APL5611/A
Low Dropout Linear Regulator Controller
Features
General Description
•
Wide Supply Voltage Range from 4.5 to 13.5V
•
High Output Accuracy Over Operating Temperature
The APL5611/A is a low dropout linear regulator controller.
The APL5611/A could drive an external N-Channel
MOSFET and provide an adjustable output by using an
external resistive divider.
and Loading Ranges
•
Fast Transient Response
•
Power-On-Reset Monitoring on VCC
•
Programmable Soft-Start
•
Low Shutdown Current
•
Enable Control Function
•
Under-Voltage Protection
•
Two Versions of IC Available:
The APL5611/A integrates various functions. For example,
a Power-On-Reset (POR) circuit monitors VCC supply
voltage to prevent wrong operations; the function of Under-Voltage Protection (UVP) protects the device from short
circuit condition. The soft-start of output voltage is adjustable by the external capacitor on SS pin. Moreover, the
APL5611/A can be enabled by other power system;
namely, holding the EN above 1.6V enables output and
- APL5611: UVP Activated after VOUT is Ready
- APL5611A: UVP Activated after VCC is Supplied
•
SOT-23-6 Package
•
Lead Free and Green Devices Available
pulling the EN under 0.4 disables output.
The APL5611/A is available in a SOT-23-6 package.
(RoHS Compliant)
Simplified Application Circuit
Applications
VCC
VIN
•
Notebook PC Applications
•
Motherboard Applications
SS
VCC
DRV
APL5611/A
VOUT
ON
EN
Pin Configuration
OFF
APL5611/A
FB
GND
-
EN 1
6 VCC
GND 2
5 DRV
FB 3
EN
4 SS
SOT-23-6
(Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp.
Rev. A.5 - Oct., 2012
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APL5611/A
Ordering and Marking Information
Package Code
C : SOT-23-6
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5611
APL5611A
Assembly Material
Handling Code
Temperature Range
Package Code
APL5611 C:
L11X
X - Date Code
APL5611A C:
LA1X
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1 )
Symbol
VCC
Parameter
Rating
Unit
VCC Input Voltage (VCC to GND)
-0.3 to 15
V
EN, SS, to GND Voltage
-0.3 to 7
V
VFB
FB to GND Voltage
-0.3 to 7
V
VDRV
DRV to GND Voltage
TJ
TSTG
TSDR
-0.3 to VCC+0.3
Maximum Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
V
150
o
-65 to 150
o
260
o
C
C
C
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristic
Symbol
θJA
Parameter
Typical Value
Junction-to-Ambient Resistance in Free Air (Note 2)
SOT-23-6
Unit
o
250
C/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operating Conditions (Note 3)
Symbol
Parameter
VCC
VCC Input Voltage (VCC to GND)
VEN
EN to GND Voltage
VOUT
VOUT Output Voltage
TA
Ambient Temperature
TJ
(Note4)
Range
Unit
4.5 to 13.5
V
0 to 5.5
V
0.8 ~ VIN - VDROP
Junction Temperature
V
-40 to 85
o
-40 to 125
o
C
C
Note 3: Refer to the typical application circuit.
Note 4: VDROP defined as the VIN -VOUT voltage at VOUT = 98% normal VOUT. The linear regulator must provide the output MOSFET with
sufficient Gate-to-Source voltage (VGS = VCC - VOUT) to regulate the output voltage.
Copyright ANPEC Electronics Corp.
Rev. A.5 - Oct., 2012
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APL5611/A
Electrical Characteristics
Unless otherwise specified, these specifications apply over VCC = 5/12V, TA = -40 to 85 oC. Typical values are at TA =25oC.
Symbol
Parameter
APL5611/A
Test Conditions
Unit
Min.
Typ.
Max.
