RFP-250375N4Z50-2

Model RFP-250375N4Z50-2 Aluminum Nitride Terminations Aluminum Nitride SMD Terminations 25 Watts, 50 Ω General Specifications Resistive Element: Substrate: Terminals: Thick film Aluminum nitride ceramic Tin/Lead, 90/10 over nickel Electrical Specifications Features • DC – 3.0 GHz • 25 Watts • Aluminum Nitride (AlN) Ceramic • Surface Mountable • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Resistance Value: Frequency Range: Power: V.S.W.R.: 50 ohms, ±2% DC - 3.0 GHz 25 Watts 1.25:1 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +125°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. Outline Drawing SIDE VIEW .040 TOP VIEW .250 BACK VIEW RFP 250375 N4ZXXX .375 .060 .060 DENOTES LOCATION OF RF PAD ON BACKSIDE OF CHIP Note: XXX denotes value. .058 .135 .058 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING .135 VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Model RFP-250375N4Z50-2 % OF RATED POWER Aluminum Nitride SMD Terminations 2 Typical Performance Power Derating Suggested Mounting Procedures SCREW (2 PLS.) 100 75 50 25 0 25 50 75 100 125 SOLDER PASTE PC BOARD HEATSINK SOLDER FILLED VIA 1. Solder part in place using 60/40 type solder with controlled temperature iron (700°F). 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws. P.C.B. SOLDER INTERFACE TEMPERATURE — °C Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369