
led4_
supply_low
0
SC_WS (1)
If this bit is cleared, LED4 current sink voltage was below its
compliance voltage
22
led3_
supply_low
0
SC_WS (1)
If this bit is cleared, LED3 current sink voltage was below its
compliance voltage.
21
led2_
supply_low
0
SC_WS (1)
If this bit is cleared, LED2 current sink voltage was below its
compliance voltage.
20
led1_
supply_low
0
SC_WS (1)
If this bit is cleared, LED1 current sink voltage was below its
compliance voltage.
15:8
pdoffx
0x00
R/W
Input offset current
Ioffset = pdoffx*10nA
00000000…Offset source is turned OFF
5
pd4
0
R/W
0 …Photodiode PD4 is disconnected from photo amplifier
1 …Photodiode PD4 is connected to photo amplifier (as
defined in diode_ctrl)
4
pd3
0
R/W
0 …Photodiode PD3 is disconnected from photo amplifier
1 …Photodiode PD3 is connected to photo amplifier (as
defined in diode_ctrl)
3
pd2
0
R/W
0 …Photodiode PD2 is disconnected from photo amplifier
1 …Photodiode PD2 is connected to photo amplifier (as
defined in diode_ctrl)
2
pd1
0
R/W
0 …Photodiode PD1 is disconnected from photo amplifier
1 …Photodiode PD1 is connected to photo amplifier (as
defined in diode_ctrl)
1
pdi_1
0
R/W
0 …GPIO7-input is disconnected from photo amplifier
1 …GPIO7-input is connected to photo amplifier
0
pdi_0
0
R/W
0 …GPIO6-input is disconnected from photo amplifier
1 …GPIO6-input is connected to photo amplifier
Note(s):
1. SC_WS: Self clear, write sets: These registers are reset by the hardware. Set to ‘1’ before using them.
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Photodiode Characteristics
Figure 17:
Photodiode Arrangement
VD1
1mm
PD1
PD3
Sensor
1mm
PD4
PD2
VD2
Note(s):
1. Orientation as in Figure 115 or Figure 3.
Figure 18:
AS7000-AA Photodiode Sensitivity (Solid Black) and LED Emission Spectrum (Dotted Green) – Dual
Green LED Configuration
100%
90%
70%
60%
LED SPD
Response (normalized)
80%
50%
40%
30%
20%
10%
0%
300
400
500
600
700
800
900
1000
1100
Wavelength (nm)
Note(s):
1. Perpendicular light source.
2. LEDs and Filters are shown for Dual Green LED Configuration.
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ams Datasheet
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AS7000 − Detailed Description
Figure 19:
Operating Characteristics of Each Photodiode, VDD=3V, TAMB=25°C (unless otherwise noted)
Symbol
Parameter
Conditions
Re
Irradiance
responsivity
λP=525nm,
4 photodiodes used pd1/2/3/4=1,
gain_g=4x, gain_en=1, pd_ampres=7MΩ
dual green LED configuration filters
Id
Dark current
Ee=0
Ios
Extrapolated
offset current
Min
Typ
Max
Unit
mV/
(μW
/cm2)
76
0
1
nA
−1
1
nA
Note(s):
1. For monochromatic light of 555nm, one lux corresponds to 0.146 μW/cm2. That is, one obtains 6.5 lux per μW/cm2
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Photodiode Trans-Impedance Amplifier (TIA)
The photodiode amplifier can be configured in three different
modes:
• Photocurrent to frequency converter
• Photocurrent to voltage converter
• Photocurrent integrator
Figure 20:
Trans-Impedance-Amplifier (TIA)
pd_ampres
pd_ampcap
from
photodiodes
to synchronous
demodulator
pd_amp_en
man_mode
man_sw_itg
Sequencer
The integration time tINT is defined either by the sequencer
(man_mode=0) of manually through the bit sw_itg if
man_mode=1.
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ams Datasheet
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AS7000 − Detailed Description
Figure 21:
Settings for the Programming of the TIA
pd_ampres
pd12341
pd_ampcap
pd_ampcomp
pd_ampvo
Gain
1
1…4
13
1
15
1V/μA
2
1…4
7
1
15
2V/μA
3
1…4
5
1
15
3V/μA
1…2
2
0
15
5V/μA
3…4
3
1…2
2
0
15
7V/μA
3…4
3
1
1
0
15
10V/μA
2…4
2
1…2
1
0
15
15V/μA
3…4
2
15
7V/μA
4
5
6
7
Low Bandwidth Mode
5
1…4
31
3
Integrating Mode (pd_ampres=0)
0
1…4
10
3
15
1V/pQ
0
1…4
20
3
15
1/2V/pQ
0
1…4
30
3
15
1/3V/pQ
Note(s):
1. pd1234 … number of active photodiodes (for example, pd1=1, pd2=0, pd3=1, pd4=0 -> pd1234=2)
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
AFE_PD_AMPCFG Register (Addr: 0x0c)
The AFE_PD_AMPCFG register is used to configure the
operating mode of the photo-amplifier
Figure 22:
AFE_PD_AMPCFG Register
Addr: 0x0c
AFE_PD_AMPCFG
Bit
Bit Name
Default
Access
Description
31
pd_amp_en
0
R/W
0…Activates power down mode of photo-amplifier
1…Enables photo-amplifier
13:10
pd_amp_vo
15
R/W
Opamp offset. Use ams device drivers – these
automatically configure this register.
9:8
pd_
ampcomp
3
R/W
Opamp compensation. Use ams device drivers – these
automatically configure this register.
7:5
pd_ampres
0x0
R/W
Feedback resistor
000…No resistor in feedback of amplifier
001…1MΩ
010…2MΩ
011…3MΩ
100…5MΩ
101…7MΩ
110…10MΩ
111…15MΩ
4:0
pd_ampcap
0x0
R/W
Feedback capacitor – automatically set by ams device
drivers for modes using pd_ampres not 000b.
Capacitor = pd_ampcap*0.1pF
For registers man_mode and man_sw_itg see AFE_MAN_SEQ_
CFG .
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Voltage Mode of the Photodiode Amplifier
The output voltage of the photodiode amplifier is depending
on the feedback component:
(EQ1)
Feedback resistor: Uout = I photo ⋅ Rfb
(EQ2)
INT
Feedback capacitor: U out = I photo ⋅ ---------
t
C fb
Note(s): The integration time t INT is defined either by the
sequencer (man_mode=0) of manually through the bit sw_itg
if man_mode=1.
For the synchronous demodulator only use the resistive
feedback.
Figure 23:
Difference Between Resistive and Capacitive Feedback
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Optical Front End Operating Modes
Once the photodiode amplifier is configured the measurement
can be done in two different ways. Either the LED-outputs, the
photodiode amplifier and the ADC are controlled manually by
means of register bits, or they are controlled by a built in
sequencer.
Manual Operation of The Optical Frontend:
The optical front end can be manually controlled via the AFE_
MAN_SEQ_CFG register using man_mode=1.
Figure 24:
Manual Operation of the Optical Frontend and LED
pdoffx
pd1
pd_ampres
pd_ampcap
adc_sel=0
pd2
ADC
pd3
pd4
pd_amp_en
Start conversion: seq_en=1
End of conversion: seq_en returns to 0
GPIO6
pdi_0
GPIO7
man_sw_itg
pdi_1
Note(s):
1. Applies only if man_mode=1.
For manual operation of the LEDs and its current sinks see
LED-Driver.
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AS7000 − Detailed Description
Sequencer
In order to synchronize the LED-currents, the integration time
and the ADC-sampling time, a built in sampling Sequencers can
be used. The sequencer generates the 16 bit-timings based on
a 1μs clock. The results of the analog to digital conversion are
automatically stored in a pipeline buffer or in register adc_data.
The timings can be programmed with following registers (apply
for man_mode=0):
Figure 25:
Sequencer Control Registers Overview
Register
Description
seq_div
Divider of the 1μs input clock
seq_count
Number of measurements in one sequence
seq_start
Writing 1 starts the sequencer, 0 stops the sequencer
seq_period
Time of one measurement cycle
seq_led_start
Start time of the LED drivers within one cycle
seq_led_stop
Stop time of the LED drivers within one cycle
seq_itg_start
Start time of the integrator
seq_itg_stop
Stop time of the integrator
seq_sdp_start
Start time of the synchronous demodulator’s positive multiplication
seq_sdp_stop
Stop time of the synchronous demodulator’s positive multiplication
seq_sdm1_start
Start time of the synchronous demodulator’s negative multiplication 1
seq_sdm1_stop
Stop time of the synchronous demodulator’s negative multiplication 1
seq_sdm2_start
Start time of the synchronous demodulator’s negative multiplication 2
seq_sdm2_stop
Stop time of the synchronous demodulator’s negative multiplication 2
seq_adc, seq_adc_fract
Sampling position of the ADC in single steps / in 1/16th steps
seq_adc_inc, seq_adc_inc_fract
Increment of the sampling position of the ADC after each measurement in
single steps / in 1/16th steps
sd_subs
Subsampling ratio between sequencer frequency and ADC sampling
frequency – use for adjusting the ADC sampling frequency at a lower
speed than the sequencer cycle frequency
Note(s):
1. The lowest data value of all registers except seq_count, seq_div, seq_adc_inc, seq_adc_inc_fract and seq_adc_fract is 1.
ams Datasheet
[v1-12] 2018-Feb-26
Page 27
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AS7000 − Detailed Description
Figure 26:
Block Diagram of Sequencer
pdoffx
pd_ampres
pd1
pd_ampcap
Synchronous Demodulator
sd_en
sd_byp
pd2
pdi_0
adc_sel=0
aa_freq
pd_amp_en
reset
sd_bw
200Hz
TIA
ADC
hp_freq hp_byp
hp_en
gain_g gain_byp
gain_en
High Pass Filter
Gain Stage
-1 +1
seq_itg_start
S
SET
Q
R
CL R
S
Q
seq_sdp_stop
clk
VD1 VD2
+1 -1
seq_sdp_start
seq_itg_stop
R
SET
CL R
Q
Q
clk
register
diode_ctrl
seq_sdm1_start
S
seq_sdm1_stop
VD4 VD3
sample
pdi_1
adc_sel=1
GPIO7 GPIO6
pd4
adc_data
*
pd3
R
SET
CL R
Q
Q
clk
led_x_mode
x=1...4
seq_sdm2_start
S
seq_sdm2_stop
seq_led_start
S
seq_led_stop
R
SET
CL R
Q
R
SET
CL R
Q
Q
clk
Synchronous Demodulator control
Q
clk
seq_adc_frac_inc
seq_adc_frac
+
sd_subs
z-1
clk
init
+
z
init clk*16
seq_div
1µs
Sequencer
Page 28
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div
div
-1
Counter
0...seq_period-1
ADC control
Run / Stop
Logic
Run/Reset
clk
read status
seq_adc_inc
seq_adc
seq_count
cycles
seq_start
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Sequencer Registers
For registers man_mode, man_sw_sdmult, man_sw_sdpol,
man_sw_itg, man_sw_led4, man_sw_led3, man_sw_led2,
man_sw_led1, diode_ctrl, dma_disable, led4_mode, led3_
mode, led2_mode and led1_mode,seq_en
see AFE_MAN_SEQ_CFG .
For register sd_subs see AFE_SC_CFG .
AFE_SEQ_DIV_CNT Register (Addr: 0x24)
The AFE_SEQ_DIV_CNT register sets the input divider for the
main clock.
Figure 27:
AFE_SEQ_DIV_CNT Register
Addr: 0x24
Bit
Bit Name
AFE_SEQ_DIV_CNT
Default
Access
Description
Divider value; Sequencer time increment
23:8
seq_div
0x0000
R/W
7:0
seq_count
0x00
R/W
tclk = (seq_div + 1) * 1μs
Number of measurements in one sequence.
IF seq_count = 0x00 the sequencer is running
continuously.
AFE_SEQ_START Register (Addr: 0x28)
In AFE_SEQ_START register the configured sequencer can be
started.
Figure 28:
AFE_SEQ_START Register
Addr: 0x28
Bit
0
Bit Name
seq_start
ams Datasheet
[v1-12] 2018-Feb-26
AFE_SEQ_START
Default
0
Access
Description
R/W
1…Starts the sequencer. Sequencer is running according
to the configurations in the sequencer registers
Writing 0 stops the sequencer(s). In manual mode, writing
1 starts one ADC conversion. Reading returns 1 if the
sequencer is running (sequencer mode), respectively if
the ADC is converting (manual mode) and it returns to 0
once the ADC has finished its conversion
Page 29
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AS7000 − Detailed Description
AFE_SEQ_PER Register (Addr: 0x2C)
The AFE_SEQ_PER register sets one measurement cycle of the
sequencer.
Figure 29:
AFE_SEQ_PER Register
Addr: 0x2C
AFE_SEQ_PER
Bit
Bit Name
Default
Access
15:0
seq_period
0x0000
R/W
Description
Sequencer period
T = seq_period * seq_div * 1μs
AFE_SEQ_LED Register (Addr: 0x30)
The AFE_SEQ_LED register sets the LED drive timing. Data is
stored as 16-bit value
Figure 30:
AFE_SEQ_LED Register
Addr: 0x30
AFE_SEQ_LED
Bit
Bit Name
Default
Access
Description
31:16
seq_led_start
0x0000
R/W
LED start time; the LED starts one cycle later to allow the
analog biasing to settle before the current is enabled.
15:0
seq_led_stop
0x0000
R/W
LED stop time
AFE_SEQ_ITG Register (Addr: 0x34)
The AFE_SEQ_ITG register sets the photoamplifier integration
time if using capacitive feedback respectively removes the
short of the resistive feedback. Data is stored as 16-bit value
Figure 31:
AFE_SEQ_ITG Register
Addr: 0x34
Bit
Bit Name
AFE_SEQ_ITG
Default
Access
Description
31:16
seq_itg_start
0x0001
R/W
Integrator start time
(start time=1 and stop time=0 means that it's - by default always ON) Turning OFF the integrator actually means
discharge the capacitor for capacitive integration mode,
without the synchronous demodulator.
15:0
seq_itg_stop
0x0000
R/W
Integrator stop time
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AS7000 − Detailed Description
AFE_SEQ_SDP Register (Addr: 0x38)
The AFE_SEQ_SDP register sets the synchronous demodulator
positive multiplication time. Data is stored as 16-bit value
Figure 32:
AFE_SEQ_SDP Register
Addr: 0x38
AFE_SEQ_SDP
Bit
Bit Name
Default
Access
Description
31:16
seq_sdp_start
0x0000
R/W
Positive multiplication start time
15:0
seq_sdp_stop
0x0000
R/W
Positive multiplication stop time
AFE_SEQ_SDM1 Register (Addr: 0x3C)
The AFE_SEQ_SDM1 register sets the synchronous
demodulator negative multiplication time 1. Data is stored as
16-bit value
Figure 33:
AFE_SEQ_SDM1 Register
Addr: 0x3C
AFE_SEQ_SDM1
Bit
Bit Name
Default
Access
Description
31:16
seq_sdm1_start
0x0000
R/W
Negative multiplication start time 1
15:0
seq_sdm1_stop
0x0000
R/W
Negative multiplication stop time 1
AFE_SEQ_SDM2 Register (Addr: 0x40)
The AFE_SEQ_SDM2 register sets the synchronous
demodulator negative multiplication time 2. Data is stored as
16-bit value
Figure 34:
AFE_SEQ_SDM2 Register
Addr: 0x40
AFE_SEQ_SDM2
Bit
Bit Name
Default
Access
31:16
seq_sdm2_start
0x0000
R/W
Negative multiplication start time 2
15:0
seq_sdm2_stop
0x0000
R/W
Negative multiplication stop time 2
ams Datasheet
[v1-12] 2018-Feb-26
Description
Page 31
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AS7000 − Detailed Description
AFE_SEQ_ADC Register (Addr: 0x44)
The AFE_SEQ_ADC register defines the time when the ADC
starts sampling during each measurement cycle. The fraction
setting permits a definition of the sampling point as a 1/16
fraction of a sequencer cycle. If seq_div=0 (1us sequencer
clock), then one unit is equivalent to 62.5ns. If, e.g. seq_div=4
(5us) then the resolution of the fract register is
62.5ns*5=312.5ns
Figure 35:
AFE_SEQ_ADC Register
Addr: 0x44
AFE_SEQ_ADC
Bit
Bit Name
Default
Access
Description
31:28
seq_adc_inc_fract
0x0
R/W
ADC delay increment :
seq_adc_inc_fract/16 fractional
27:24
seq_adc_fract
0x0
R/W
ADC start delay:
seq_adc_fract/16 fractional
23:16
seq_adc_inc
0x00
R/W
ADC increment to the adc sample time after each
conversion.
15:0
seq_adc
0x0000
R/W
ADC Sampling time; changes of this register have
no effect as long as the sequencer is running (seq_
en=1).
AFE_SEQ_COUNTER Register (Addr: 0x80)
The AFE_SEQ_COUNTER register shows the counter value of the
sequence counter and period counter
Figure 36:
AFE_SEQ_COUNTER Register
Addr: 0x80
AFE_SEQ_COUNTER
Bit
Bit Name
Default
Access
31:24
subs_counter
0x00
R
Current subsampling counter value
23:16
sequence_counter
0x00
R
Current sequence counter value
15:0
cycle_counter
0x0000
R
Current cycle counter value
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Description
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
AFE_ADC_COUNTER Register (Addr: 0x84)
The AFE_ADC_COUNTER register shows the current value of the
ADC counter
Figure 37:
AFE_ADC_COUNTER Register
Addr: 0x84
AFE_ADC_COUNTER
Bit
Bit Name
Default
Access
7:0
adc_counter
0x00
R
Description
Current ADC counter value
Example Sequencer Configurations
Used adc_clock = 0 and adc_highres=0 for the examples to
shorten the ADC settling time. As seq_div = 1 and seq_
period=40, one sequence is 80μs.
Example 1
Making 4 measurements with LED1 only.
Integration time is 20 cycles. LED is turned on 10 cycles before
integration starts to avoid current bouncing errors.
Figure 38:
Sequencer Example 1
seq_
period
seq_
div
seq_
count
seq_
led_
start
seq_
led_
stop
seq_
itg_
start
seq_
itg_
stop
seq_
adc
seq_
adc_inc
led1_
mode
led2_
mode
40
1
4
10
40
20
40
39
0
2
0
Figure 39:
Sequencer Example 1 Waveform
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Example 2
Making 4 measurements with LED2 only.
Integration time is 20 cycles. LED is turned ON 10 cycles before
integration starts to avoid current bouncing errors.
Figure 40:
Sequencer Example 2
seq_
period
seq_
div
seq_
count
seq_
led_
start
seq_
led_
stop
seq_
itg_
start
seq_
itg_
stop
seq_
adc
seq_
adc_inc
led1_
mode
led2_
mode
40
1
4
10
40
20
40
39
0
0
2
Figure 41:
Sequencer Example 2 Waveform
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[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Example 3
Making 4 measurements, switching between LED1 and LED2.
Integration time is 20 cycles. LED is turned ON 10 cycles before
integration starts to avoid current bouncing errors.
Figure 42:
Sequencer Example 3
seq_
period
seq_
div
seq_
count
seq_
led_
start
seq_
led_
stop
seq_
itg_
start
seq_
itg_
stop
seq_
adc
seq_
adc_inc
led1_
mode
led2_
mode
40
1
4
10
40
20
40
39
0
3
4
Figure 43:
Sequencer Example 3 Waveform
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Example 4
Making 4 measurements, switching LED1 and LED2
simultaneously.
Integration time is 20 cycles. LED is turned ON 10 cycles before
integration starts to avoid current bouncing errors.
Figure 44:
Sequencer Example 4
seq_
period
seq_
div
seq_
count
seq_
led_
start
seq_
led_
stop
seq_
itg_
start
seq_
itg_
stop
seq_
adc
seq_
adc_inc
led1_
mode
led2_
mode
40
1
4
10
40
20
40
39
0
2
2
Figure 45:
Sequencer Example 4 Waveform
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AS7000 − Detailed Description
Example 5
Making 4 measurements with LED1 only and subsampling.
Integration time is 20 cycles. LED is turned ON 10 cycles before
integration starts to avoid current bouncing errors. ADC
sampling starts 5 cycles delayed every measurement.
Figure 46:
Sequencer Example 5
seq_
period
seq_
div
seq_
count
seq_
led_
start
seq_
led_
stop
seq_
itg_
start
seq_
itg_
stop
seq_
adc
seq_
adc_inc
led1_
mode
led2_
mode
40
1
4
10
40
20
40
25
4
2
0
Figure 47:
Sequencer Example 5 Waveform
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Example 6
Making 4 measurements with LED1 only and subsampling.
Integration time is 20 cycles. LED is turned OFF 10 cycles before
integration starts to measure fluorescent response of a sensor.
ADC sampling starts 5 cycles delayed every measurement.
Figure 48:
Sequencer Example 6
seq_
period
seq_
div
seq_
count
seq_
led_
start
seq_
led_
stop
seq_
itg_
start
seq_
itg_
stop
seq_
adc
seq_
adc_inc
led1_
mode
led2_
mode
40
1
4
10
19
20
40
25
4
2
0
Figure 49:
Sequencer Example 6 Waveform
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[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Example 7
Making 8 measurements with LED1 only. Reduced cycle time to
40μs.
Integration time is 5 cycles. LED is turned ON 5 cycles before
integration starts to avoid current bouncing errors.
Figure 50:
Sequencer Example 7
seq_
period
seq_
div
seq_
count
seq_
led_
start
seq_
led_
stop
seq_
itg_
start
seq_
itg_
stop
seq_
adc
seq_
adc_inc
led1_
mode
led2_
mode
20
1
8
10
20
15
20
19
0
2
0
Figure 51:
Sequencer Example 7 Waveform
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Optical Signal Conditioning
Synchronous Demodulator
High Pass Filter
sd_en
adc_sel=0
Figure 52:
Optical Signal Conditioning
Gain Stage
sd_byp
ADC
aa_freq
sd_bw
200Hz
hp_freq hp_byp
hp_en
Sequencer
gain_g gain_byp
gain_en
adc_sel=1
*
from TIA
Synchronous Demodulator
An optional synchronous demodulator can be used to detect
small optical signals in the presence of large unwanted noise
(ambient light). Since the detector synchronizes to the LED
frequency, the demodulator can only be used of the
measurement sequencer is running.
It includes input filer (high pass at 200Hz, adjustable low pass)
and an 2nd order adjustable output low pass. The demodulator
itself multiplies the signal by +1 / 0 / -1 with a timing which is
controlled by the sequencer.
Note(s): The optical signal conditioning stage need sigref_
en=1 for operation.
High Pass Filter
An optional high pass filter can be used to remove unwanted
DC-components from the signal and allows further
amplification. In order to guarantee fast settling times of the
filter, four cutoff frequencies can be chosen.
Gain Stage
An optional gain stage can be used to amplify the signal after
the DC-component has been removed.
Page 40
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Optical Signal Conditioning Registers
Register bit sigref_en see register AFE_LED_CFG.
Figure 53:
AFE_SC_CFG
0x70: AFE_SC_CFG
Field
Name
Rst
Type
Description
26
sd_pol_init
0
RW
The low level driver shall ensure that this register is 0 if one
of the seq_sdm pulses is first, and is 1 if the seq_sdp is first
within a sequence.
Anti-aliasing filter cut-off frequency
25:24
20:13
aa_freq
sd_subs
0
0
Setting
Signal
0
10kHz
1
20kHz
2
40kHz
3
60kHz
RW
RW
Synchronous demodulator subsampling ratio between
sequencer frequency and ADC sampling frequency.
ADC-Fsample = Sequencyer_Frequency/(sd_subs+1)
When setting to 0, then in every sequencer iteration the
ADC will run.
When setting to 1, then the first sequencer iteration will
not trigger the ADC, but the second one will.
Setting to N will make N iterations without ADC, followed
by one iteration with the ADC measurement executed.
It is recommended to use the ADC interrupt in this case
and not the sequencer interrupt.
Synchronous demodulator low pass filter.
12:11
sd_bw
0
Setting
Frequency
0
10Hz
1
20Hz
2
40Hz
3
80Hz
RW
10
hp_en
0
RW
0...Power down of the high pass filter
1...Enable high pass filter
9
hp_byp
0
RW
0...HP filter is used
1...HP filter is bypassed
ams Datasheet
[v1-12] 2018-Feb-26
Page 41
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AS7000 − Detailed Description
0x70: AFE_SC_CFG
Field
Name
Rst
Type
Description
High pass filter cutoff frequency
8:7
hp_freq
0
Setting
Cutoff frequency
0
0.33Hz
1
1.32Hz
2
5.28Hz
3
10.56Hz
RW
6
sd_en
0
RW
0...Power down of the synchronous demodulator
1...Enable synchronous demodulator
5
sd_byp
0
RW
0...Synchronous demodulator is used
1...Synchronous demodulator is bypassed
4
gain_en
0
RW
0...Power down of the Gain stage 1...Enable Gain stage
3
gain_byp
0
RW
0...Gain stage is used
1...Gain stage is bypassed
Gain
2:0
gain_g
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0
Setting
Gain
0
1
1
2
2
4
3
8
4
16
5
32
6
64
7
don‘t use
RW
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Sync Demodulator Example
LED1 and LED2 should be modulated with 2kHz
Demodulated signal should be sampled with 20Hz for 1 second.
Calculation of sequencer values:
1. Modulation Frequency = 2kHz. Period = 500us.
2. Set sequencer period to 250us.
-> seq_div=0, seq_period=500
3. Operation of LEDs between 0us and 100us (depends on
LED and Amp-settings)
-> seq_led_start=1, seq_led_stop=100
4. Operation of photo-amplifier and synchronous
demodulator multipl. by +1 between 50us and 100us
-> seq_sdp_start=50, seq_sdp_stop=100
5. Operation of photo-amplifier and synchronous
demodulator multipl. by -1 between 300us and 350us
-> seq_sdm1_start=300, seq_sdm1_stop=350
6. Sampling position at 495us + settling
-> seq_adc=490
7. ADC should only sample at 20Hz (50ms). This means
sampling at every 50ms/500us = 100th sequencer run.
sd_subs=100
8. ADC values should be stored for 1 second. This means
1s/50ms = 20 samples must be stored.
->seq_count=20
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Figure 54:
Sync Demodulator Example Detail
Page 44
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Figure 55:
Sync Demodulator Example
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Electrical Analog Front End
The electrical analog front end consists of three identical signal
paths with independent settings of bias condition, gain and
offset.
Figure 56:
Electrical Analog Front End Internal Circuit
SIGREF
1.9V
dac_value
1
DAC
opamp & DAC enabled
automatically
0
sigref_on_dac_buf
160kΩ
T-gates:
250Ω
1
2
3
4
5
1
2
3
4
5
0
0
gpio_r_bias
0
gpio_bias_current
gpio_i_bias
00b … off
01b … 10µ A
10b … 100µA
11b … 1mA gpio_dac
T-gates:
10kΩ
1
2
3
4
5
VDD
1
2
3
4
5
GPIO4
GPIO5
GPIO6
GPIO1
GPIO0
measure_dac
gpio_gst_in
0
T-gates:
50kΩ
on
adc_sel=2
gpio_gst_in
measure_dac
Vref=1.6V
ADC
50kΩ
128kΩ
AGND
SIGREF
don’t
use
0
1
2
3
gst_ref
gst_gain
AGND
0 … 1x
1 … 2x
2 … 4x
3 … 8x
4 … 16x
5 … 32x
6 … 64x
7 … don’t use
Note(s):
1. Resistor / T-gates resistance values are given as indication – do not rely on absolute values
Input Pins
Five general purpose pins can be used either as configurable
GPIO for the processor or as analog input pins for the electrical
analog front end. The analog inputs can be configured to setup
different amplifier topologies.
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
AFE Registers
Figure 57:
AFE_LED_CFG
0x00: AFE_LED_CFG
Field
Name
Rst
Type
18
sigref_en
0
RW
Description
Signal reference: Is required for all analog blocks
0...Disable signal reference
1...Enable signal reference
Figure 58:
AFE_EAF
0x90: AFE_EAF
Field
Name
Rst
Type
Description
25
sigref_on_dac_
buf
0
RW
If asserted, connect SIGREF to DAC buffer.
24
measure_dac
0
RW
If this bit is asserted, the DAC output is connected to the
gain stage input (independent of gpio_gst_in selection,
therefore the DAC output is measureable on the GPIO pin)
DAC on GPIO
18:16
gpio_dac
ams Datasheet
[v1-12] 2018-Feb-26
0
Setting
Meaning
0
No DAC biasing
1
DAC on GPIO4
2
DAC on GPIO5
3
DAC on GPIO6
4
DAC on GPIO1
5
DAC on GPIO0
RW
Page 47
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AS7000 − Detailed Description
0x90: AFE_EAF
Field
Name
Rst
Type
Description
Resistive biasing
15:13
gpio_r_bias
0
Setting
Meaning
0
No resistive biasing
1
Resistive biasing on GPIO4
2
Resistive biasing on GPIO5
3
Resistive biasing on GPIO6
4
Resistive biasing on GPIO1
5
Resistive biasing on GPIO0
RW
Current biasing
12:10
gpio_i_bias
0
Setting
Meaning
0
No current biasing
1
Current biasing on GPIO4
2
Current biasing on GPIO5
3
Current biasing on GPIO6
4
Current biasing on GPIO1
5
Current biasing on GPIO0
RW
Current setting of gpio current bias
9:8
gpio_bias_
current
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0
Setting
Current
0
OFF
1
10μA
2
100μA
3
1mA
RW
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
0x90: AFE_EAF
Field
Name
Rst
Type
Description
Gain stage input selection
7:5
gpio_gst_in
0
Setting
Meaning
0
Not connected
1
GPIO4
2
GPIO5
3
GPIO6
4
GPIO1
5
GPIO0
RW
Gain stage reference voltage
4:3
gst_ref
0
Setting
Meaning
0
AGND
1
DAC buffer
2
SIGREF
3
Reserved – do not use
RW
Gain stage gain
2:0
gst_gain
ams Datasheet
[v1-12] 2018-Feb-26
0
Setting
Meaning
0
1
1
2
2
4
3
8
4
16
5
32
6
64
7
Reserved – do not use
RW
Page 49
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AS7000 − Detailed Description
The AFE_EAF register is used to configure the electrical
frontend
Figure 59:
AFE_EAF_DAC
0x94: AFE_EAF_DAC
Field
Name
Rst
Type
9:0
dac_value
0
RW
Description
DAC value (10 bit)
0x000 … 0V
0x1FF … 1.9V
The AFE_EAF_DAC register is used to configure the dac value
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Possible Configurations of Every Amplifier Stage
Figure 60:
Non Inverting Amplifier With Offset and Input Voltage
Divider (Temperature Sensor)
Figure 61:
Non Inverting Amplifier With Current Source and Offset
(Temperature Sensor)
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
Figure 62:
Non Inverting Amplifier With Current Source and Reference
Path (Temperature Sensor)
Figure 63:
Non Inverting Amplifier High Impedance, GND Referenced
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Figure 64:
Non Inverting Amplifier With DC-Blocking, Referenced to
V_ADCRef/2
Figure 65:
Non Inverting Amplifier With DC-Blocking and Fast Settling
Time, Referenced to ADCRef /2
ams Datasheet
[v1-12] 2018-Feb-26
Page 53
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AS7000 − Detailed Description
ADC
The ADC is a 14bit successive-approximation register (SAR)
type. It supports 12 bit with very fast conversion time up to
1Msps and 14bit with moderate conversion time up to 250ksps.
The ADC is started by the sequencer and its timing or in manual
mode (man_mode=1) by setting seq_start=1 (seq_start stays
‘1’ as long as the conversion runs). The AS7000 can be
configured to trigger an interrupt upon end of conversion.
Figure 66:
ADC Internal Circuit and Multiplexer
V_LDO
LDO
CPU
enable
VDD
POR
R
gpio7_wakeup_en
GPIO8
GPIO7
Q
sleep_timer
S
For best accuracy the ADC needs to recalibrate itself – use ams
SDK to initiate the calibration procedure.
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Figure 67:
Operating Characteristics of the ADC, VDD=3V, TAMB=25°C (unless otherwise noted)
Symbol
Vref
TCvref
Parameter
Conditions
Min
Typ
Max
Unit
Reference voltage V_ADCRef
1.6
V
Reference voltage temperature
coefficient
±50
ppm/°C
Resolution
adc_clock ≤ 1MHz
Otherwise
14
12
Bit
INL
Relative accuracy
-8
8
LSB
DNL
Differential nonlinearity
±2
LSB
Offset error
±8
LSB
Gain error
±8
LSB
SNR
Signal-to-noise ratio
Fsample = 1kHz,
Fsignal=100Hz
80
dB
THD
Total harmonic distortion
Fsample = 1kHz,
Fsignal=100Hz
-70
dB
Conversion rate
12 bit resolution
Tconv
Vin
Input voltage range
1
0
μs
Vref
V
Figure 68:
ADC Output Codes (12 Bit Resolution Setting Range)
ADC Output Codes:
For 14 bit resolution the output data
range is 0 to 16383, one LSB represents
Vref/16384.
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
ADC Registers
Figure 69:
AFE_ADC_DATA
0x88: AFE_ADC_DATA
Field
Name
Rst
Type
13:0
adc_data
0
RO
Description
Current ADC output signals
The ADC_DATA register shows the current raw output of the
ADC.
Figure 70:
AFE_ADC_CFG
0xa4: AFE_ADC_CFG
Field
21
20
Name
adc_selfpd
adc_discharge
Page 56
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Rst
1
1
Type
Description
RW
1…Power down ADC when not converting; use this to
conserve power, but set adc_settling_time to minimum
64μs to permit settling of the ADC reference buffer.
0 … Always enabled ADC
RW
0…Suppress ADC capacitor discharging
1…Discharge ADC capacitor before tracking
If asserted, the capacitor is discharged before the tracking
phase. If zero, the discharge phase is suppressed and the
tracking phase is started one cycle earlier.
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
0xa4: AFE_ADC_CFG
Field
Name
Rst
Type
Description
ADC settling time: Do not use in interleaved mode. It
defines the number of ADC clock cycles the sampling
window is kept open additionally to its 4 ADC clock cycles.
If the gain stage in the optical frontend is used (gain_
byp=0), set this to minimum 8μs. If adc_selfpd=1, set this
to minimum 64μs and set adc_discharge=1.
19:17
adc_settling_
time
5
RW
Setting
Periods
μs
(@4MHz)
μs
(@2MHz)
μs
(@1MHz)
0
0
0
0
0
1
4
1
2
4
2
8
2
4
8
3
16
4
8
16
4
32
8
16
32
5
64
16
32
64
6
128
32
64
128
7
256
64
128
256
If adc_discharge=0 and adc_selfpd=0 and the TIA is
connected directly to the ADC using following minimum
settling times:
ams Datasheet
[v1-12] 2018-Feb-26
pd_ampres
minimum adc_settling_time
1MΩ
1μs
2MΩ-7MΩ
2μs
10MΩ-15MΩ
3μs
Page 57
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AS7000 − Detailed Description
0xa4: AFE_ADC_CFG
Field
Name
Rst
Type
Description
ADC clock divider: The ADC clock is freely configurable.
Note that values other than 4MHz, 2MHz, 1MHz and
500kHz will make the resulting timing very confusing for
the human observer.
15:12
adc_clock
7
RW
Setting
Periods
ns
kHz
0
2
125
8000
1
4
250
4000
2
6
375
2666
3
8
500
2000
4
10
625
1600
5
12
750
1333
6
14
875
1142
7
16
1000
1000
8
18
1125
888
9
20
1250
800
10
22
1375
727
11
24
1500
666
12
26
1625
615
13
28
1750
571
14
30
1875
533
15
32
2000
500
11
adc_calibration
0
RW
To activate self calibration, this bit must be asserted, and
an ADC “conversion” has to be started in manual mode
(man_mode=1) by asserting seq_start. It is suggested to
let the CPU sleep and wait for the ADC interrupt. Also, a
slow ADC clock should be used.
10
adc_interleave
0
RW
Interleave mode
RW
0...Reset ADC
1...Enable ADC
Warning: In reset state the ADC clears its calibration data.
Re-calibration is necessary next time it is enabled again.
9
adc_en
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
0xa4: AFE_ADC_CFG
Field
Name
Rst
Type
Description
ADC Input Select
0… Trans impedance amplifier – see Figure 8
1… Optical frontend – see Figure 8
8:6
adc_sel
0
RW
2… Electrical front end – see Figure 56
3… Do not use
4… Do not use
5… Temperature sensor (diode with approx. -2mV/K)
6… Do not use
7… Do not use
ADC resolution depending on the Sampling speed
4
adc_highres
1
Setting
Selection
0
12 bit
1
14 bit
RW
Defines number of samples that are taken in multimode
(adc_multimode =1)
3:1
adc_multi_n
ams Datasheet
[v1-12] 2018-Feb-26
0
RW
Setting
Sample Period
0
2
1
4
2
8
3
16
4
32
5
48
6
64
7
96
Page 59
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AS7000 − Detailed Description
0xa4: AFE_ADC_CFG
Field
0
Name
adc_multimode
Page 60
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Rst
0
Type
Description
RW
0...If ADC is started one sample is measured
1...If ADC is started multiple samples are measured with
"adc_multi_fs" interval and stored to memory by the DMA
controller. The number of samples is defined with adc_
multi_n.
In interleaved mode, the sampling time is 4x higher than in
non-interleave mode.
In non-interleave mode, if adc_multimode=0, only 1
sample is taken.
In interleave mode, if adc_multimode=0, then ADC
conversions are executed until the end of the sequencer
period.
If adc_multimode=1, then adc_multi_n is always taken
into account.
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Power Management and Operating Modes
After the supply (VDD) is asserted the AS7000 automatically
starts up. It is up to the application software into which
operating mode the AS7000 is changed (e.g. to power down
mode).
The AS7000 can operate in following modes:
Figure 71:
AS7000 Operating Modes
Mode
Internal
LDO (V_
LDO)
512Hz
Oscillator
16MHz
Oscillator
CPU
Wake Up CPU to
Active Mode By
Entered By
Active
Running
-
-
Sleep
mode
Idle
Any interrupt
(any timer, GPIO)
__WFI()
command of
CPU
512Hz sleep_counter,
GPIO7(1) and GPIO8(2)
Use ams SDK
for entering
deep sleep
GPIO7(1) and GPIO8(3)
enter_
powerdown=
1
Deep
sleep
mode
= reset;
registers
keep
content
Power
down
= reset;
registers
are reset
Note(s):
1. Wakeup by GPIO7=high if gpio7_wakeup_en=1; applies for power down and deep sleep mode.
2. Wakeup by GPIO8=low if gpio8_wakeup_en=1.
3. In power down mode the AS7000 will always wakeup if GPIO8=low independent of previous setting of gpio8_wakeup_en.
ams Datasheet
[v1-12] 2018-Feb-26
Page 61
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AS7000 − Detailed Description
For operation of the sequencer the 16MHz oscillator is required,
therefore the sequencer only operates in active or wait for
interrupt mode.
Clock Control Unit (CCU) for Peripheral Blocks
All peripheral block have a reset bit and a clock enable bit. The
purpose of these register bits is to disable clock to them when
they are not used and therefore reduce power consumption.
Note(s): Access to the register is not possible if the clock to the
peripheral is disabled or reset is asserted.
e.g. to access any register of AFE (like optical analog front end)
set the register bits afe_resetn=1 and afe_enable=1.
Wake-Up From Power Down Mode
Figure 72:
Wake-Up Logic From Power Down Mode
V_LDO
LDO
CPU
enable
VDD
POR
R
gpio7_wakeup_en
GPIO8
GPIO7
Page 62
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Q
sleep_timer
S
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Power Management And Operating Modes Registers
In order to operate the different blocks inside the AS7000, the
block has to be enabled (e.g. gpio_enable=1) and the reset
de-asserted (e.g. gpio_resetn=1).
Figure 73:
CCU_DEVICEID
0x00: CCU_DEVICEID
Field
Name
Rst
Type
Description
31:16
device_id
0
RO
Reads back 0x1b58 (decimal 7000) ("AS7000")
3:0
revision
0
RO
Reads back the silicon revision
Figure 74:
CCU_GPIO
0x20: CCU_GPIO
Field
Name
Rst
Type
Description
0
gpio_resetn
0
RW
0=reset 1=running
1
gpio_enable
0
RW
0=clock OFF 1=clock ON
Figure 75:
CCU_I2CM
0x2c: CCU_I2CM
Field
Name
Rst
Type
0
i2cm_resetn
0
RW
0=reset 1=running
1
i2cm_enable
0
RW
0=clock OFF 1=clock ON
ams Datasheet
[v1-12] 2018-Feb-26
Description
Page 63
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AS7000 − Detailed Description
Figure 76:
CCU_I2CS
0x30: CCU_I2CS
Field
Name
Rst
Type
Description
0
i2cs_resetn
0
RW
0=reset 1=running
1
i2cs_enable
0
RW
0=clock OFF 1=clock ON
Figure 77:
CCU_UART
0x34: CCU_UART
Field
Name
Rst
Type
Description
0
uart_resetn
0
RW
0=reset 1=running
1
uart_enable
0
RW
0=clock OFF 1=clock ON
Figure 78:
CCU_TMR
0x38: CCU_TMR
Field
Name
Rst
Type
Description
0
tmr_resetn
0
RW
0=reset 1=running
1
tmr_enable
0
RW
0=clock OFF 1=clock ON
Figure 79:
CCU_AFE
0x3c: CCU_AFE
Field
Name
Rst
Type
0
afe_resetn
0
RW
0=reset 1=running
1
afe_enable
0
RW
0=clock OFF 1=clock ON
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Description
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Figure 80:
CCU_WD_CTRL
0x40: CCU_WD_CTRL
Field
Name
Rst
Type
Description
0
wd_en
0
RW
Enable watchdog timer
1
wd_irq_msk
0
RW
If 1, pass wd_irq to system NMI input
2
wd_reset_msk
0
RW
If 1, then reset system in case of wd_reset
Figure 81:
CCU_WD_STATUS
0x44: CCU_WD_STATUS
Field
Name
Rst
Type
Description
0
wd_irq
0
SS_WC
Watchdog timer has reached interrupt level
1
wd_reset
0
SS_WC
Watchdog has reached zero
2
wd_irq_intr
0
RO
NMI is currently asserted by watchdog
Figure 82:
CCU_WD_VAL
0x48: CCU_WD_VAL
Field
Name
Rst
Type
23:0
wd_value
0
R_PUSH
Description
Reload the watchdog counter with this value. The
watchdog counter counts down, and it triggers a system
reset as soon as it reaches zero.
Figure 83:
CCU_WD_IRQVAL
0x4c: CCU_WD_IRQVAL
Field
Name
Rst
Type
23:0
wd_irq_value
0
RW
ams Datasheet
[v1-12] 2018-Feb-26
Description
If the watchdog counter reached this value, it will trigger
an NMI as an early warning, if wd_irq_msk is set.
Page 65
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AS7000 − Detailed Description
Figure 84:
CCU_LP_CFG
0x60: CCU_LP_CFG
Field
Name
Rst
Type
Description
15:0
sleep_counter
0
RW
When going into low power sleep, this the sleep counter
start value in slow clock ticks. As soon as it reaches zero,
the CPU will wake up (if the register was written with a non
zero value)
16
gpio7_wakeup_
en
0
RW
If asserted, setting GPIO7 to high can wake up the chip as
well (from both sleep and powerdown)
17
gpio8_wakeup_
en
0
RW
If asserted, setting GPIO8 to low can wake up the chip from
deep sleep (GPIO8=low always wakes up from
powerdown)
The CCU_LP registers controls the low power modes
Figure 85:
CCU_LP_CTRL
0x64: CCU_LP_CTRL
Field
Name
Rst
Type
Description
0
enter_sleep
0
W
Writing a 1 here makes the system enter deep sleep mode
(wakeup by counter reaching zero) (1)
1
enter_
powerdown
0
W
Writing a 1 here makes the system enter power down
mode (wakeup by GPIO)
Note(s):
1. Only use ams SDK to enter deep sleep mode, do not set bit directly.
Page 66
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
MCU
The MCU is a 32-bit ARM Cortex-M0-based RISC processor with
32kB of EEPROM memory and 4kB of RAM data memory. Details
of the core processor can be found under
infocenter.arm.com.
The MCU offers the following features:
• System:
• ARM Cortex M0 processor with single cycle 32 bit
multiplication instruction
• System tick timer
• Hardware protection to disable the read or read/write
of the internal EEPROM and SRAM
• Unique ID for every device delivered
• Memory:
• 32kByte EEPROM memory
• 4kByte RAM
• Peripherals:
• 9 general-purpose (GPIO) pins with configurable
output structure
• UART
• I²C Master
• I²C Slave
• 14 bit ADC
• Watchdog timer
• 2 general purpose 16 bit timer
• Clock:
• Internal 16MHz RC oscillator
• Internal 512Hz watchdog oscillator and timer
• Debug:
• Serial wire Debug
• Power control:
• Reduced power modes Sleep, Stop
• Power ON reset
ams Datasheet
[v1-12] 2018-Feb-26
Page 67
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AS7000 − Detailed Description
Figure 86:
CPU Internal Block Diagram
Clock generation
Power control
Reset
RTC
EEPROM
SRAM
ARM
Cortex-M0
32-bit RISC
AHB - APB Bridge
Debug interface
SWD
MUX
GPIO
ADC
SCL
I2C Master
2x 16 bit Timer
SDA
SCL
I2C Slave
WDT
GPIO0/8
SDA
TxD
UART
Optical/electrical
Front end
RxD
SWD
ams delivers a SDK (Software Development Kit) for easy access
of the internal digital and analog blocks. The SDK includes
detailed documentation of the hardware (like I²C, UART) and
includes low level drivers.
For accessing of the peripheral registers, a base address needs
to added. The base address depends on the block used (see also
ams provided SDK – software development kit).
Base Address
Page 68
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Function
0x40000000
CCU: Chip control unit
0x40010000
GPIO
0x40040000
I2CM: I2C Master
0x40050000
I2CS: I2C Slave
0x40060000
UART
0x40070000
Timers
0x40080000
AFE: Analog frontend controller
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Debug – SWD
Figure 87:
Program/Debug
Optical barrier
GPIO 0
GPIO 1
GPIO 2
GPIO 3
GPIO 4
VDD
VDD
V_LDO
GND
VD4
GPIO8
GPIO7
GPIO6
GPIO5
M0 CPU
+ RAM/
EEPROM
& Interfaces
LDO
Ref
SIGREF
AGND
VD2
VD3
AS7000
ON=0,off by software
10kΩ
Serial
SWCLK
SWDIO Wire
Debug
Press on
startup for
debug
s
VD1
ac
tiv
a te
LED
Supply
10Ω
LED
Supply
Note(s):
1. Press debug button on power-up (VDD ON).
During power up of the AS7000 the device checks if the pin
SIGREF is shorted to GND (e.g. by a resistance of 10Ω) – see
Figure 87. If this condition is detected and the security bit is not
set, a monitor mode is entered.
In this monitor mode the AS7000 waits 5s where a debugger
can be connected. If the 10s expires without a debugger
connected, the AS7000 continues startup.
If a debugger is connected, the debugger can control AS7000
as required.
Note(s): If the security bit is set inside the EEPROM the
debugger is bypassed even if SIGREF is shorted to GND upon
startup.
ams Datasheet
[v1-12] 2018-Feb-26
Page 69
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AS7000 − Detailed Description
GPIO Pins and Output Switch Matrix
A flexible output switch matrix allows dynamic assignment of
the internal digital blocks to the GPIO pins:
Figure 88:
Output Switch Matrix
securitybit
Wake up from
deep sleep mode
SWD
Serial Wire Debug
INT , WA K E, in 0
INT , WA K E, in 1
INT , WA K E, in 2
INT , WA K E, in 3
INT , WA K E, in 4
INT , WA K E, in 5
INT , WA K E, in 6
INT , WA K E, in 7
INT , WA K E, in 8
Out 0
Out 0
Out 2
Out 3
Out 4
Programming
mode bit:
enable_swd
GPIO8
GPIO7
GPIO6
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
GPIO0
Page 70
Document Feedback
GPIO
Out 5
Out 6
Out 7
Out 8
Selector
M_S DA
Controlled by
gpioX_func; X=0...9
M _S CL
S _S DA
S _S CL
Tx D
Rx D
I2C
Master
I2C
Slave
UART
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Figure 89:
Selector Assignments
Interface
GPIO
I²C Master
I²C Slave
UART
Analog
gpioX_func; X=0…8
000
011
100
101
111
GPIO0
I/O
M_SDA
S_SDA
TxD
Ana0
GPIO1
I/O
M_SCL
S_SCL
RxD
Ana1
GPIO2
I/O
M_SDA
S_SDA
TxD
Ana2
GPIO3
I/O
M_SCL
S_SCL
RxD
Ana3
GPIO4
I/O
M_SDA
S_SDA
TxD
Ana4
GPIO5
I/O
M_SCL
S_SCL
RxD
Ana5
GPIO6
I/O
M_SDA
S_SDA
TxD
Ana6
GPIO7
I/O
M_SCL
S_SCL
RxD
Ana7
GPIO8
I/O
M_SDA
S_SDA
TxD
Ana8
Each of the GPIO pins is capable of adding a pullup and/or
pulldown:
Figure 90:
GPIO Internal Circuit
AS7000
VDD
}
GPIO0...8
to/from digital control
enable if gpioX_func is not analog
to analog
GND
ams Datasheet
[v1-12] 2018-Feb-26
pullup/pulldown controlled
by gpioX_pd
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AS7000 − Detailed Description
I²C Mode
The AS7000 includes an I²C master and slave (independent)
hardware block. The pins name SDA and SCL in this section can
be mapped during runtime to the GPIO pins according to
Figure 89. ams SDK operates the I²C slave on GPIO2 (=SDA) and
GPIO3 (=SCL) and uses a default I²C address of 0x30 (7-bit
format; R/W bit has to be added) respectively 60h (8-bit format
for writing) and 61h (8-bit format for reading). It expects
external pullup resistors.
I²C Serial Control Interface
I²C Feature List:
Fast mode (400kHz) and standard mode (100kHz) support
7+1-bit addressing mode
Write formats: Single-Byte-Write, Page-Write
Read formats: Current-Address-Read, Random-Read,
Sequential-Read
SDA input delay and SCL spike filtering by integrated
RC-components
I²C Protocol
Figure 91:
I²C Symbol Definition
Symbol
Definition
RW
Note
S
Start condition after stop
R
1 bit
Sr
Repeated start
R
1 bit
DW
Device address for write
R
0110 0000b (60h)
DR
Device address for read
R
0110 0001b (61h)
WA
Word address
R
8 bit
A
Acknowledge
W
1 bit
N
No Acknowledge
R
1 bit
reg_data
Register data/write
R
8 bit
data (n)
Register data/read
W
8 bit
P
Stop condition
R
1 bit
WA++
Increment word address internally
R
During acknowledge
I²C Symbol Definition: Shows the symbols used in the following mode descriptions.
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
I²C Write Access
Byte Write and Page Write formats are used to write data to the
slave.
Figure 92:
I²C Byte Write
S
DW
A
WA
A
reg_data
A P
write register
WA++
I²C Byte Write: Shows the format of an I²C byte write access.
Figure 93:
I²C Page Write
S
DW
A
WA
A
reg_data 1
A
reg_data 2
write register
W A++
A
write register
W A++
...
reg_data n
A
P
write register
W A++
I²C Page Write: Shows the format of an I²C page write access.
The transmission begins with the START condition, which is
generated by the master when the bus is in IDLE state (the bus
is free). The device-write address is followed by the word
address. After the word address any number of data bytes can
be sent to the slave. The word address is incremented internally,
in order to write subsequent data bytes on subsequent address
locations.
For reading data from the slave device, the master has to change
the transfer direction. This can be done either with a repeated
START condition followed by the device-read address, or simply
with a new transmission START followed by the device-read
address, when the bus is in IDLE state. The device-read address
is always followed by the 1st register byte transmitted from the
slave. In Read Mode any number of subsequent register bytes
can be read from the slave. The word address is incremented
internally.
ams Datasheet
[v1-12] 2018-Feb-26
Page 73
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AS7000 − Detailed Description
I²C Read Access
Random, Sequential and Current Address Read are used to read
data from the slave.
Figure 94:
I²C Random Read
S
DW
A
WA
A Sr
DR
A
data
read register
W A++
N
P
W A++
I²C Random Read: Shows the format of an I²C random read access.
Random Read and Sequential Read are combined formats. The
repeated START condition is used to change the direction after
the data transfer from the master.
The word address transfer is initiated with a START condition
issued by the master while the bus is idle. The START condition
is followed by the device-write address and the word address.
In order to change the data direction a repeated START
condition is issued on the 1st SCL pulse after the acknowledge
bit of the word address transfer. After the reception of the
device-read address, the slave becomes the transmitter. In this
state the slave transmits register data located by the previous
received word address vector. The master responds to the data
byte with a not-acknowledge, and issues a STOP condition on
the bus.
Figure 95:
I²C Sequential Read
S
DW
A
WA
A Sr
DR
A
read register
W A++
data
N
P
W A++
I²C Sequential Read: Shows the format of an I²C sequential read access.
Page 74
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Sequential Read is the extended form of Random Read, as more
than one register-data bytes are transferred subsequently. In
difference to the Random Read, for a sequential read the
transferred register-data bytes are responded by an
acknowledge from the master. The number of data bytes
transferred in one sequence is unlimited (consider the behavior
of the word-address counter). To terminate the transmission the
master has to send a not-acknowledge following the last data
byte and generate the STOP condition subsequently.
Figure 96:
I²C Current Address Read
S
DW
A
WA
A Sr
DR
A
read register
W A++
data
N
P
W A++
I²C Current Address Read: Shows the format of an I²C current address read access.
To keep the access time as small as possible, this format allows
a read access without the word address transfer in advance to
the data transfer. The bus is idle and the master issues a START
condition followed by the Device-Read address. Analogous to
Random Read, a single byte transfer is terminated with a
not-acknowledge after the 1st register byte. Analogous to
Sequential Read an unlimited number of data bytes can be
transferred, where the data bytes has to be responded with an
acknowledge from the master. For termination of the
transmission the master sends a not-acknowledge following
the last data byte and a subsequent STOP condition.
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Detailed Description
GPIO, SWD and Security Registers
Figure 97:
GPIO_DATA
0x00: GPIO_DATA
Field
Name
Rst
Type
12:0
gpio_d
0
R_PUSH
Description
Read/write pin data directly. A read always returns the
value at the pin. (1)
Note(s):
1. The upper 4 bits are routed to the LED pins. This way the software can output data conveniently and quickly. The AFE module has
to be turned ON and the LED have to be enabled for this to work.
Figure 98:
GPIO_OE
0x04: GPIO_OE
Field
Name
Rst
Type
8:0
gpio_oe
0
R_PUSH
Description
Output enable (1=output 0=input)
Figure 99:
GPIO_WMASK
0x08: GPIO_WMASK
Field
8:0
Name
gpio_wmask
Page 76
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Rst
0x1ff
Type
Description
RW
All subsequent writes to GPIO_DATA and GPIO_OE will affect
only those bits that are asserted in this mask register. This
way a driver can set and clear bits with one access without
affecting any other bits. This can be used for bit banging
implementations of serial protocols.
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Figure 100:
GPIO_INTTYPE
0x10: GPIO_INTTYPE
Field
Name
Rst
Type
8:0
gpio_inttype
0
RW
Description
Interrupt type (0=level 1=edge sensitive). Level sensitive
interrupts are asserted as long the interrupt condition is
true. Edge level interrupt have to be cleared explicitly.
Figure 101:
GPIO_INTPOL
0x14: GPIO_INTPOL
Field
Name
Rst
Type
8:0
gpio_intpol
0
RW
Description
Interrupt polarity (0=interrupt when '0' / nedgedge,
1=when '1' / posedge)
Figure 102:
GPIO_STATUS
0x20: GPIO_STATUS
Field
Name
Rst
Type
8:0
gpio_status
0
R_PUSH
Description
Interrupt condition fulfilled (edge interrupt has to be
cleared by writing a '1' here)
Figure 103:
GPIO_INTMASK
0x24: GPIO_INTMASK
Field
Name
Rst
Type
8:0
gpio_intmsk
0
RW
ams Datasheet
[v1-12] 2018-Feb-26
Description
Interrupt mask: a '1' enables the interrupt
Page 77
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AS7000 − Detailed Description
Figure 104:
GPIO_INTR
0x28: GPIO_INTR
Field
Name
Rst
Type
8:0
gpio_intr
0
RO
Description
These bits are OR'ed together and generate the interrupt
signal
Figure 105:
GPIO_D_SET
0x30: GPIO_D_SET
Field
Name
Rst
Type
12:0
gpio_o_set
0
PUSH
Description
Setting one or more bit(s) of the GPIO_DATA register
directly without affecting the others
Figure 106:
GPIO_OE_SET
0x34: GPIO_OE_SET
Field
Name
Rst
Type
Description
12:0
gpio_oe_set
0
PUSH
Setting one or more bit(s) of the GPIO_OE registers directly
without affecting the others
Figure 107:
GPIO_D_CLR
0x38: GPIO_D_CLR
Field
Name
Rst
Type
12:0
gpio_o_clr
0
PUSH
Page 78
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Description
Clearing one or more bit(s) of the GPIO_DATA register
directly without affecting the others
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Figure 108:
GPIO_OE_CLR
0x3c: GPIO_OE_CLR
Field
Name
Rst
Type
12:0
gpio_oe_clr
0
PUSH
Description
Clearing one or more bit(s) of the GPIO_OE registers
directly without affecting the others
Figure 109:
CCU_IOFUNC0
0x50: CCU_IOFUNC0
Field
Name
Rst
Type
2:0
gpio0_func
0
RW
Please refer to Figure 110
4:3
gpio0_pd
0
RW
Please refer to Figure 111
5
gpio0_sr
0
RW
Slew rate: 0=fast 1=slow
10:8
gpio1_func
0
RW
Please refer to Figure 110
12:11
gpio1_pd
0
RW
Please refer to Figure 111
13
gpio1_sr
0
RW
Slew rate: 0=fast 1=slow
18:16
gpio2_func
0
RW
Please refer to Figure 110
20:19
gpio2_pd
0
RW
Please refer to Figure 111
21
gpio2_sr
0
RW
Slew rate: 0=fast 1=slow
26:24
gpio3_func
0
RW
Please refer to Figure 110
28:27
gpio3_pd
0
RW
Please refer to Figure 111
29
gpio3_sr
0
RW
Slew rate: 0=fast 1=slow
ams Datasheet
[v1-12] 2018-Feb-26
Description
Page 79
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AS7000 − Detailed Description
The CCU_IOFUNC0/1/2 gpioX_func register defines the
multiplexing mode of each pin.
Figure 110:
gpioX_func Codings (X=0…8)
gpioX_func
Description
0
GPIO
3
I²C Master
4
I²C Slave
5
UART
7
Analog
The CCU_IOFUNC0/1/2 gpioX_pd fields define the
pullup/pulldown configuration
Figure 111:
gpioX_pd Codings (X=0…8)
Page 80
Document Feedback
gpioX_pd
Description
0
None
1
Weak Pull Up
2
Weak Pull Down
3
Keeper
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Detailed Description
Figure 112:
CCU_IOFUNC1
0x54: CCU_IOFUNC1
Field
Name
Rst
Type
Description
2:0
gpio4_func
0
RW
Please refer to Figure 110
4:3
gpio4_pd
0
RW
Please refer to Figure 111
5
gpio4_sr
0
RW
Slew rate: 0=fast 1=slow
10:8
gpio5_func
0
RW
Please refer to Figure 110
12:11
gpio5_pd
0
RW
Please refer to Figure 111
13
gpio5_sr
0
RW
Slew rate: 0=fast 1=slow
18:16
gpio6_func
0
RW
Please refer to Figure 110
20:19
gpio6_pd
0
RW
Please refer to Figure 111
21
gpio6_sr
0
RW
Slew rate: 0=fast 1=slow
26:24
gpio7_func
0
RW
Please refer to Figure 110
28:27
gpio7_pd
0
RW
Please refer to Figure 111
29
gpio7_sr
0
RW
Slew rate: 0=fast 1=slow
Figure 113:
CCU_IOFUNC2
0x58: CCU_IOFUNC2
Field
Name
Rst
Type
2:0
gpio8_func
0
RW
Please refer to Figure 110
4:3
gpio8_pd
0
RW
Please refer to Figure 111
5
gpio8_sr
0
RW
Slew rate: 0=fast 1=slow
ams Datasheet
[v1-12] 2018-Feb-26
Description
Page 81
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AS7000 − Detailed Description
Figure 114:
CCU_RETENTION
0xfc: CCU_RETENTION
Field
Name
Rst
Type
30
enable_swd
1
RW
31
securitybit
0
Description
Enable SWD interface on GPIO7/8 (overrides any gpio7_
func/gpio8_func setting).
WS_SC
securitybit, to disable access through the SWD interface in
the final product. The bit can only be written to 1, not reset.
If enabled by the factory or in EEPROM, the bootloader sets
this bit before booting the user software. Therefore the
image inside the EEPROM is protected against external
access.
The CCU_RETENTION register is the only register that is not
affected by powerdown, Only a power cycle will reset these bits.
Page 82
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Application Information
The AS7000 has a built-in I²C master and host device. Therefore
it allows to connect an accelerometer used for motion artefact
compensation in two ways:
Application Information
1. Connected through the host and data provided by the
host to the AS7000 via the AS7000 I²C slave
2. Connected directly to the AS7000 and the AS7000 I²C
master retrieves the data from the accelerometer.
Following two figures show the different configurations.
Figure 115:
Measurement System With Motion Artefact Compensation
VD1
to LED Supply
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
VDD
2.6V-3.6V
ON=0
GPIO8
GPIO7
GPIO6
GPIO5
M0 CPU
+ RAM/
EEPROM
& Interfaces
GND
VDD
VDD
V_LDO
GND
LDO
Ref
SIGREF
AGND
INT
SDA
SCL
VDD
VD4
Optical barrier
VBAT
VD2
VD3
VDD LDO VBAT
3V
AS7000
LED
Supply
(DCDC)
on
on
GPIO2=SDA
GPIO3=SCL I2C to AS7000
VD3/VD4: if not used
connect to GND
Accelerometer
Host
Processor
PMIC
VBAT
+Charger
Note(s):
1. Accelerometer data provided by host.
In above configuration the host needs to send the
accelerometer data to the AS7000 via the I²C interface.
ams Datasheet
[v1-12] 2018-Feb-26
Page 83
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AS7000 − Application Information
Figure 116:
Measurement System With Motion Artefact Compensation Using AS7000 Dedicated Accelerometer
VD1
to LED Supply
SDA
Accelerometer SCL
VD4
Optical barrier
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
VDD
ON=0
GPIO8
GPIO7
GPIO6
GND
GPIO5
M0 CPU
+ RAM/
EEPROM
& Interfaces
VDD
VDD
V_LDO
GND
LDO
Ref
SIGREF
AGND
INT
2.6V-3.6V
VBAT
VD2
VD3
VDD LDO
3V
AS7000
VBAT
LED
Supply
(DCDC)
on
on
GPIO2
GPIO3 I2C to AS7000
LCD
VD3/VD4: if not
used connect to
GND
Host
Processor
PMIC
VBAT
+Charger
Bluetooth
Note(s):
1. Accelerometer connected directly
In above configuration, the AS7000 I²C master is used to poll
the data from the accelerometer.
The AS7000 has internal protection diodes on all GPIO pins
connected to VDD. If VDD is switched off, all GPIO pins are
clamped to this VDD supply plus one diode voltage (typically
0.6V). Therefore connect the periphery supply of these pins
(example: I²C pins from host in above example connected to
GPIO2/3), which are connected to the AS7000 GPIO pins to the
same VDD supply as the AS7000. If this is not possible, ensure
that these pins are at logic 0 if the VDD supply of AS7000 is
switched off.
Page 84
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Application Information
Due to the integration of the optical diode / optical frontend /
analog processing / ADC and microprocessor a heart-rate
measurement application can be built with very small PCB area
as shown in following figure:
Figure 117:
Typical Form Factor Including VDD LDO
External Components
Figure 118:
External Components
Part Number
AS1383
AS1369-BWLT-30
GRM153R60J225ME95
LIS2DH12
ams Datasheet
[v1-12] 2018-Feb-26
Parameter or
Type
DC-DC converter
200mA, 3.5MHz
Voltage
Rating
Size
n/a
1.17x0.77x0.6mm
Comment
DC-DC converter for
VLED supply on pin
VD1/VD2
VOUT=3.0V
0.97x0.97x0.6mm
Ultra Small LDO for
VDD supply
C=2.2μF,
min. 1μF at 1.0V bias
6.3V
0402
(1.0x0.5x0.5mm)
On pin VDD, V_LDO
and SIGREF
Accelerometer
n/a
2x2x1mm
200mA LDO
Manufacturer
ams
www.ams.com
Murata
www.murata.com
ST
www.st.com
Page 85
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AS7000 − Package Drawings & Mark ings
Package Drawings & Markings
Figure 119:
Package Drawings
XXXXX
RoHS
Green
Note(s):
1. XXXXX - Tracecode backside marking (upside down)
Page 86
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Ordering & Contact Information
Ordering & Contact Information
Figure 120:
Ordering Information
Ordering
Code
Type
LED Configuration
Marking
Delivery
Form
Delivery
Quantity
AS7000-AA
AS7000
Green/Green
XXXXX(1)
Tape & Reel
5000 pcs/reel
AS7000-AAM
AS7000
Green/Green
XXXXX(1)
Tape & Reel
500 pcs/reel
Note(s):
1. XXXXX - Tracecode backside marking
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-12] 2018-Feb-26
Page 87
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AS7000 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
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ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
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Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-12] 2018-Feb-26
AS7000 − Revision Information
Revision Information
Changes from 1-10 (2017-Feb-28) to current revision 1-12 (2018-Feb-26)
Page
1-10 (2017-Feb-28) to 1-11 (2017-Sep-28)
Added note under Absolute Maximum Ratings figure
5
1-11 (2017-Sep-28) to 1-12 (2018-Feb-26)
Removed AS7000AB related content
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
ams Datasheet
[v1-12] 2018-Feb-26
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AS7000 − Content Guide
Content Guide
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1
1
1
2
General Description
Key Benefits and Features
Applications
Block Diagram
3
5
7
Pin Assignments
Absolute Maximum Ratings
Electrical Characteristics
10
10
11
12
18
20
22
25
26
26
27
29
33
40
40
40
40
41
43
46
46
47
51
54
56
61
62
62
63
67
69
70
72
76
Detailed Description
Optical Analog Front End
LEDs
LED-Driver
Photodiode Selection
Photodiode Characteristics
Photodiode Trans-Impedance Amplifier (TIA)
Voltage Mode of the Photodiode Amplifier
Optical Front End Operating Modes
Manual Operation of The Optical Frontend:
Sequencer
Sequencer Registers
Example Sequencer Configurations
Optical Signal Conditioning
Synchronous Demodulator
High Pass Filter
Gain Stage
Optical Signal Conditioning Registers
Sync Demodulator Example
Electrical Analog Front End
Input Pins
AFE Registers
Possible Configurations of Every Amplifier Stage
ADC
ADC Registers
Power Management and Operating Modes
Clock Control Unit (CCU) for Peripheral Blocks
Wake-Up From Power Down Mode
Power Management And Operating Modes Registers
MCU
Debug – SWD
GPIO Pins and Output Switch Matrix
I²C Mode
GPIO, SWD and Security Registers
83
85
Application Information
External Components
86
87
88
89
90
91
Package Drawings & Markings
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
ams Datasheet
[v1-12] 2018-Feb-26