RFP-250250-4X50-2

Model RFP-250250-4X50-2 Chip Terminations 40 Watts, 50 Ω Chip Terminations General Specifications Resistive Element: Substrate: Terminals: Thick film Beryllium oxide ceramic Thick film silver Electrical Specifications Features • DC - 2.0 GHz • 40 Watts • BeO Ceramic • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Resistance Value: Frequency Range: Power: V.S.W.R.: 50 ohms, ±2% DC - 2.0 GHz 40 Watts 1.30:1 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +150°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. Outline Drawing SIDE VIEW .040 TOP VIEW .250 .230 .065 .055 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING Note: XX denotes value RFP X XX .250 VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Model RFP-250250-4X50-2 % OF RATED POWER Chip Terminations 2 Typical Performance Power Derating Suggested Mounting Procedures .025 MIN. (2 PLACES) 100 75 50 25 0 25 50 75 100 125 150 BOARD LOWER THAN LEAD. BOARD EVEN WITH LEAD. BOARD LOWER THAN LEAD. BOARD HIGHER THAN LEAD. SUGGESTED STRESS RELIEF METHODS SCALE: NOT RECOMMENDED APPLICATION SCALE: 1. Make sure that the devices are mounted on flat surfaces (.001” under the device) to optimize the heat transfer. P.C.B. SOLDER INTERFACE TEMPERATURE — °C 2. Position device on mounting surface and solder in place using an indalloy type or a 60/40 type solder. 3. Solder leads in place using a 60/40 type solder with a controlled temperature iron (700°F). Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369