BD2425N50ATI

BD2425N50ATI Rev C Ultra Low Profile 0404 Balun For TI transceiver CC2500 50Ω to 127+j34Ω Balanced (TTM Application Note Ann-2003) Description: The BD2425N50ATI is a low cost, low profile sub-miniature unbalanced to balanced transformer designed for differential inputs and output locations on modern chipsets in an easy to use surface mount package. The BD2425N50ATI is ideal for high volume manufacturing and delivers higher performance than traditional ceramic baluns. The BD2425N50ATI has an unbalanced port impedance of 50Ω and 127+ j34Ω balanced port impedance. This transformation enables single ended signals to be applied to differential ports on modern integrated chipsets. The output ports have equal amplitude (-3dB) with 180 degree phase differential. The BD2425N50ATI is available on tape and reel for pick and place high volume manufacturing. Detailed Electrical Specifications: Specifications subject to change without notice. Features: • 2400 – 2500 MHz • 0.65mm Height Profile • 50 Ohm to 2 x 63.5+j17 Ohm • Low Insertion Loss • Surface Mountable • Tape & Reel • Non-conductive Surface • RoHS Compliant Zigbee • ROOM (25°C) Parameter Min. Frequency Unbalanced Port Impedance** Balanced Port Impedance** Return Loss** 2300 Typ. Unit 2600 MHz Ω Ω dB 0.4 0.6 dB 1 TBD +85 Watts ºC 50 127+j34 17 13 Insertion Loss* ** Power Handling Operating Temperature Max -55 *Insertion Loss stated at room temperature (Insertion Loss is approximately 0.1 dB higher at +85 ºC) *Stated performance assumes proper matching network found in application note: ANN-2003 Outline Drawing: Side View Top View (Near-side) .041+.003 -.002 1.05+0.08 -0.06 [ ] .041+.003 -.002 1.05+0.08 -0.06 [ ] Bottom View (Far-side) .012 [0.30] .024±.0025 [0.62±0.064] 0.12 [0.30] 1 2 3x.010 [0.25] 4 4X .020 [0.50] 3 3x.010 [0.25] Pin Designation GND / DC Feed 1 + RF GND Dimensions are in Inches [Millimeters] Mechanical Outline 2 Unbalanced Port 3 Balanced Port 4 Balanced Port Tolerances are Non-Cumulative 1 BD2425N50ATI Rev C Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability. An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. With DC Bias Plated thru hole to ground 3X .011 [0.29] .008 [0.21] 3X .011 [0.29] .014 [0.36] .008 [0.21] .020 [0.50] 3X Transmission Line .020 [0.50] Circuit Pattern Footprint Pad (s) Solder Resist Dimensions are in Inches [Millimeters] Mounting Footprint 2 BD2425N50ATI Rev C Packaging and Ordering Information: Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4000 per reel. See Model Numbers below for further ordering information. Contact us: rf&s_support@ttm.com 3