RFP-250375-4X50-2

Model RFP-250375-4X50-2 Chip Terminations 150 Watts, 50 Ω Chip Terminations General Specifications Resistive Element: Substrate: Terminals: Thick film Beryllium oxide ceramic Thick film silver Electrical Specifications Features • DC - 1.0 GHz • 150 Watts • BeO Ceramic • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Resistance Value: Frequency Range: Power: V.S.W.R.: 50 ohms, ±2% DC - 1.0 GHz 150 Watts 1.20:1 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +150°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. Outline Drawing SIDE VIEW .040 .060 TOP VIEW .250 RFP 250375 4X50 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING .375 VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Model RFP-250375-4X50-2 % OF RATED POWER Chip Terminations 2 Typical Performance Power Derating Suggested Mounting Procedures .025 MIN. (2 PLACES) 100 75 50 25 0 25 50 75 100 125 150 BOARD LOWER THAN LEAD. BOARD EVEN WITH LEAD. BOARD LOWER THAN LEAD. BOARD HIGHER THAN LEAD. SUGGESTED STRESS RELIEF METHODS SCALE: NOT RECOMMENDED APPLICATION SCALE: 1. Make sure that the devices are mounted on flat surfaces (.001” under the device) to optimize the heat transfer. P.C.B. SOLDER INTERFACE TEMPERATURE — °C 2. Position device on mounting surface and solder in place using an indalloy type or a 60/40 type solder. 3. Solder leads in place using a 60/40 type solder with a controlled temperature iron (700°F). Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369