RFP-100200N4X50-2

Model RFP-100200N4X50-2 Aluminum Nitride Terminations Aluminum Nitride Chip Terminations 30 Watts, 50 Ω General Specifications Resistive Element: Substrate: Terminals: Thick film Aluminum nitride ceramic Tin/Lead, 90/10 over nickel Electrical Specifications Features • DC – 3.0 GHz • 30 Watts • Aluminum Nitride (AlN) Ceramic • Terminal for Lead Attachment • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Resistance Value: Frequency Range: Power: V.S.W.R.: 50 ohms, ±2% DC - 3.0 GHz 30 Watts 1.25:1 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +150°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. Outline Drawing SIDE VIEW .040 TOP VIEW .100 .200 .030 HATCHED AREA INDICATES PROTECTIVE COATING VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Model RFP-100200N4X50-2 % OF RATED POWER Aluminum Nitride Chip Terminations 2 Typical Performance Power Derating Suggested Mounting Procedures .025 MIN. (2 PLACES) 100 75 50 25 0 25 50 75 100 125 150 BOARD LOWER THAN LEAD. SUGGESTED STRESS RELIEF METHODS SCALE: NONE CASE TEMPERATURE — °C 1. Make sure that the devices are mounted on flat surfaces (.001” under the device) to optimize the heat transfer. 2. Position device on mounting surface and solder in place using an SN96 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron (700°F). Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369