SFH 4500

Leistungsstarke IR-Lumineszenzdiode High Power Infrared Emitter SFH 4500 SFH 4505 SFH 4500 SFH 4505 Vorläufige Daten / Preliminary Data Wesentliche Merkmale Features • • • • • • • • • • • • Leistungsstarke GaAs-LED (40mW) Hoher Wirkunsgrad bei kleinen Strömen Typische Peakwellenlänge 950nm Engwinkliger SMT-Sidelooker IR Reflow Löten geeignet Feuchte-Empfindlichkeitsstufe 3 nach JEDEC Standard J-STD-020A High Power GaAs-LED (40mW) High Efficiency at low currents Typical peak wavelength 950nm Narrow angle SMT-Sidelooker Suitable for IR reflow soldering Moisture Sensitivity Level 3 according to JEDEC Standard J-STD-020A Anwendungen Applications • Bauteil mit hoher Strahlstärke zur Oberflächenmontage (SMT) • Schnelle Datenübertragung mit Übertragungsraten bis 100 Mbaud (IR Tastatur, Joystick, Multimedia) • Analoge und digitale Hi-Fi Audio- und Videosignalübertragung • Alarm- und Sicherungssysteme • IR Freiraumübertragung • IR-Scheinwerfer für Kameras • Device with high radiant intensity suitable for surface mounting (SMT) • High data transmission rate up to 100 Mbaud (IR keyboard, Joystick, Multimedia) • Analog and digital Hi-Fi audio and video signal transmission • Alarm and safety equipment • IR free air transmission • IR spotlight for cameras Typ Type Bestellnummer Strahlstärkegruppierung 1) (IF = 100mA, tp = 20 ms) Ordering Code Radiant intensity grouping 1) Ie (mW/sr) SFH 4500 Q62702-P5163 85 (>25) SFH 4505 Q62702-P5164 85 (>25) 1) gemessen bei einem Raumwinkel Ω = 0.01 sr measured at a solid angle of Ω = 0.01 sr 2003-10-29 1 SFH 4500, SFH 4505 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 3 V Durchlaßstrom Forward current IF (DC) 100 mA Stoßstrom Surge current tp = 10 µs, D = 0 IFSM 2.2 A Verlustleistung Power dissipation Ptot 180 mW Wärmewiderstand Sperrschicht - Umgebung, freie Beinchenlänge max. 10 mm Thermal resistance junction - ambient, lead length between package bottom and PCB max. 10 mm RthJA 375 K/W 2003-10-29 2 SFH 4500, SFH 4505 Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength of peak emission IF = 100 mA, tp = 20 ms λpeak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp = 20 ms ∆λ 40 nm Abstrahlwinkel Half angle ϕ ± 10 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimension of the active chip area L×B L×W 0.3 × 0.3 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10% Switching times, Ie from 10% to 90% and from 90% to 10% IF = 100 mA, tP = 20 ms, RL = 50 Ω t r, t f 10 ns Kapazität Capacitance VR = 0 V, f = 1 MHz Co 35 pF VF VF 1.5 (≤ 1.8) 3.2 (≤ 4.3) V V Sperrstrom Reverse current VR = 3 V IR 0.01 (≤ 10) µA Gesamtstrahlungsfluß Total radiant flux IF = 100 mA, tp = 20 ms Φe 40 mW Temperaturkoeffizient von Ie bzw. Φe Temperature coefficient of Ie or Φe IF = 100 mA TCI – 0.44 %/K Durchlaβspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs 2003-10-29 3 SFH 4500, SFH 4505 Kennwerte (TA = 25 °C) (cont’d) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Temperaturkoeffizient von VF Temperature coefficient of VF IF = 100 mA TCV – 1.5 mV/K Temperaturkoeffizient von λ Temperature coefficient of λ IF = 100 mA TCλ + 0.2 nm/K Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie typ 25 85 mW/sr mW/sr Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Ie typ 550 mW/sr Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel von Ω = 0.01 sr Radiant Intensity Ie in Axial Direction measured at a solid angle of Ω = 0.01 sr Lötbedingungen Soldering Conditions Reflowlötung Reflow Soldering Lötzonentemperatur Maximale Durchlaufzeit Temperature of Soldering Zone Max. Transit Time 245 °C 10 s 2003-10-29 Kolbenlötung (mit 1,5-mm-Kolbenspitze) Iron Soldering (with 1.5-mm-bit) Temperatur des Kolbens Maximale zulässige Lötzeit Abstand Lötstelle – Gehäuse Temperature of the Soldering Iron Max. Permissible Soldering Time Distance between Solder Joint and Case 300 °C 3s ≥ 1.5 mm 4 SFH 4500, SFH 4505 Radiant Intensity Ιe/Ιe (100 mA) = f (IF) Single pulse, tp = 20 µs Relative Spectral Emission Ierel = f (λ) OHF00777 100 Ι erel OHF00809 10 2 I F mA Ι e (100 mA) 100 60 10 0 75 40 10 -1 50 20 10 -2 0 800 850 900 950 1000 nm 1100 λ Forward Current IF = f (VF) single pulse, tp = 20 µs 25 10 -3 10 0 10 1 10 2 0 10 3 mA 10 4 ΙF 0 10 20 30 40 50 60 70 80 ˚C 100 T Radiation Characteristic Ierel = f (ϕ) 40˚ OHF00784 10 4 mA OHF01534 125 Ιe 80 ΙF Max. Permissible Forward Current IF = f (TA) 30˚ 20˚ 10˚ 0˚ ϕ OHF01019 1.0 10 3 50˚ 0.8 10 2 0.6 10 1 60˚ 10 0 70˚ 10 -1 80˚ 10 -2 90˚ 10 -3 0.4 0.2 0 0.5 1 1.5 2 2.5 3 3.5 V 4.5 0 100˚ 1.0 0.8 0.6 VF Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C, duty cycle D = parameter IF 101 A 5 OHF00041 t D = TP tP IF T D= 100 5 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 10-1 -5 10 10-4 10-3 10-2 10-1 100 101 s 10 2 tp 2003-10-29 5 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ SFH 4500, SFH 4505 Maßzeichnungen Package Outlines SFH 4500 2.54 (0.100) spacing 14.7 (0.579) 13.1 (0.516) Cathode 4.5 (0.177) 3.9 (0.154) 2.7 (0.106) 2.4 (0.094) 4.8 (0.189) 4.4 (0.173) 3.7 (0.146) 3.3 (0.130) 2.05 (0.081) R 1.95 (0.077) -0.1...0.2 (-0.004...0.008) 7.5 (0.295) 5.5 (0.217) 2.8 (0.110) 2.4 (0.094) Chip position 4.5 (0.177) 3.9 (0.154) 7.7 (0.303) 7.1 (0.280) ((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.213) GEOY6960 SFH 4505 2.54 (0.100) spacing 15.5 (0.610) 14.7 (0.579) Cathode 4.5 (0.177) 3.9 (0.154) 7.7 (0.303) 7.1 (0.280) -0.15...0.15 (-0.006...0.006) 2.7 (0.106) 2.4 (0.094) 4.8 (0.189) 4.4 (0.173) 8.0 (0.315) 7.4 (0.291) Chip position 4.5 (0.177) 3.9 (0.154) 2.05 (0.081) R 1.95 (0.077) ((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.213) GEOY6961 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2003-10-29 6 SFH 4500, SFH 4505 Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2003-10-29 7