RFP-250250-6Z50-2

Model RFP-250250-6Z50-2 Surface Mount Terminations 16 Watts, 50 Ω Surface Mount Terminations General Specifications Resistive Element: Substrate: Terminals: Thick film Beryllium oxide ceramic Thick film silver Electrical Specifications Features • DC - 3.0 GHz • 16 Watts • BeO Ceramic • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Resistance Value: Frequency Range: Power: V.S.W.R.: 50 ohms, ±2% DC - 3.0 GHz 16 Watts 1.25:1 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +125°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. Outline Drawing SIDE VIEW .060 GND RF PAD BOTTOM VIEW TOP VIEW .250 RFP Z 50 .037 .175 .250 .070 .030 .070 .120 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Model RFP-250250-6Z50-2 % OF RATED POWER Surface Mount Terminations 2 Typical Performance Power Derating Suggested Mounting Procedures 100 75 50 25 0 25 50 75 100 125 °C SOLDER PASTE SOLDER FILLED VIA SCREW (2 PLS.) PC BOARD HEATSINK 1. Solder part in place using 60/40 type solder with controlled temperature iron (700°F). 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws. P.C.B. SOLDER INTERFACE TEMPERATURE Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369