VCC = 12V
-
0.8
1.0
VCC = 5V
-
0.8
1.0
VCC = 12V, EN=GND
-
-
5
VCC = 5V, EN=GND
-
-
5
3.8
4.0
4.2
V
-
0.4
-
V
SUPPLY CURRENT
ICC
VCC Supply Current
ISD
VCC Shutdown Current
mA
µA
POWER-ON-RESET (POR)
VCC POR Threshold
VCC rising
VCC POR Hysteresis
REFERENCE VOLTAGE
VREF
Reference Voltage
VCC = 12V, TA = 25 oC
-
0.8
-
V
Reference Voltage Accuracy
VCC = 12V
-1
-
1
%
Line Regulation
VCC = 4.5V to 13.2V
FB Input Current
-1.5
-
1.5
%
-100
-
100
nA
ERROR AMPLIFIER
PSRR
Unity Gain Bandwidth
VCC = 5/12V
Open Loop DC Gain
VCC =12V, No Load
Power Supply Rejection Ratio
VCC =12V, 100Hz, No Load
VDRV (high) DRV High Voltage
VDRV (low) DRV Low Voltage
IDRV (source) DRV Source Current
IDRV (sink)
DRV Sink Current
-
2
-
MHz
60
80
-
dB
dB
50
-
-
VCC =12V, IDRV (SOURCE) = 5mA, VFB = 0.6V
11.2
11.5
-
VCC =5V, IDRV (SOURCE) = 5mA, VFB = 0.6V
-
4.7
-
VCC =12V, IDRV (SINK) = 5mA, VFB = 1V
-
0.5
1
VCC =5V, IDRV (SINK) = 5mA, VFB = 1V
-
0.8
-
VCC =12V, VDRV =6V, VFB = 0.6V
-
50
-
VCC =5V, VDRV =2.5V, VFB = 0.6V
-
10
-
VCC =12V, VDRV =6V, VFB = 1V
-
40
-
VCC =5V, VDRV =2.5V, VFB = 1V
-
10
-
0.55
0.8
1.05
V
-
50
-
mV
-
2
-
µs
-
5
-
µA
3
4.5
6
µA
68
75
82
%
-
5
-
µs
V
V
mA
mA
ENABLE
VEN (TH)
EN Logic High Threshold Voltage
VEN rising, TA=25oC
EN Hysteresis
EN Shutdown Debounce
VEN falling
EN Internal Pull High Current
SOFT-START
ISS
SS Current
UNDER-VOLTAGE PROTECTION (UVP)
VUV (TH)
Under-Voltage Threshold
VEN =5V, VFB falling
UVP Debounce Interval
Copyright ANPEC Electronics Corp.
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APL5611/A
Typical Operating Characteristics
Feedback Voltage vs. Junction
Temperature
Supply Current vs. Supply Voltage
0.50
0.900
0.45
Feedback Voltage (V)
Supply Current (mA)
0.875
IC Enabled
0.40
0.35
0.30
0.25
0.20
0.15
IC Disabled
0.10
0.850
0.825
0.800
0.775
0.750
0.725
0.05
0.700
-50
0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
0
25
50
75
100
125
Junction Temperature (oC)
Supply Voltage (V)
DRV Source Current vs. DRV Voltage
DRV Sink Current vs. DRV Voltage
70
45
40
60
35
DRV Sink Current (µA)
DRV Sink Current (µA)
-25
30
25
20
15
10
VIN = 12V, VFB=1V,
TA=25oC
5
50
40
30
20
10
VIN = 12V, VFB=0.75V,
TA=25oC
0
0
0
2
4
6
8
10
0
12
DRV Voltage (V)
Copyright ANPEC Electronics Corp.
Rev. A.5 - Oct., 2012
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4
6
8
10
12
DRV Voltage (V)
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APL5611/A
Operating Waveforms
The test condition TA= 25oC unless otherwise specified.
