APL5316-33BI-TRG

APL5316 Low Dropout 300mA Linear Regulator With Power-Ok Indicator Features • • • • • • • • • • • Wide Operating Voltage: 2.8~6V Fixed Output Voltage in the range of 0.8V~5.5V Low Dropout Voltage: 170mV(typical) @ 300mA Guaranteed 300mA Output Current Power-Ok Indicator Current Limit Protection with Foldback Current Internal Soft-Start Over Temperature Protection Stable with Low ESR Ceriamic Capacitors SOT-23-5 Package Lead Free and Green Devices Available (RoHS Compliant) General Description The APL5316 is a low dropout linear regulator which needs only a single input voltage supply from 2.8 to 6V, and it can deliver output current up to 300mA. It can work with low ESR ceramic capacitors and ideally use in the battery-powered applications, such as notebook computers and cellular phones. Its typical dropout voltage is only 170mV at 300mA loading. A power-ok detection indicates the output status at POK pin. The current limit protection (with foldback current) and thermal shutdown functions protect the device against current overloads and over temperature. The APL5316 is available in a SOT-23-5 package. Pin Configuration VIN 1 GND 2 SHDN 3 APL5316 SOT-23-5 4 POK 5 VOUT Applications • • • Cellular Phones Portable and Battery-powered Equipment Notebook and Personal Computers Ordering and Marking Information APL5316 Assembly Material Handling Code Temperature Range Package Code Voltage Code Package Code B : SOT-23-5 Operating Junction Temperature Range I : -40 to 85° C Handling Code TR : Tape & Reel Voltage Code 12 : 1.2V 33 : 3.3V Assembly Material L : Lead Free Device G: Halogen and Lead Free Device X - Date code APL5316 -12 B: 365X APL5316 -33 B: 36RX Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright © ANPEC Electronics Corp. Rev. A.21 Aug, 2008 1 www.anpec.com.tw APL5316 Simplified Application Circuits APL5316 1 CIN VIN VOUT 5 POK COUT R1 APL5316 1 CIN VIN VOUT 5 R1 POK 4 POK COUT VIN VOUT VIN VOUT 3 SHDN GND 2 POK 4 3 SHDN GND 2 VIN Absolute Maximum Ratings Symbol VIN VSHDN PD TJ TSTG TSDR Parameter VIN Supply Voltage (VIN to GND) SHDN Input Voltage (SHDN to GND) Power Dissipation Junction Temperature Storage Temperature Maximum Lead Soldering Temperature, 10 Seconds Rating -0.3 ~ 6.5 -0.3 ~ 6.5 Internally Limited -40 ~ 150 -65 ~ 150 260 Unit V V W ° C ° C ° C Thermal Characteristics Symbol θJA θJC Parameter Thermal Resistance-Junction to Ambient Thermal Resistance- Junction to Case (Note 1) Typical Value 240 130 Unit o C/W C/W o Note 1 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Recommended Operating Conditions Symbol VIN VOUT IOUT COUT TJ VIN Supply Voltage Output Voltage VOUT Output Current Output Capacitor Junction Temperature Parameter Range 2.8 ~ 6 Fixed Voltage 0 ~ 300 1.5 ~ 22 -40 ~ 125 Unit V V mA µF o C C opyright © A NPEC Electronics Corp. Rev. A.2 - Aug, 2008 2 www.anpec.com.tw APL5316 Electrical Characteristics Unless otherwise specified, these specifications apply over VIN = VOUT+1V (min VIN=2.8V), IOUT=0~300mA, CIN = 1µF, COUT = 2.2µF, TA = -40 to 85oC. Typical values are at TA = 25oC. Symbol VIN IQ Parameter Input Voltage Quiescent Current Output Voltage Accuracy REGLINE Line Regulation REGLOAD Load Regulation VDROP PSRR ILIMIT ISHORT Dropout Voltage Power Supply Ripple Rejection Ratio Current Limit Foldback Current SHDN Input Voltage High SHDN Input Voltage Low Shutdown VIN Supply Current SHDN Pull Low Resistance VOUT Discharge MOSFET RDS(ON) Over Temperature Threshold Over Temperature Hysteresis TSS VPOK VPNOK Soft-Start Interval POK threshold Voltage for Power Ok POK threshold Voltage for Power Not Ok POK Low Voltage VOUT Rising VOUT falling POK sinks 5mA SHDN = Low SHDN = Low, VIN = 6V VOUT = 0V IOUT =10mA ~300mA IOUT=10mA ΔVOUT%/ΔVIN, IOUT=10mA ΔVOUT%/ΔIOUT VOUT = 3.3V, IOUT = 300mA f = 10kHz, IOUT = 300mA Test Conditions Min. 2.8 -2 -0.06 -0.2 450 1.6 89 78 APL5316 Typ. 135 170 45 600 80 0.1 3 60 160 40 60 92 81 0.25 Max. 6 160 +2 +0.06 +0.2 300 V 0.4 1 95 84 0.4 µA MΩ Ω ° C ° C µs %VOUT %VOUT V V µA % %/V %/A mV dB mA mA Unit C opyright © A NPEC Electronics Corp. Rev. A.2 - Aug, 2008 3 www.anpec.com.tw APL5316 Typical Operating Characteristics Quiescent Current vs. Supply Voltage 160 140 Quiescent Current, IQ (µA) 120 100 80 60 40 20 0 0 1 2 3 4 5 6 7 Supply Voltage, VIN (V) IOUT= 0mV Quiescent Current vs. Junction Temperature 138 136 Quiescent Current, IQ (µA) 134 132 130 128 126 -50 -25 0 25 50 75 100 125 Junction Temperature, T J (° C) Quiescent Current vs. Output Current 180 160 Quiescent Current, IQ (µA) 140 VIN=5.5V PSRR (dB) 0 -10 -20 PSRR vs. Frequency VIN=3.3V, VOUT=1.2V CIN=1µF, COUT=2.2µF IOUT=300mA 120 100 80 60 0 50 100 -30 -40 -50 -60 VIN=4.5V 150 200 250 300 1000 10000 100000 1000000 Output Current, I OUT (mA) Frequency (Hz) Dropout Voltage vs. Output Current 250 VOUT=3.3V Dropout Voltage, VDROP (mV) 200 TJ=75° C TJ=125° C TJ=25° C Current Limit vs. Junction Temperature 650 VIN=5V 150 Current Limit, ILIMIT (mA) 600 550 100 TJ=0° C TJ=-50° C 500 50 0 0 100 200 Output Current, IOUT (mA) 300 450 -50 -25 0 25 50 75 Junction Temperature, T J (° C) 100 125 C opyright © A NPEC Electronics Corp. Rev. A.2 - Aug, 2008 4 www.anpec.com.tw APL5316 Typical Operating Characteristics (Cont.) Loop Gain vs. Frequency 50 40 30 20 Loop Gain (dB) 10 0 -10 -20 -30 -40 1000 10000 100000 1000000 Frequency (Hz) IOUT=300mA 40 20 0 1000 10000 100000 Frequency (Hz) 1000000 IOUT=100mA 160 Phase vs. Frequency 140 120 Phase (degree) 100 80 60 VIN=3.3V, VOUT=1.2V, CIN=1µF, C OUT=2.2µF IOUT=300mA VIN=3.3V, VOUT=1.2V, CIN=1µF, COUT=2.2µF IOUT=100mA Operating Waveforms Load Transient VIN=3.3V, VOUT=1.2V, CIN=1µF, COUT=2.2µF, TR=1µs Line Transient VOUT=1.2V, CIN=1µF, COUT=2.2µF, TR=10µs, IOUT=10mA V OUT V IN V OUT IOUT CH1 : VOUT, 50mV/div, AC CH2 : IOUT, 100mA/div, DC Time : 100µs/div CH1 : VIN, 1V/div, DC CH2 : VOUT, 20mV/div, AC Time : 100µs/div C opyright © A NPEC Electronics Corp. Rev. A.2 - Aug, 2008 5 www.anpec.com.tw APL5316 Operating Waveforms (Cont.) Enable VOUT=1.2V Shutdown VOUT=1.2V V OUT V OUT V SHDN V SHDN I OUT I OUT CH1 : VOUT, 500mV/div CH2 : VSHDN, 5V/div CH3 : IOUT, 200mA/div Time : 50µs/div CH1 : VOUT, 500mV/div CH2 : V , 5V/div SHDN CH3 : IOUT, 200mA/div DC Time : 10µs/div Power on Power off V IN V IN V OUT V OUT I OUT I OUT CH1 : VIN, 2V/div CH2 : VOUT, 500mV/div CH3 : IOUT, 100mA/div Time : 200µs/div CH1 : VIN, 2V/div CH2 : VOUT, 500mV/div, CH3 : IOUT, 100mA/div Time : 50ms/div C opyright © A NPEC Electronics Corp. Rev. A.2 - Aug, 2008 6 www.anpec.com.tw APL5316 Operating Waveforms (Cont.) POK VIN 1 2 VOUT POK 3 IOUT 4 CH1 : VIN, 2V/div CH2 : VOUT, 1V/div, CH3 : POK, 2V/div CH4 : IOUT, 200mA/div Time : 1ms/div Pin Description PIN No 1 2 3 4 5 NAME VIN GND SHDN POK VOUT Voltage supply input pin Ground pin Shutdown control pin, logic high: enable; logic low: shutdown Power-ok signal output pin Regulator output pin FUNCTION C opyright © A NPEC Electronics Corp. Rev. A.2 - Aug, 2008 7 www.anpec.com.tw APL5316 Block Diagram SHDN Shutdown Logic Thermal Shutdown + Current Limit VIN VOUT POK X92% + GND 0.8V Typical Application Circuit 1 VIN APL5316 1 CIN VIN VOUT POK GND 2 1KΩ 5 4 POK VOUT 3 SHDN 1μF COUT R1 2.2μF VIN 2.2µF/GRM155R60J225M Murata C opyright © A NPEC Electronics Corp. Rev. A.2 - Aug, 2008 8 www.anpec.com.tw APL5316 Typical Application Circuit (Cont.) 2. VIN APL5316 1 CIN 1μF VIN VOUT POK 5 4 1KΩ VOUT R1 3 SHDN GND 2 POK COUT 2.2μF Function Description Internal Soft-Start An internal soft-start function controls rising rate of the output voltage to limit the surge current at start-up. The typical soft-start interval is about 60µs. Shutdown Control Power-ok (POK) The APL5316 indicates the status of the output voltage. As the VOUT rises and reaches the Power-ok threshold (VPOK), the IC turns off the internal NMOS of the POK to indicate the output is ok. As the VOUT falls and reaches the falling Power-ok threshold (VPNOK), the IC immediately turns on the NMOS of the POK to indicate the output is not ok. The resistance of the resistor R1 connected from VOUT to POK or VIN to POK should be in the range from 1K to 50K. Thermal Shutdown A thermal shutdown circuit limits the junction temperature of the APL5316. When the junction temperature exceeds +160 οC, a thermal sensor turns off the output PMOS, allowing the device to cool down. The regulator regulates the output again through initiation of a new softstart cycle after the junction temperature cools by 40οC. The thermal shutdown is designed with a 40οC hysteresis to lower the average junction temperature during continuous thermal overload conditions, extending life time of the device. The APL5316 has an active-low shutdown function. Forcing SHDN high (>1.6V) enables the VOUT; forcing SHDN low ( 2KV, VMM > 200V 10ms, 1tr > 100mA www.anpec.com.tw C opyright © A NPEC Electronics Corp. Rev. A.2 - Aug, 2008 APL5316 Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Time 25°C to Peak Temperature Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds See table 1 10-30 seconds 6°C/second max. 6 minutes max. Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds See table 2 20-40 seconds 6°C/second max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface. Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness