APL3510/1
USB Power-Distribution Switches
General Description
Features
•
•
•
•
•
•
•
•
The APL3510/1 series of power switches are designed
for USB applications. The 70mΩ N-channel MOSFET
70mΩ (MSOP-8) High Side MOSFET
Wide Supply Voltage Range: 2.7V to 5.5V
power switch satisfies the voltage drop requirements of
USB specification.
Current-Limit and Short-Circuit Protections
Over-Temperature Protection
The protection features include current-limit protection,
short-circuit protection, and over-temperature protection.
Fault Indication Output
Enable Input
The device limits the output current at current limit threshold level. When VOUT drops below VIN-1V, the devices limit
UL Approved-File No. E328191
Nemko IEC/EN60950-1 CB Scheme Certified, No.
the current to a lower and safe level. The over-temperature protection limits the junction temperature below
85153
•
•
TUV IEC/EN60950-1 Certified, No. 44 780 16
140oC in case of short circuit or over load conditions.
Other features include a deglitched OCB output to indi-
406748-014
Lead Free and Green Devices Available
cate the fault condition and an enable input to enable or
disable the device.
(RoHS Compliant)
Simplified Application Circuit
Applications
•
•
•
5V
USB Port
VIN
VOUT
Notebook and Desktop Computers
APL3510A/B/C/D/E/F
APL3511A/B/C/D
USB Ports
High-Side Power Protection Switchs
USB
Controller
OCB
EN/ENB
GND
Pin Configurations
GND 1
8 VOUT
VIN 2
7 VOUT
OCB 1
VIN 3
6 VOUT
GND 2
EN 4
5 OCB
5 VOUT
4 VIN
8 VOUT
VIN 2
7 VOUT
OCB 1
6 VOUT
5 OCB
SOP-8/MSOP-8
APL3510B/D
(Top View)
4 EN
SOT-23-5
APL3511A/C
(Top View)
5 VOUT
GND 2
VIN 3
OCB 3
SOT-23-5
APL3510A/C/E
(Top View)
GND 1
5 VIN
GND 2
EN 3
SOP-8/MSOP-8
APL3510A/C
(Top View)
ENB 4
VOUT 1
VOUT 1
5 VIN
GND 2
ENB 3
4 VIN
SOT-23-5
APL3510B/D/F
(Top View)
OCB 3
4 ENB
SOT-23-5
APL3511B/D
(Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
1
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APL3510/1
Ordering and Marking Information
Package Code
K : SOP-8 X : MSOP-8 B : SOT-23-5
Operating Ambient Temperature Range
Assembly Material
I : -40 to 85 oC
Handling Code
Handling Code
TR : Tape & Reel
Temperature Range
Output Current/EN Function
Package Code
A : 2A/Active High B : 2A/Active Low
C : 1A/Active High
Output Current/EN Function
D : 1A/Active Low E : 0.3A/Active High F : 0.3A/Active Low
Assembly Material
G : Halogen and Lead Free Device
APL3510
APL3511
APL3510Ο K:
APL3510Ο
XXXXX
XXXXX - Date Code
Ο-Output Current/EN Function Code
APL3510Ο X:
L510Ο
XXX
XX
XXXXX - Date Code
Ο-Output Current/EN Function Code
APL3510Ο B:
L0ΟX
X - Date Code
Ο-Output Current/EN Function Code
APL3511Ο B:
L1ΟX
X - Date Code
Ο-Output Current/EN Function Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
VIN
VOUT
VENB, VEN
VOCB
TJ
(Note 1)
Rating
Unit
VIN Input Voltage (VIN to GND)
Parameter
-0.3 ~ 7
V
VOUT to GND Voltage
-0.3 ~ 7
V
EN, ENB to GND Voltage
-0.3 ~ 7
V
OCB to GND Voltage
-0.3 ~ 7
V
Maximum Junction Temperature
TSTG
Storage Temperature
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
150
o
-65 ~ 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
Parameter
Junction-to-Ambient Resistance in Free Air
Typical Value
Unit
(Note 2)
SOP-8
MSOP-8
SOT-23-5
θJA
160
160
235
o
C/W
Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
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APL3510/1
Recommended Operating Conditions (Note 3)
Symbol
VIN
Parameter
VIN Input Voltage
OUT Output Current (APL3510A/B, APL3511A/B)
IOUT
Range
Unit
2.7 ~ 5.5
V
0 ~2
OUT Output Current (APL3510C/D, APL3511C/D)
A
0 ~1
OUT Output Current (APL3510E/F)
0 ~0.3
TA
Ambient Temperature
-40 ~ 85
o
TJ
Junction Temperature
-40 ~ 125
o
C
C
Note 3 : Refer to the typical application circuit
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are
at TA=25oC.