Turn On Response
Turn Off Response
VCC
VCC
V DRV
1
1
VFB
2
VOUT
VDRV
2
VFB
3
3
V OUT
4
4
VCC=5V, VIN =5V, VOUT =1.5V, CIN =33µF/
Electrolytic, C OUT =120µF/Electrolytic,
CSS =0.01µF
CH1: VCC, 2V/Div, DC
CH2: VDRV, 2V/Div, DC
CH3: VFB, 0.5V/Div, DC
CH4: VOUT, 0.5V/Div, DC
TIME: 2ms/Div
VCC=5V, VIN =5V, VOUT =1.5V, CIN =33µF/
Electrolytic, C OUT =120µF/Electrolytic,
CSS =0.01µF
CH1: VCC, 2V/Div, DC
CH2: VDRV, 2V/Div, DC
CH3: VFB, 0.5V/Div, DC
CH4: VOUT, 0.5V/Div, DC
TIME: 50ms/Div
Load Transient Response-1
Load Transient Response-2
V OUT
VOUT
1
1
I LOA D
ILOA D
2
2
VCC=5V, VIN =5V, VOUT=1.2V,
ILOAD =0-5-0A(rising/falling edge=1A/µs ),
CIN =22µF/MLCC, C OUT =100µF/Electrolytic,
VCC=5V, VIN =5V, VOUT=1.5V,
ILOAD =0-5-0A(rising/falling edge=1A/µs ),
CIN =22µF/MLCC, C OUT =22µF/MLCC,
CH1: VOUT, 50mV/Div, AC
CH2: IOUT, 2A/Div, DC
CH1: VOUT, 50mV/Div, AC
CH2: IOUT, 2A/Div, DC
TIME:100µs/Div
TIME:20µs/Div
Copyright ANPEC Electronics Corp.
Rev. A.5 - Oct., 2012
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APL5611/A
Operating Waveforms (Cont.)
The test condition TA= 25oC unless otherwise specified.
Short Circuit Response
Load Transient Response-3
VOUT
VDRV
1
V OUT
1
2
IOUT
2
IOUT
3
VCC=5V, VIN =5V, VOUT=1.5V,
ILOAD =0-0.2-0A(rising/falling edge=1A/µs ),
CIN =22µF/MLCC, C OUT =22µF/MLCC,
VCC=5V, VIN =5V, VOUT =1.5V,
CIN =22µF/MLCC,COUT =22µF/MLCC,
CH1: VDRV, 2V/Div, DC
CH2: VOUT, 0.5V/Div, DC
CH3: IOUT, 20A/Div, DC
CH1: VOUT, 20mV/Div, AC
CH2: IOUT, 100mA/Div, DC
TIME:100µs/Div
Copyright ANPEC Electronics Corp.
Rev. A.5 - Oct., 2012
TIME: 50µs/Div
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APL5611/A
Pin Description
PIN
FUNCTION
NO.
NAME
1
EN
2
GND
3
FB
Voltage Feedback Pin. Connecting this pin to an external resistor divider receives the feedback voltage
of the regulator.
4
SS
Connect this pin to a capacitor for soft-start.
5
DRV
This pin drives the gate of an external N-channel MOSFET for linear regulator.
6
VCC
Power input pin of the device. The voltage at this pin is monitored for Power-On-Reset purpose.
Enable control pin. Pulling the EN high enables the VOUT; forcing the EN low (VEN IOUT(max)
4. Package Thermal Resistance θ(JA): Select a package
capacitor is 1µF.
of MOSFET that can dissipate the heat, θ(JA) < (TJ –TA)/PD,
where TJ is the maximum allowable Junction tempera-
Output Capacitor
ture of MOSFET, TA is the ambient temperature, PD is the
maximum power dissipation on MOSFET, calculated as
The APL5611/A needs a proper output capacitor to maintain circuit stability and to improve transient response
over temperature and current. In order to insure the cir-
below:
PD =(VIN(max) –VOUT(min)) x IOUT(max)
cuit stability, the proper output capacitor value should be
larger than 10µF. With X5R and X7R dielectrics, 22µF is
sufficient at all operating temperatures.
Power Sequencing (Only for APL5611A)
Soft-Start Capacitor
At start-up, it is necessary to ensure that the VIN (the voltage supplied to MOSFET drain), VCC and V EN are sequenced correctly to avoid erroneous latch-off. To avoid
The soft-start capacitor on SS pin can reduce the inrush
current and overshoot of output voltage. The capacitor is
UVP latch-off happened at start-up due to sequencing
issues, the key method is the VIN should be larger than
charge to VCC with a constant 4.5µA (typ.) current source,
ISS. This results in a linear charge of the soft-start capacitor
the output under-voltage threshold plus the drop through
the pass MOSFET when that output is enabled.
and thus the output voltage. The soft-start period, tss,
ends once the capacitor voltage reaches 0.8V (typ.). The
Figure 1 and 2 show the two types of power on sequence.
Figure 1 shows the VCC comes up before the VIN, and then
soft-start capacitor is calculated using the equation:
CSS = (ISS x tSS) / 0.8
Where CSS is the soft-start capacitor. ISS is the soft-start
the output would be enabled when the VEN is applied.
Figure 2 shows the VIN comes up before the VCC, and then
current of SS pin. TSS is the soft-start time you set for your
application.
the output can either be enabled with the VCC or VEN. Recommended power on sequence is shown in Figure1 and
2.
Copyright ANPEC Electronics Corp.
Rev. A.5 - Oct., 2012
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APL5611/A
Application Information (Cont.)
Power Sequencing (Only for APL5611A) (Cont.)
VCC
VIN
VCC
CVCC
VIN
CVIN
VUV(TH)
VEN(TH)
VEN
VCC
DRV
VOUT
APL5611
APL5611A
VEN(TH) occurs after
VUV(TH) is reached
R1
FB
Figure 1. APL5611A supply comes up before MOSFET
drain supply
GND
VCC
VIN
R2
COUT
Load
Figure 3
Layout Consideration
VUV(TH)
Figure 3 illustrates the layout. Below is a checklist for
VEN
your layout:
VEN(TH)
1. Please place the input capacitor CVCC close to the VCC
pin.
VOUT
2. Please place the CVIN close to the MOSFET’s drain.
3. Layout a copper plane for N-channel MOSFET’s drain
VEN(TH) occurs after
VUV(TH) is reached
to improve the heat dissipation.
4. Output capacitor COUT for load must be placed near the
Figure 2. MOSFET drain supply comes up before
APL5611A supply
load as close as possible.
5. Large current paths, the bold lines in figure 3, must
Short Circuit Concerns (Only for APL5611)
have wide tracks.
Since the APL5611 UVP function is activated after the VOUT
reaches 90% level, any combinations of sequence among
VIN, VCC, and VEN are allowable. However, please note that
the advantage of none-power-sequencing brings a
drawback. If and only if a short circuit condition of output
voltage occurs before V IN supply, the UVP won’t be
activated. Thus, the short circuit current persists to flow
and could impair the MOSFET. If in your application the
short circuit is most likely to be encountered before VIN
supply, we suggest you use the APL5611A instead of the
APL5611, who can provide this short circuit protection.
Nevertheless, if the V IN supply can provide the OCP
protection, this short circuit won’t be an issue in APL5611.
Copyright ANPEC Electronics Corp.
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APL5611/A
Package Information
SOT-23-6
-T-
D
SEATING PLANE < 4 mils
e
E
E1
SEE VIEW A
b
c
0.25
A
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-6
MILLIMETERS
MIN.
INCHES
MAX.
A
MAX.
MIN.
0.057
1.45
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
b
0.30
0.50
0.012
0.020
A1
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
e
0.95 BSC
e1
L
0
0.071
0.037 BSC
1.90 BSC
0.075 BSC
0.30
0.60
0.012
0°
8°
0°
0.024
8°
Note : 1. Follow JEDEC TO-178 AB.
2. Dimension D and E1 do not include mold flash, protrusions or
gate burrs. Mold flash, protrusion or gate burrs shall not exceed
10 mil per side.
Copyright ANPEC Electronics Corp.
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APL5611/A
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOT-23-6
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
4.0±0.10
4.0±0.10
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOT-23-6
Tape & Reel
3000
Copyright ANPEC Electronics Corp.
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APL5611/A
Taping Direction Information
SOT-23-6
USER DIRECTION OF FEED
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
Classification Profile
Copyright ANPEC Electronics Corp.
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APL5611/A
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness