APL3553ABI-TRG

APL3553 USB Power-Distribution Switches Features General Description  62mΩ Power Switch On Resistance The APL3553 series of power switches are designed for USB applications. The 62mΩ N-channel MOSFET power switch satisfies the voltage drop requirements of USB specification. The protection features include current-limit protection, short-circuit protection, and over-temperature protection. The device limits the output current at current limit thresh ld level. When VOUT drops below VIN-1V, the devices limit the current to a lower and safe level. The over-temperature protection limits the junction temperature below 140oC in case of short circuit or over load conditions. Other features include a deglitched OCB output to indicate the fault condition and an enable input to enable or disable the device.  Wide Supply Voltage Range: 2.7V to 5.5V  Fix Current Limit Protection  Fast Over current Response: 2us (typ.)  Over-Temperature Protection  Fault Indication Output  Enable Input  Built-in Soft-Start  Reverse Input-Output Voltage Protection: 25mV (typ.)  UL Approved-File No. E328191  UL-CB Scheme IEC/EN62368-1 Certified  TUV IEC/EN62368-1 Certified Simplified Application Circuit Applications 5V USB Port VIN ●● Notebook and Desktop Computers ●● USB Ports VOUT APL3553A/B/C/D ●● High-Side Power Protection Switchs ●● MHL Ports OCB USB Controller EN/ENB GND Pin Configuration VOUT 1 5 VIN GND 2 OCB 3 4 EN/ENB 8 VOUT VIN 2 7 VOUT VIN 3 6 NC 5 OCB EN/ENB 4 SOT-23-5 (Top View) EN/ENB 1 GND 1 MSOP-8 (Top View) 6 OCB GND 2 5 VOUT VIN 3 4 VOUT SOT-23-6 (Top View) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 1 www.anpec.com.tw APL3553 Ordering and Marking Information APL3553 Assembly Material Handling Code Temperature Range Package Code Output Current/EN Function Package Code B: SOT-23-5 C: SOT-23-6 X:MSOP-8 Operating Ambient Temperature Range I : -40 to 85oC Handling Code TR : Tape & Reel Output Current/EN Function A : 2A/Active High B : 2A/Active Low C : 1A/Active High D : 1A/Active Low Assembly Material G: Halogen and Lead Free Device APL3553 B: 53OX X – Date Code O – EN Function Code APL3553 C: 53OX X – Date Code O – EN Function Code APL3553 X: L553O XXX XX X – Date Code O – EN Function Code Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol VIN VOUT VENB, VEN VOCB TJ (Note 1) Parameter Rating Unit VIN Input Voltage (VIN to GND) -0.3 ~ 7 V VOUT to GND Voltage -0.3 ~ 7 V EN, ENB to GND Voltage -0.3 ~ 7 V OCB to GND Voltage -0.3 ~ 7 Maximum Junction Temperature TSTG Storage Temperature TSDR Maximum Lead Soldering Temperature, 10 Seconds V 150 o C -65 ~ 150 o C 260 o C Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 2 www.anpec.com.tw APL3553 Thermal Characteristics Symbol Parameter Junction-to-Ambient Resistance in Free Air Typical Value θJA Junction-to-Case Resistance in Free Air Unit (Note 2) SOT-23-5 SOT-23-6 MSOP-8 260 250 160 SOT-23-5 SOT-23-6 MSOP-8 130 120 50 o C/W o C/W (Note 2) θJC Note 2 : θJA and θJC is measured with the component mounted on a high effective thermal conductivity test board in free air. Recommended Operating Conditions Symbol VIN IOUT Parameter VIN Input Voltage (Note3) Range Unit 2.7 ~ 5.5 V OUT Output Current (APL3553A/B) 0 ~2 OUT Output Current (APL3553C/D) 0 ~1 A TA Ambient Temperature -40 ~ 85 o C TJ Junction Temperature -40 ~ 125 o C Note 3 : Refer to the typical application circuit CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 3 www.anpec.com.tw APL3553 Electrical Characteristics Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC. Symbol Parameter Test Conditions APL3553 Unit Min. Typ. Max. No load, VEN=0V or VENB=5V - - 1 µA SUPPLY CURRENT VIN Supply Current No load, VEN=5V or VENB=0V - 65 - µA Leakage Current VOUT=GND, VEN=0V or VENB=5V - - 1 µA Reverse Leakage Current VIN=GND, V OUT =5V, V EN =0V or VENB=5V - - 1 µA I OUT= 1 . 5 A , TA= 25 oC - 62 78 mΩ 1.7 - 2.65 V - 0.2 - V 2.1 2.5 2.9 A 1.1 1.5 1.9 A - 1.5 - A - 0.8 - A VIN =5V - 2 - us IOCB=5mA - 0.2 0.4 V OCB Leakage Current VOCB=5V - - 1 µA OCB Deglitch Time OCB assertion, TA= -40 ~ 85 oC 5 12 20 ms POWER SWITCH RDS(ON) Power Switch On Resistance SOT-23-5 Package UNDER-VOLTAGE LOCKOUT (UVLO) VIN UVLO Threshold Voltage VIN rising, TA= -40 ~ 85 oC VIN UVLO Hysteresis CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS ILIM ISHORT Current Limit Threshold Short-Circuit Output Current APL3553A/B VIN=2.7V to 5.5V, TA= 25 oC APL3553C/D VIN=2.7V to 5.5V, TA= 25 oC APL3553A/B VIN=2.7V to 5.5V APL3553C/D VIN=2.7V to 5.5V TIOS Response time of over current OCB OUTPUT PIN OCB Output Low Voltage tD(OCB) EN OR ENB INPUT PIN VIH Input Logic HIGH VIN=2.7V to 5V 1.4 - - V VIL Input Logic LOW VIN=2.7V to 5V - - 0.6 V - - 1 µA - 150 - Ω - 80 - µs - 5 - µs No load, COUT=1µF, VIN=5V 500 - 2000 µs VIN=3.3V,CIN=1uF,COUT=1uF,RL=10Ω 500 - 2000 µs - 140 - °C - 20 - °C Input Current VOUT Discharge Resistance tD(ON) tD(OFF) tSS VEN=0V or VENB=5V Turn On Delay Time Turn Off Delay Time Soft-Start Time OVER-TEMPERATURE PROTECTION (OTP) TOTP Over-Temperature Threshold TJ rising Over-Temperature Hysteresis REVERSE VOLTAGE PROTECT IREV VREV TREV Reverse current trip point Enable reverse current protection - 100 - mA Reverse voltage comparator trip point VIN -VOUT , disable reverse current protection - 25 - mV VIN=5V 3 5 7 ms Time from reverse current condition to MOSFET turn off CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 4 www.anpec.com.tw APL3553 Typical Operating Characteristics 90 130 VIN=5V IOUT=1.5A CIN=10µF COUT=10µF Switch On Resistance, RDS(on) (mΩ) Switch On Resistance, RDS(on) (mΩ) 110 Switch On Resistance vs. Junction Temperature 70 50 -50 120 -10 30 70 O 110 Junction Temperature ( C) 70 3 3.5 4 4.5 Input Voltage (V) 5 5.5 Supply Current vs. Input Voltage 120 110 Supply Current, ICC (µA) 100 80 60 40 VIN=5V RLOAD=OPEN CIN=10µF COUT=10µF 20 0 -50 4 -10 30 70 110 Junction Temperature (OC) 2 APL3553A/B VIN=5V -50 -10 30 70 110 Junction Temperature (OC) CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 RLOAD=OPEN CIN=10µF COUT=10µF TA=25OC 70 3.0 3 0 80 50 2.5 150 Current Limit Threshold vs. Junction Temperature 1 90 60 Current Limit Threshold, ILIM (A) Supply Current, ICC (µA) 90 50 2.5 100 Current Limit Threshold, ILIM (A) IOUT=1.5A CIN=10µF COUT=10µF TA=25OC 110 150 Supply Current vs. Junction Temperature Switch On Resistance vs. Input Voltage 5 3.5 4 4.5 Input Voltage (V) 5 5.5 Current Limit Threshold vs. Input Voltage 2.9 2.8 2.7 2.6 2.5 2.5 150 3 APL3553A/B TA=25oC 3 3.5 4 4.5 Input Voltage (V) 5 5.5 www.anpec.com.tw APL3553 Typical Operating Characteristics (Cont.) Current- Limit Response vs. Output Peak Current 20 10 2 4 6 8 Output Peak Current (A) 10 VIN =5V RLOAD=0Ω CIN =10µF COUT=10µF SD mode 1 -10 30 70 110 Junction Temperature (OC ) 0.8 UVLO Threshold Voltage vs . Junction Temperature UVLO Falling 1.5 IOUT=15mA CIN =10µF COUT=10µF 1 -10 30 70 110 Junction Temperature ( OC ) CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 -10 30 70 110 Junction Temperature( OC) 150 16 12 8 VIN =5V RLOAD=1Ω CIN =10µF COUT=10µF 4 100 2.5 2 VIN =5V RLOAD=50Ω CIN =10µF COUT=10µF 0.4 0 -50 150 ULVO Rising 0.5 -50 EN Falling OCB Deglitch Time vs . Junction Temperature 2 3 1.2 Turn- Off Leakage Current vs . Junction Temperature 3 0 -50 EN Rising 1.6 0 -50 12 OCB Deglitch Time, TD(OCB) (ms) 0 4 Turn-Off Leakage Current, ILEAK (µA) EN Pin Threshold Voltage, VEN (V) APL3553 VIN=5V TA =25o C 30 0 UVLO Threshold Voltage, VUVLO (V) 2 Turn-Off Falling Time, tF (µs) Current-Limit Response (µs) 40 EN Pin Threshold Voltage vs . Junction Temperature 6 30 70 110 Junction Temperature ( OC) 150 Turn- Off Falling Time vs . Junction Temperature VIN =5V RLOAD=30Ω CIN =10µF COUT=1µF 80 60 40 20 0 -50 150 -10 -10 30 70 110 Junction Temperature ( OC ) 150 www.anpec.com.tw APL3553 Typical Operating Characteristics (Cont.) Turn-On Rising Time, tR (µs) 700 Turn- On Rising Time vs. Junction Temperature 600 500 400 300 VIN=5V RLOAD=30Ω CIN =10µF COUT=1µF 200 100 0 -50 -10 30 70 110 Junction Temperature (OC) CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 150 7 www.anpec.com.tw APL3553 Operating Waveforms Turn On Response Turn Off Response VENB 1 1 VOUT 2 VENB VOUT 2 VIN=5V,COUT=10µF/Electrolytic, CIN=10µF/Electrolytic,RLOAD=30Ω CH1:VENB,5V/Div, DC CH2:VOUT,2V/Div, DC TIME:200µs/Div VIN=5V,COUT=10µF/Electrolytic, CIN=10µF/Electrolytic,RLOAD=30Ω CH1:VENB,5V/Div, DC CH2:VOUT,2V/Div, DC TIME:100µs/Div UVLO at Rising UVLO at Falling VIN VIN 1 2 1 VOUT 2 VIN=5V,COUT=10µF/Electrolytic, CIN=10µF/Electrolytic,RLOAD=30Ω CH1:VIN,1V/Div, DC CH2:VOUT,1V/Div, DC TIME:4ms/Div CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 VOUT VIN=5V,COUT=10µF/Electrolytic, CIN=10µF/Electrolytic,RLOAD=30Ω CH1:VIN,1V/Div, DC CH2:VOUT,1V/Div, DC TIME:4ms/Div 8 www.anpec.com.tw APL3553 Operating Waveforms (Cont.) OCB(FLAG/FAULT) Response During Short Circuit VENB 1 1 VOCB 2 3 OCB(FLAG/FAULT) Response During Over Load 2 IOUT 3 VIN=5V,COUT=10µF/Electrolytic, CIN=10µF/Electrolytic,RLOAD=0Ω CH1:VENB,5V/Div, DC CH2:VOCB,5V/Div, DC CH3:IOUT,1A/Div, DC TIME:4ms/Div VENB VOCB IOUT VIN=5V,COUT=10µF/Electrolytic, CIN=10µF/Electrolytic,RLOAD=1Ω CH1:VENB,5V/Div, DC CH2:VOCB,5V/Div, DC CH3:IOUT,1A/Div, DC TIME:4ms/Div OCB(FLAG/FAULT) Response with Ramped Load Load-Transient Response VOCB 2 VOUT VOUT 1 3 1 IOUT 2 VIN=5V,COUT=10µF/Electrolytic, CIN=10µF/Electrolytic CH1:VOUT,5V/Div, DC CH2:VOCB,5V/Div, DC CH3:IOUT,1A/Div, DC TIME:2ms/Div CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 IOUT VIN=5V,COUT=10µF/Electrolytic, CIN=10µF/Electrolytic,IOUT=0 to 2A CH1:VOUT,1V/Div, DC CH2:IOUT,1A/Div, DC TIME:2µs/Div 9 www.anpec.com.tw APL3553 Pin Descriptions PIN FUNCTION SOT-23-5 SOT-23-6 MSOP-8 NAME 2 2 1 GND Ground. 5 3 2,3 VIN Power Supply Input. Connect this pin to external DC supply. EN Enable Input. Pulling this pin to high will enable the device and pulling this pin to low will disable device. The EN pin cannot be left floating. 4 1 (A/C) 4 ENB (B/D) Enable Input. Pulling this pin to high will disable the device and pulling this pin to low will enable device. The ENB pin cannot be left floating. 3 6 5 OCB Fault Indication Pin. This pin goes low when a current limit or an overtemperature condition is detected after a 12ms deglitch time. 1 4,5 7,8 VOUT Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or EN is low, the output voltage is discharged by an internal resistor. - - 6 NC No connection. Block Diagram Reverse Voltage Protect CS IN UVLO EN/ENB Current Limit Charge Pump Gate Driver and Control Logic OTP CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 OUT 10 2us Response OCB GND www.anpec.com.tw APL3553 Parameter Measurement Information 2.65V 2.65V VIN 0V EN 0V 90%VOUT 10%VOUT VOUT TD(ON) 80us IOUT OCB VOUT>1.5V 0V TSS 400us TON 10ms Current Limit 0A high high low TIOS 2us NO TD(OCB) TD(OCB) 12ms Figure 1. Sequence of Power On & Current Limit & OCB Indicate RCP release trip point 25mV VIN-VOUT -6mV 1.5V (see Figure 1). Since the OCB pin is an open-drain output, connecting a resistor to a pull high voltage is necessary. Enable/Disable Pull the ENB above 1.4V or EN below 0.6V will disable the device, and pull ENB pin below 0.6V or EN above 1.4V will enable the device. When the IC is disabled, the supply current is reduced to less than 1mA. The enable input is compatible with both TTL and CMOS logic levels. The EN/ ENB pin cannot be left floating. Over-Temperature Protection When the junction temperature exceeds 140 o C, the internal thermal sense circuit turns off the power FET and allows the device to cool down. When the device’s junction temperature cools by 20 oC, the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed to protect the IC in the event of over temperature conditions. For normal operation, the junction temperature cannot exceed TJ=+125oC. CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 13 www.anpec.com.tw APL3553 Applications and Implementation Input Capacitor Recommended Minimum Footprint 1.88 1.435 2.578 Unit : mm 0.94 0.5 SOT-23-5 1.88 Unit : mm 1.435 2.578 10mF or higher ceramic bypass capacitor from VIN to GND, located near the APL3553, is strongly recommended to suppress the ringing during short circuit fault event. When the load current trips the SCP threshold in an over load condition such as a short circuit, hot plug-in or heavy load transient the IC immediately turns off the internal power switch that will cause VIN ringing due to the inductance between power source and VIN. Without the bypass capacitor, the output short may cause sufficient ringing on the input to damage internal control circuitry. Input capacitor is especially important to prevent VIN from ringing too high in some applications where the inductance between power source to VIN is large (ex, an extra bead is added between power source line to VIN for EMI reduction), additional input capacitance may be needed on the input to reduce voltage overshoot from exceeding the absolute maximum voltage of the device during over load conditions. Output Capacitor A low-ESR 150uF aluminum electrolytic between OUT and GND is strongly recommended to reduce the voltage droop during hot-attachment of downstream peripheral. Highervalue output capacitor is better when the output load is heavy. Additionally, bypassing the output with a 0.1uF ceramic capacitor improves the immunity of the device to short-circuit transients. 0.94 0.5 SOT-23-6 Layout Consideration The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop, droop and EMI. The following guidelines must be considered: 1.Please place the input capacitors near the IN pin as close as possible. 2.Output decoupling capacitors for load must be placed near the load as close as possible for decoupling high frequency ripples. 3.Locate APL3553 and output capacitors near the load to reduce parasitic resistance and inductance for excellent load transient performance. 4.The negative pins of the input and output capacitors and the GND pin must be connected to the ground plane of the load. 5.Keep IN and OUT traces as wide and short as possible. 6.The traces routing the RILIM resistor to the APL3553 should be as short as possible to reduce parasitic effects on the current limit accuracy. CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 14 0.35 8 7 6 5 2 3 4 1.5 3.9 1 Unit : mm 0.65 MSOP-8 www.anpec.com.tw APL3553 Package Information SOT-23-5 SEE VIEW GAUGE PLANE SEATING PLANE VIEW A S Y M B O L SOT-23-5 INCHES MILLIMETERS MIN. TYP MAX. MIN. TYP A 1.10 1.20 1.30 0.043 0.047 0.051 A1 0.00 0.05 0.15 0.000 0.002 0.00 6 A2 0.90 1.10 1.3 0 0.035 0.0 43 0.0 51 b 0.30 0.40 0.50 0.012 0.01 6 0.020 c 0.08 0. 17 0.22 0.003 0.0 07 0.009 D 2.80 2.9 0 3.00 0.110 0.114 0.118 E 2.80 3.00 0.110 0.114 0.118 E1 1.40 1.80 0.055 0.063 0.071 2.90 1.6 0 e 0.95 BSC 0.037 BSC e1 1.90 BSC 0.075 BSC L 0.30 0. 45 0.60 0° 4° 8° 0 aaa CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 0.012 0° 0.10 0.018 4° MAX. 0.024 8° 0.004 15 www.anpec.com.tw APL3553 Package Information SOT-23-6 D e E E1 SEE VIEW A c b 0.25 A L GAUGE PLANE SEATING PLANE 0 A1 A2 e1 VIEW A S Y M B O L SOT-23-6 MILLIMETERS MIN. INCHES 0.057 1.45 0.000 0.006 1.30 0.035 0.051 0.50 0.012 0.020 0.009 0.00 0.15 A2 0.90 b 0.30 A1 MAX. MIN. MAX. A c 0.08 0.22 0.003 D 2.70 3.10 0.106 0.122 E 2.60 3.00 0.102 0.118 E1 1.40 1.80 0.055 0.071 e 0.95 BSC e1 1.90 BSC 0.037 BSC 0.075 BSC L 0.30 0.60 0.012 0 0° 8° 0° 0.024 8° Note : 1. Follow JEDEC TO-178 AB. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 16 www.anpec.com.tw APL3553 Package Information MSOP-8 D b 0.25 A A1 A2 c L GAUGE PLANE SEATING PLANE 0 e E E1 SEE VIEW A VIEW A S Y M B O L MSOP-8 MILLIMETERS MIN. INCHES MIN. MAX. A MAX. 0.043 1.10 0.15 0.000 0.006 0.75 0.95 0.030 0.037 0.22 0.38 0.009 0.015 c 0.08 0.23 0.003 0.009 A1 0.00 A2 b D 2.90 3.10 0.114 0.122 E 4.70 5.10 0.185 0.201 E1 2.90 3.10 0.114 e 0.65 BSC 0.122 0.026 BSC L 0.40 0.80 0.016 0.031 0 0° 8° 0° 8° Note: 1. Follow JEDEC MO-187 AA. 2. Dimension“D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension“E1”does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 5 mil per side. CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 17 www.anpec.com.tw APL3553 Carrier Tape & Reel Dimensions P0 P1 P2 A B0 W F E1 OD0 K0 B A0 A OD1 B T SECTION A-A SECTION B-B H A d T1 Application SOT-23-5 Application SOT-23-6 Application MSOP-8 A H 178.0±2.00 50 MIN. P0 P1 T1 8.4+2.00 -0.00 P2 4.0±0.10 4.0±0.10 2.0±0.05 A H 178.0±2.00 50 MIN. P0 P1 T1 8.4+2.00 -0.00 P2 4.0±0.10 4.0±0.10 2.0±0.05 A H 330.0±2.00 50 MIN. P0 P1 4.00±0.10 8.00±0.10 CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 T1 12.4+2.00 -0.00 P2 2.00±0.05 C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00 C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00 C d D W E1 F 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 D1 A0 B0 K0 3.20±0.20 3.10±0.20 1.50±0.20 d T 0.6+0.00 -0.40 D W E1 F 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 D1 T 0.6+0.00 -0.40 D A0 B0 K0 3.20±0.20 3.10±0.20 1.50±0.20 W E1 F 1.75±0.10 5.5±0.05 B0 K0 3.30±0.20 1.40±0.20 1.0 MIN. 1.0 MIN. d 13.0+0.50 1.5 MIN. -0.20 D0 D1 1.5+0.10 -0.00 18 20.2 MIN. T 0.6+0.00 1.5 MIN. -0.40 12.0±0.30 A0 5.30±0.20 (mm) www.anpec.com.tw APL3553 Devices Per Unit Package Type Unit Quantity SOT-23-5 Tape & Reel 3000 SOT-23-6 Tape & Reel 3000 MSOP-8 Tape & Reel 3000 Taping Direction Information SOT-23-5 USER DIRECTION OF FEED SOT-23-6 USER DIRECTION OF FEED AAAX CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 AAAX AAAX AAAX 19 AAAX AAAX AAAX www.anpec.com.tw APL3553 Taping Direction Information MSOP-8 USER DIRECTION OF FEED Classification Profile CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 20 www.anpec.com.tw APL3553 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body Temperature (Tp)* See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Time 25°C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Volume mm3 350 220 °C 220 °C Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness 2.5 mm Volume mm3 2000 260 °C 245 °C 245 °C Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 21 Description 5 Sec, 245°C 1000 Hrs, Bias @ Tj=125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM ≧ 2KV VMM ≧ 200V 10ms, 1tr ≧ 100mA www.anpec.com.tw APL3553 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 CopyrightANPEC Electronic Corp. Rev. A.15 – Mar., 2020 22 www.anpec.com.tw