BD2425J50200AHF

BD2425J50200AHF Rev D Ultra Low Profile 0805 Balun 50Ω to 200Ω Balanced Description: The BD2425J50200AHF is a low profile sub-miniature balanced to unbalanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering the GSM frequencies. The BD2425J50200AHF is ideal for high volume manufacturing and is higher performance than traditional ceramic and lumped element baluns. The BD2425J50200AHF has an unbalanced port impedance of 50Ω and a 200Ω balanced port impedance. This transformation enables single ended signals to be applied to differential ports on modern semiconductors. The output ports have equal amplitude (-3dB) with 180 degree phase differential. The BD2425J50200AHF is available on tape and reel for pick and place high volume manufacturing. Detailed Electrical Specifications: Specifications subject to change without notice. Features: • • • • • • • • • • 2400 – 2500 MHz 0.7mm Height Profile 50 Ohm to 2 x 100 Ohm 802.11 b+g +n Compliant Low Insertion Loss Input to Output DC Isolation Surface Mountable Tape & Reel Non-conductive Surface RoHS Compliant ROOM (25°C) Parameter Min. Frequency Unbalanced Port Impedance Balanced Port Impedance Return Loss Insertion Loss* Amplitude Balance Phase Balance CMRR Power Handling @85C Power Handling @105C Operating Temperature 2400 9.5 Typ. 50 200 12.2 0.6 0.1 2 37 TOP VIEW (Near Side) 2.04±0.10 2500 MHz Ω Ω dB dB dB Degrees dB Watts Watts ºC 2 1.2 +105 -55 SIDE VIEW Unit 0.8 0.5 6 * Insertion Loss stated at room temperature (Insertion Loss is approximately 0.1 dB higher at +85 ºC). Outline Drawing Max BOTTOM VIEW (Far Side) 0.71±0.07 1 4x 0.37 2 3 2x 0.15 1.29±0.10 6x 0.98 Orientation Marker Denotes Pin Location Mechanical Outline -Dimensions are in Millimeters Orientation Marker Denotes Pin Location 6x 0.22 6 4x 0.65 5 4 6x 0.30 Pin Designation 1 Unbalanced Port 2 GND/DC Feed +RF GND 3 Balanced Port 4 Balanced Port 5 GND 6 NC 1 BD2425J50200AHF Rev D Typical Broadband Performance: 0 GHz. to 8.5 GHz. Amplitude Balance Return Loss - Input 0 2 -3 1.5 -6 1 -9 -12 0.5 [dB] [dB] -15 -18 -21 0 -0.5 -24 -27 -1 -30 -1.5 -33 6000 6500 7000 7500 8000 8500 6500 7000 7500 8000 8500 5500 6000 5000 4500 4000 3500 3000 2500 2000 1500 500 8500 8000 7500 7000 6500 6000 5500 5000 4500 4000 3500 3000 2500 2000 1500 500 1000 1000 -2 -36 Frequency [MHz] Frequency [MHz] Phase Balance Insertion Loss 20 0 -0.3 15 -0.6 10 -0.9 -1.2 5 deg [dB] -1.5 -1.8 -2.1 0 -5 -2.4 -10 -2.7 -3 -15 -3.3 5500 5000 4500 4000 3500 3000 2500 2000 1500 500 8500 8000 7500 7000 6500 6000 5500 5000 4500 4000 3500 3000 2500 2000 1500 500 1000 1000 -20 -3.6 Frequency [MHz] Frequency [MHz] CMRR 0 -5 -10 [dB] -15 -20 -25 -30 -35 8500 8000 7500 7000 6500 6000 5500 5000 4500 4000 3500 3000 2500 2000 1500 500 1000 -40 Frequency [MHz] 2 BD2425J50200AHF Rev D Typical Performance: 2300 MHz. to 2600 MHz. Return Loss - Input Amplitude Balance 0 2 -3 1.5 -6 -9 1 -12 0.5 [dB] [dB] -15 -18 -21 0 -0.5 -24 -1 -27 -30 -1.5 -33 2500 2550 2600 2500 2550 2600 2450 2400 2300 2600 2550 2500 2450 2400 2350 2300 2350 -2 -36 Frequency [MHz] Frequency [MHz] Phase Balance Insertion Loss 20 0 -0.3 15 -0.6 -0.9 10 -1.2 5 deg [dB] -1.5 -1.8 -2.1 0 -5 -2.4 -10 -2.7 -3 -15 -3.3 2450 2400 2350 2600 2550 2500 2450 2400 2350 2300 Frequency [MHz] 2300 -20 -3.6 Frequency [MHz] CMRR 0 -5 -10 [dB] -15 -20 -25 -30 -35 2600 2550 2500 2450 2400 2350 2300 -40 Frequency [MHz] 3 BD2425J50200AHF Rev D Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from organic PTFE based composites which possess excellent electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier. An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. No Bias Footprint Circuit Pattern Dimensions are in Millimeters Mounting Footprint Footprint Pad (s) DC Bias Footprint Circuit Pattern Footprint Pad (s) Solder Resist Dimensions are in Millimeters Mounting Footprint Plated thru holes to ground Solder Resist Capacitor 6x .41 4x .25 Plated thru holes to ground .04 6x .41 DC Bias 3x Transmission lines .04 6x .33 6x .33 .66 .66 PART ORIENTATION TOP DOWN PART ORIENTATION TOP DOWN Plated thru holes to ground 3x Transmission lines 4x .25 Plated thru holes to ground 4 BD2425J50200AHF Rev D Packaging and Ordering Information Parts are available in reel and are packaged per EIA 481-D. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4000 per reel. Contact us: rf&s_support@ttm.com 5