Model 1P603AS
Rev B
Hybrid Couplers
3 dB, 90°
Description
The 1P603AS is a low profile, high performance 3dB hybrid coupler in an
easy to use, manufacturing friendly surface mount package. It is designed for
W-LAN and MMDS applications. The 1P603AS is designed for balanced
amplifiers, variable phase shifters and attenuators, LNAs, signal distribution
and is an ideal solution for the ever-increasing demands of the wireless
industry for smaller printed circuit boards and high performance. Parts have
been subjected to rigorous qualification testing and they are manufactured
using materials with coefficients of thermal expansion (CTE) compatible with
common substrates such as FR4, G-10, RF-35, RO4003 and polyimide.
Produced with 6 of 6 RoHS compliant tin immersion finish.
ELECTRICAL SPECIFICATIONS**
Features:
•
•
•
•
•
•
•
•
•
2330-2700 MHz
W-LAN and MMDS
Low Loss
High Isolation
90° Quadrature
Surface Mountable
Tape And Reel
Lead Free
100% Tested
Outline Drawing
Frequency
Isolation
Insertion Loss
VSWR
MHz
dB Min
dB Max
Max:1
2300-2700
20
0.30
Amplitude
Balance
Phase Balance
Power
dB Max
Degrees
Ave. CW Watts
@85°C
± 0.25
±3
25
1.20
Operating
Temp.
ºC
-55 to +140
**Specification based on performance of unit properly installed on microstrip printed circuit boards
with 50 Ω nominal impedance. Specifications subject to change without notice.
Dimensions are in Inches [Millimeters]
1P603AS Mechanical Outline
Part is Symmetric About All Axis
Tolerances are Non-Cumulative
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Model 1P603AS
Rev B
Hybrid Coupler Pin Configuration
The 1P603AS has an orientation marker to denote Pin 1. Once port one has been identified the other ports are
known automatically. Please see the chart below for clarification:
Configuration
Splitter
Splitter
Splitter
Splitter
Pin 1
Input
Isolated
Pin 2
Isolated
Input
-3dB ∠θ − 90
-3dB ∠θ
-3dB ∠θ
-3dB ∠θ − 90
*Combiner
*Combiner
*Combiner
*Combiner
A ∠θ − 90
A ∠θ
Isolated
Output
A ∠θ
A ∠θ − 90
Output
Isolated
Pin 3
-3dB ∠θ − 90
-3dB ∠θ
Input
Isolated
Pin 4
-3dB ∠θ
-3dB ∠θ − 90
Isolated
Input
Isolated
Output
Output
Isolated
A ∠θ − 90
A ∠θ
A ∠θ
A ∠θ
− 90
*Notes:
“A” is the amplitude of the applied signals. When two quadrature signals with equal
amplitudes are applied to the coupler as described in the table, they will combine at the output
port. If the amplitudes are not equal, some of the applied energy will be directed to the isolated
port.
The actual phase, ∠θ , or amplitude at a given frequency for all ports, can be seen in our deembedded s-parameters, that can be downloaded at www.anaren.com.
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 1P603AS
Rev B
Typical Performance (-55°C, 25°C & 125°C): 2300 - 2700 MHz
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Model 1P603AS
Rev B
Typical Performance (-55°C, 25°C & 125°C): 2300 - 2700 MHz
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 1P603AS
Rev B
Definition of Measured Specifications
Parameter
Definition
VSWR
(Voltage Standing Wave
Ratio)
The impedance match of
the coupler to a 50Ω
system. A VSWR of 1:1 is
optimal.
Return Loss
Insertion Loss
Isolation
Phase Balance
Amplitude Balance
Mathematical Representation
The impedance match of
the coupler to a 50Ω
system. Return Loss is
an alternate means to
express VSWR.
The input power divided
by the sum of the power
at the two output ports.
The input power divided
by the power at the
isolated port.
The difference in phase
angle between the two
output ports.
The power at each output
divided by the average
power of the two outputs.
VSWR =
Vmax
Vmin
Vmax = voltage maxima of a standing wave
Vmin = voltage minima of a standing wave
Return Loss (dB)= 20log
VSWR + 1
VSWR - 1
Insertion Loss(dB)= 10log
Pin
Pcpl + Pdirect
Isolation(dB)= 10log
Pin
Piso
Phase at coupled port – Phase at direct port
10log
Pdirect
Pcpl
and 10log
Pcpl + Pdirect
Pcpl + Pdirect
2
2
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Model 1P603AS
Rev B
1P603AS Power Derating Curve
Power Derating:
The power handling and corresponding power derating plots are a function of the thermal resistance, mounting
surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and
the thermal insertion loss. The thermal insertion loss is defined in the Power Handling section of the data
sheet.
As the mounting interface temperature approaches the maximum continuous operating temperature, the power
handling decreases to zero.
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 1P603AS
Rev B
Mounting
Coupler Mounting Process
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, electrical performance may not
meet published specifications.
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high volume
usage.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom ground
layers of the PCB. This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and directional couplers are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability.
When a surface mount hybrid coupler is mounted to a
printed circuit board, the primary concerns are; ensuring
the RF pads of the device are in contact with the circuit
trace of the PCB and insuring the ground plane of neither
the component nor the PCB is in contact with the RF
signal.
Mounting Footprint
To ensure proper electrical and thermal performance
there must be a ground plane with 100%
solder conection underneath the part
.174
[4.42]
4X .024 [0.61]
Figure 1: Surface Mounting Process Steps
Storage of Components: Xinger products are available
in an immersion tin finish. Commonly used storage
procedures used to control oxidation should be followed
for these surface mount components. The storage
temperatures should be held between 15OC and 60OC.
Substrate: Depending upon the particular component,
the circuit material has a coefficient of thermal expansion
(CTE) similar to commonly used board substrates such
as RF35, RO4003, FR4, polyimide and G-10 materials.
The similarity in CTE minimizes solder joint stresses due
to similar expansion rates between component and
board. Mounting to “hard” substrates (alumina etc.) is
possible depending upon operational temperature
requirements. The solder surfaces of the coupler are all
copper plated with an immersion tin finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
Multiple
plated thru holes
to ground
4X .024
[0.61]
.124
[3.15]
4X .045 SQ
[1.14]
4X .099
[2.51]
4X 50
Transmission
Line
Dimensions are in Inches [Millimeters]
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Model 1P603AS
Rev B
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. A low and high
temperature thermal reflow profile are shown in Figures 5
and 6, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-heating is highly
recommended for these selective hot air soldering
methods. Manual soldering with conventional irons should
be avoided.
Figure 2: Solder Paste Application
Coupler Positioning: The surface mount coupler can
be placed manually or with automatic pick and place
mechanisms. Couplers should be placed (see Figure 3
and 4) onto wet paste with common surface mount
techniques and parameters. Pick and place systems
must supply adequate vacuum to hold a 0.106 gram
coupler.
Figure 3: Component Placement
Figure 4: Mounting Features Example
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 1P603AS
Rev B
Figure 5 – Low Temperature Solder Reflow Thermal Profile
Figure 6 – High Temperature Solder Reflow Thermal Profile
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Model 1P603AS
Rev B
Packaging and Ordering Information
Packaging follows EIA-481-2. Parts are oriented in tape as shown below. Minimum order quantities are 2000 per
reel.
Xinger® Tape & Reel Diagram
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 233-5510
(833) 389-6402
+44 2392-232392
+86 512 62749282
Available on Tape and
Reel For Pick and Place
Manufacturing.
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