Symbol
Parameter
APL3510/1
Test Conditions
Unit
Min.
Typ.
Max.
No load, VEN=0V or VENB=5V
-
-
1
µA
SUPPLY CURRENT
VIN Supply Current
No load, VEN=5V or VENB=0V
-
65
100
µA
Leakage Current
VOUT=GND, VEN=0V or VENB=5V
-
-
1
µA
Reverse Leakage Current
VIN=GND, VOUT=5V, VEN=0V or
VENB=5V
-
-
1
µA
SOP-8 Package
-
80
90
SOT-23-5 Package
-
75
90
MSOP-8 Package
-
70
90
1.7
-
2.65
V
-
0.2
-
V
APL3510A/B, APL3511A/B,
VIN=2.7V to 5.5V, TA= -40 ~ 85 oC
2.1
2.5
2.9
A
APL3510C/D, APL3511C/D,
VIN=2.7V to 5.5V, TA= -40 ~ 85 oC
1.1
1.5
1.9
A
APL3510E/F,
VIN=2.7V to 5.5V, TA= -40 ~ 85 oC
0.35
-
0.7
A
APL3510A/B, APL3511A/B,
VIN=2.7V to 5.5V
-
0.8
-
A
APL3510C/D, APL3511C/D,
VIN=2.7V to 5.5V
-
0.8
-
A
0.35
-
0.7
A
POWER SWITCH
RDS(ON)
Power Switch On Resistance
IOUT=1.5A,
TA= 25 oC
mΩ
UNDER-VOLTAGE LOCKOUT (UVLO)
VIN UVLO Threshold Voltage
VIN rising, TA= -40 ~ 85 oC
VIN UVLO Hysteresis
CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS
ILIM
ISHORT
Current Limit Threshold
Short-Circuit Output Current
APL3510E/F,
VIN=2.7V to 5.5V
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
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APL3510/1
Electrical Characteristics (Cont.)
Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are
at TA=25oC.
Symbol
Parameter
APL3510/1
Test Conditions
Unit
Min.
Typ.
Max.
IOCB=5mA
-
0.2
0.4
OCB Leakage Current
VOCB=5V
-
-
1
µA
OCB Deglitch Time
OCB assertion, TA= -40 ~ 85 oC
5
12
20
ms
OCB OUTPUT PIN
OCB Output Low Voltage
tD(OCB)
V
EN OR ENB INPUT PIN
VIH
Input Logic HIGH
VIN=2.7V to 5V
2
-
-
V
VIL
Input Logic LOW
VIN=2.7V to 5V
-
-
0.8
V
-
-
1
µA
Input Current
-
150
-
Ω
tD(ON)
Turn On Delay Time
-
30
-
µs
tD(OFF)
Turn Off Delay Time
-
30
-
µs
No load, COUT=1µF, VIN=5V
-
400
-
µs
TJ rising
-
140
-
°C
-
20
-
°C
VOUT Discharge Resistance
tSS
Soft-Start Time
VEN=0V or VENB=5V
OVER-TEMPERATURE PROTECTION (OTP)
TOTP
Over-Temperature Threshold
Over-Temperature Hysteresis
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
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APL3510/1
Typical Operating Characteristics
Switch On Resistance vs. Input
Voltage
Switch On Resistance vs. Junction
Temperature
140
130
VIN =5V, IOUT =1.5A, CIN =1µF/X7R,
COUT =10µF/X7R
Switch On Resistance, RDS(on) (mΩ)
Switch On Resistance, RDS(on) (mΩ)
160
120
SOP8
100
80
60
SOT-23-5
40
MSOP8
20
0
IOUT =1.5A, CIN =1µF/X7R, COUT =10µF/
X7R, TA=25oC
120
110
100
SOP8
90
80
70
MSOP8
60
SOT-23-5
50
-50
0
50
100
Junction Temperature ( oC)
150
2.5
Supply Current vs. Junction
Temperature
3.0
3.5
4.0
4.5
Input Voltage (V)
5.0
5.5
Supply Current vs. Input Voltage
60
100
Supply Current, ICC (µA)
Supply Current, ICC (µA)
55
80
60
40
20
VIN =5V, RLOAD = Open,
CIN =COUT =33µF/Electrolytic
0
-50
50
45
40
35
30
RLOAD = Open,
CIN =COUT =33µF/Electrolytic, TA=25℃
25
20
0
50
100
Junction Temperature ( oC)
150
2.5
Current Limit Threshold vs.
Junction Temperature
5.0
5.5
2.8
Current Limit Threshold, ILIM (A)
Current Limit Threshold, ILIM (A)
3.5
4.0
4.5
Input Voltage (V)
Current Limit Threshold vs.
Input Voltage
3.0
APL3510A/B
2.5
2.0
1.5
APL3510C/D
1.0
0.5
VIN =5V
0.0
-50
3.0
0
50
Junction Temperature
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
100
2.6
2.2
2.0
1.8
1.6
150
APL3510C/D
1.4
1.2
1.0
2.5
( oC)
APL3510A/B
2.4
TA =25oC
3.0
3.5
4.0
4.5
5.0
5.5
Input Voltage (V)
5
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APL3510/1
Typical Operating Characteristics (Cont.)
Current-Limit Response vs. Output
Peak Current
Current-Limit Response vs. Output
Peak Current
250
APL3510A/B,
VIN = 5V, TA=25oC
250
Current-Limit Response (µs)
Current-Limit Response (µs)
300
200
150
100
50
APL3510C/D,
VIN = 5V, TA=25oC
200
150
100
50
0
0
0
2
4
6
8
10
0
12
2
EN Pin Threshold Voltage, VEN (V)
VIN = 5V, TA=25oC
1.2
1.0
0.8
0.6
0.4
0.2
10
12
2.5
2.0
EN Rising
1.5
EN Falling
1.0
RLOAD =50Ω,
CIN = COUT =33µF/Elctrolytic
0.5
3.0
3.5
4.0
4.5
Input Voltage (V)
5.0
5.5
-50
EN Falling
VIN =5V, RLOAD =50Ω,
CIN = COUT =33µF/Elctrolytic, TA=25oC
3.5
4.0
4.5
5.0
3.5
VIN =5V, Shut-Down mode, R LOAD =0Ω,
CIN = COUT =33µF/Elctrolytic
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
5.5
0
50
100
150
Junction Temperature ( oC)
Input Voltage (V)
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
150
4.0
EN Rising
3.0
0
50
100
Junction Temperature ( oC)
Turn-Off Leakage Current vs.
Junction Temperature
EN Pin Threshold Voltage vs.
Input Voltage
2.5
8
3.0
1.4
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
6
EN Pin Threshold Voltage vs.
Junction Temperature
Turn-Off Leakage Current, ILEAK (µA)
EN Pin Threshold Voltage, VEN (V)
Short-Circuit Output Current, ISHORT (A)
Short-Circuit Output Current vs.
Input Voltage
0.0
2.5
4
Output Peak Current (A)
Output Peak Current (A)
6
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APL3510/1
Typical Operating Characteristics (Cont.)
Switch Off Supply Current vs.
Junction Temperature
18
VIN = 5V, RLOAD = Open,
CIN = COUT =33µF/Elctrolytic
OCB Deglitch Time, TD(OCB) (ms)
Switch Off Supply Current, ICC(off)(µA)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
0
50
100
OCB Deglitch Time vs. Junction
Temperature
17
16
15
14
13
12
11
RLOAD =1Ω,
CIN = COUT =33µF/Elctrolytic
10
9
150
-50
Junction Temperature ( oC)
18
100
150
3.2
UVLO Threshold Voltage, VUVLO (V)
OCB Deglitch Time, TD(OCB) (ms)
50
UVLO Threshold Voltage vs.
Junction Temperature
OCB Deglitch Time vs. Input Voltage
17
16
15
14
13
12
11
10
9
2.5
RLOAD =1Ω,
CIN = COUT =33µF/Elctrolytic
3.0
3.5
4.0
4.5
2.8
UVLO Rising
2.4
UVLO Falling
2.0
1.6
1.2
IOUT =15mA,
CIN = COUT =33µF/Elctrolytic
0.8
5.0
-50
5.5
0
50
100
150
Input Voltage (V)
Junction Temperature ( oC)
Turn-Off Falling Time vs. Junction
Temperature
Turn-On Rising Time vs. Junction
Temperature
700
200
VIN = 5V, RLOAD =30Ω,
CIN = 33µF/Elctrolytic, COUT =1µF/X7R
Turn-On Rising Time, tR (µs)
Turn-Off Falling Time, tF (µs)
0
Junction Temperature ( oC)
150
100
50
600
VIN = 5V, RLOAD =30Ω,
CIN = 33µF/Elctrolytic, C OUT =1µF/X7R
500
400
300
200
100
0
0
-50
0
50
Junction Temperature
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
100
-50
150
0
50
100
150
o
Junction Temperature ( C)
( oC)
7
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APL3510/1
Typical Operating Characteristics (Cont.)
Output Voltage vs. Output Current
6
APL3510A/B,
VIN = 5V, TA=25oC
5
Output Voltage, VOUT (V)
Output Voltage, VOUT (V)
Output Voltage vs. Output Current
6
4
3
2
APL3510C/D,
VIN = 5V, TA=25oC
5
4
3
2
1
1
0
0
0.0
0.5
1.0
1.5
2.0
2.5
0.0
3.0
Output Current (A)
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
0.5
1.0
1.5
2.0
Output Current (A)
8
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APL3510/1
Operating Waveforms
The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Turn On Response
Turn Off Response
VE NB
1
1
V E NB
V OUT
VOUT
2
2
VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic,
COUT =1µF/Electrolytic
VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic,
COUT =1µF/Electrolytic
CH1: VENB, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
TIME: 200µs/Div
CH1: VENB, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
TIME: 100µs/Div
UVLO at Rising
UVLO at Falling
VIN
V OUT
VIN
1
1
VOUT
2
2
VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic,
COUT =1µF/Electrolytic
VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic,
COUT =1µF/Electrolytic
CH1: VIN, 1V/Div, DC
CH2: VOUT, 1V/Div, DC
TIME:2ms/Div
CH1: VIN, 1V/Div, DC
CH2: VOUT, 1V/Div, DC
TIME:5ms/Div
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
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APL3510/1
Operating Waveforms (Cont.)
The test condition is VIN=5V, TA= 25oC unless otherwise specified.
OCB Response During Short Circuit
OCB Response During Over Load
VB A T
VE NB
V E NB
1
1
V CHRIN
V OCB
VOCB
2
2
IOUT
IOUT
3
3
VIN =5V, RLOAD =0Ω, CIN =COUT=33µF/
Electrolytic
VIN =5V, RLOAD =2Ω, CIN =COUT=33µF/
Electrolytic
CH1: VENB, 5V/Div, DC
CH2: VOCB, 5V/Div, DC
CH3: IOUT, 1A/Div, DC
TIME: 5ms/Div
CH1: VENB, 5V/Div, DC
CH2: VOCB, 5V/Div, DC
CH3: IOUT, 1A/Div, DC
TIME: 5ms/Div
OCB Response with Ramped Load
Load-Transient Response
V OCB
VOUT
2
VOUT
1
IOUT
1
IOUT
2
3
VIN =5V, CIN =COUT=33µF/Electrolytic
CH1: VOUT, 5V/Div, DC
CH2: VOCB, 5V/Div, DC
CH3: IOUT, 1A/Div, DC
TIME: 2ms/Div
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
VIN =5V, RLOAD =1kΩ to 2.2Ω, CIN =COUT=33µF/
Electrolytic
CH1: VOUT, 1V/Div, DC
CH2: IOUT, 1A/Div, DC
TIME: 1ms/Div
10
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APL3510/1
Pin Description
PIN
NO.
SOT-23-5
SOP-8/
MSOP-8 APL3510 APL3511
1
2
3
4
5
FUNCTION
NAME
2
2
GND
Ground.
4
5
VIN
Power Supply Input. Connect this pin to external DC supply.
3
4
EN
(A/C/E)
Enable Input. Pulling this pin to high will enable the device and pulling this pin to low
will disable device. The EN pin cannot be left floating.
ENB
(B/D/F)
Enable Input. Pulling this pin to high will disable the device and pulling this pin to low
will enable device. The ENB pin cannot be left floating.
1
3
OCB
Fault Indication Pin. This pin goes low when a current limit or an over-temperature
condition is detected after a 12ms deglitch time.
5
1
VOUT
Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or
EN is low, the output voltage is discharged by an internal resistor.
6
7
8
Block Diagram
VIN
VOUT
UVLO
Charge
Pump
EN/
ENB
Short-Circuit
Protection
Current
Limit
Gate Driver and
Control Logic
OCB
GND
OTP
Copyright ANPEC Electronics Corp.
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APL3510/1
Typical Application Circuit
3.3V
USB Port
5V
CIN
50kΩ
1µF
USB
Controller
VIN
VOUT
CBYP
APL3510A/B/C/D/E/F 0.1µF
APL3511A/B/C/D
OCB
COUT
150µF
VBUS
D+
DGND
EN/ENB
GND
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APL3510/1
Function Description
VIN Under-Voltage Lockout (UVLO)
compatible with both TTL and CMOS logic levels. The
The APL3510/1 series of power switches have a built-in
EN/ENB pin cannot be left floating.
under-voltage lockout circuit to keep the output shutting
off until internal circuitry is operating properly. The UVLO
Over-Temperature Protection
When the junction temperature exceeds 140oC, the inter-
circuit has hysteresis and a de-glitch feature so that it will
typically ignore undershoot transients on the input. When
nal thermal sense circuit turns off the power FET and
allows the device to cool down. When the device’s junc-
input voltage exceeds the UVLO threshold, the output
tion temperature cools by 20 oC, the internal thermal
sense circuit will enable the device, resulting in a pulsed
voltage starts a soft-start to reduce the inrush current.
Power Switch
The power switch is an N-channel MOSFET with a low
output during continuous thermal protection. Thermal
protection is designed to protect the IC in the event of
RDS(ON). The internal power MOSFET does not have the
body diode. When IC is off, the MOSFET prevents a cur-
over temperature conditions. For normal operation, the
junction temperature cannot exceed TJ=+125oC.
rent flowing from the VOUT back to VIN and VIN to VOUT.
Current-Limit Protection
The APL3510/1 series of power switches provide the current-limit protection function. During current limit, the devices limit output current at current limit threshold. For
reliable operation, the device should not be operated in
current limit for extended period.
Short-Circuit Protection
When the output voltage drops below VIN-1V, which is
caused by an over-load or a short-circuit, the devices limit
the output current down to a safe level. The short-circuit
current limit is used to reduce the power dissipation during short-circuit conditions. If the junction temperature
reaches over-temperature threshold, the device will enter the thermal shutdown.
OCB Output
The APL3510/1 series of power switches provide an
open-drain output to indicate that a fault has occurred.
When any of current-limit or over-temperature protection
occurs for a deglitch time of tD(OCB), the OCB goes low.
Since the OCB pin is an open-drain output, connecting a
resistor to a pull high voltage is necessary.
Enable/Disable
Pull the ENB above 2V or EN below 0.8V will disable the
device, and pull ENB pin below 0.8V or EN above 2V will
enable the device. When the IC is disabled, the supply
current is reduced to less than 1µA. The enable input is
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
13
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APL3510/1
Application Information
Input Capacitor
A 1µF or higher ceramic bypass capacitor from VIN to GND,
located near the APL3510/1, is strongly recommended to
suppress the ringing during short circuit fault event.
When the load current trips the SCP threshold in an over
load condition such as a short circuit, hot plug-in or heavy
load transient the IC immediately turns off the internal
power switch that will cause VIN ringing due to the inductance between power source and VIN. Without the bypass capacitor, the output short may cause sufficient ringing on the input to damage internal control circuitry.
Input capacitor is especially important to prevent VIN from
ringing too high in some applications where the inductance between power source to VIN is large (ex, an extra
bead is added between power source line to VIN for EMI
reduction), additional input capacitance may be needed
on the input to reduce voltage overshoot from exceeding
the absolute maximum voltage of the device during over
load conditions.
Output Capacitor
A low-ESR 150µF aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to reduce
the voltage droop during hot-attachment of downstream
peripheral. (Per USB 2.0, output ports must have a minimum 120µF of low-ESR bulk capacitance per hub).
Higher-value output capacitor is better when the output
load is heavy. Additionally, bypassing the output with a
0.1µF ceramic capacitor improves the immunity of the device to short-circuit transients.
Layout Consideration
The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop,
droop and EMI. The following guidelines must be
considered:
1. Please place the input capacitors near the VIN pin as
close as possible.
2. Output decoupling capacitors for load must be placed
near the load as close as possible for decoupling highfrequency ripples.
3. Locate APL3510 and output capacitors near the load to
reduce parasitic resistance and inductance for excellent load transient performance.
4. The negative pins of the input and output capacitors
and the GND pin must be connected to the ground plane
of the load.
5. Keep VIN and VOUT traces as wide and short as possible.
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
14
www.anpec.com.tw
APL3510/1
Package Information
SOP-8
D
E
E1
SEE VIEW A
h X 45
°
c
A
0.25
b
GAUGE PLANE
SEATING PLANE
A1
A2
e
L
VIEW A
S
Y
M
B
O
L
SOP-8
INCHES
MILLIMETERS
MIN.
MAX.
MIN.
MAX.
1.75
A
0.069
0.010
0.004
0.25
A1
0.10
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
e
0.049
1.27 BSC
0.050 BSC
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
0
0°
8°
0°
8°
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
15
www.anpec.com.tw
APL3510/1
Package Information
MSOP-8
D
b
0.25
A
A1
A2
c
L
GAUGE PLANE
SEATING PLANE
0
e
E
E1
SEE VIEW A
VIEW A
S
Y
M
B
O
L
MSOP-8
MILLIMETERS
MIN.
INCHES
MIN.
MAX.
MAX.
0.043
A
1.10
A1
0.00
0.15
0.000
0.006
A2
0.75
0.95
0.030
0.037
0.015
b
0.22
0.38
0.009
c
0.08
0.23
0.003
0.009
D
2.90
3.10
0.114
0.122
E
4.70
5.10
0.185
0.201
E1
2.90
3.10
0.114
0.122
e
0.65 BSC
0.026 BSC
L
0.40
0.80
0.016
0.031
0
0°
8°
0°
8°
Note: 1. Follow JEDEC MO-187 AA.
2. Dimension “D”does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil
per side.
3. Dimension “E1”does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 5 mil per side.
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
16
www.anpec.com.tw
APL3510/1
Package Information
SOT-23-5
D
e
E
E1
SEE
VIEW A
b
c
0.25
A
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-5
INCHES
MILLIMETERS
MIN.
MIN.
MAX.
A
MAX.
1.45
0.057
A1
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
0.020
b
0.30
0.50
0.012
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
0.118
0.071
E
2.60
3.00
0.102
E1
1.40
1.80
0.055
e
0.95 BSC
e1
1.90 BSC
0.037 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
17
www.anpec.com.tw
APL3510/1
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOP-8
Application
MSOP-8
Application
SOT-23-5
A
H
T1
C
d
D
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
T1
C
d
D
W
E1
F
1.5 MIN.
20.2 MIN.
4.0±0.10
8.0±0.10
A
H
330.0±2.00
50 MIN.
P0
P1
12.4+2.00 13.0+0.50
-0.00
-0.20
W
E1
12.0±0.30 1.75±0.10
12.0±0.30 1.75±0.10
F
5.5±0.05
5.5±0.05
P2
D0
D1
T
A0
B0
K0
2.00±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
5.30±0.20
3.30±0.20
1.40±0.20
4.00±0.10
8.00±0.10
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
4.0±0.10
4.0±0.10
(mm)
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
18
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APL3510/1
Devices Per Unit
Package Type
Unit
Quantity
SOP-8
Tape & Reel
2500
MSOP-8
Tape & Reel
3000
SOT-23-5
Tape & Reel
3000
Taping Direction Information
SOP-8
USER DIRECTION OF FEED
MSOP-8
USER DIRECTION OF FEED
SOT-23-5
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
19
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APL3510/1
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright ANPEC Electronics Corp.
Rev. A.9 - Apr., 2018
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APL3510/1
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
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