APM3020P
P-Channel Enhancement Mode MOSFET
Features
• • • •
-30V/-11A, RDS(ON) = 17mΩ(typ.) @ VGS = -10V RDS(ON) = 24mΩ(typ.) @ VGS = -5V Super High Density Cell Design Reliable and Rugged TO-252 Package
Pin Description
G
D
S
Applications
Top View of TO-252
•
Power Management in Notebook Computer, Portable Equipment and Battery Powered Systems
Ordering and Marking Information
APM 3020P
H a n d lin g C o d e T e m p. R a ng e P a c ka g e C o d e P ackage C ode U : T O -2 5 2 O p e ra tin g J u n c tio n T e m p . R a n g e C : -5 5 to 1 2 5 ° C H a n d lin g C o d e TU : Tube TR : Tape & Reel
APM 3020P U :
APM 3020P XXXXX
X X X X X - D a te C o d e
Absolute Maximum Ratings
Symbol VDSS VGSS ID* IDM PD Drain-Source Voltage Gate-Source Voltage Parameter
(TA = 25°C unless otherwise noted)
Rating -30 ±20 -40 -70 50 20 Unit V A W
Maximum Drain Current – Continuous Maximum Drain Current – Pulsed Maximum Power Dissipation TA=25 ºC TA=100 ºC
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2002 1 www.anpec.com.tw
APM3020P
Absolute Maximum Ratings
Symbol TJ TSTG RθJC Parameter Maximum Junction Temperature Storage Temperature Range Thermal Resistance – Junction to Case
(TA = 25°C unless otherwise noted)
Rating 150 -55 to 150 2.5 Unit ºC ºC ºC/W
Electrical Characteristics
Symbol Static BVDSS IDSS VGS(th) IGSS RDS(ON)a VSDa
b
(TA = 25°C unless otherwise noted)
APM3020P Min. -30 -1 -1 17 24 -1.3 23 10 9 VDD=-15V , IDS=-6A , VGEN=-10 V , RG=1Ω RL=2.5Ω VGS=0V VDS=-25V Frequency=1.0MHz 16 22 75 31 3720 580 245 pF 30 30 120 80 ns -3 ±100 20 30 -1.3 30 nC Typ. Max.
Parameter
Test Condition
Unit
Drain-Source Breakdown Voltage VGS=0V , IDS=-250A Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage VDS=-24V , VGS=0V VDS=VGS , IDS=-250µA VGS=±20V , VDS=0V VGS=-10V , IDS=-11A VGS=-5V , IDS=-7A ISD=-11A, VGS=0V VDS=-15V , VGS=-4.5V, IDS=-4.6A
V µA V nA mΩ V
Dynamic Qg Total Gate Charge Qgs Qgd td(ON) Tr td(OFF) Tf Ciss Coss Crss
Notes
a b
Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
: Guaranteed by design, not subject to production testing : Pulse test ; pulse width ≤ 500µs, duty cycle ≤ 2%
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APM3020P
Typical Characteristics
Output Characteristics
50
VGS=4,5,6,7,8,9,10V
Transfer Characteristics
50
-IDS-Drain Current (A)
30
20
-IDS-Drain Current (A)
40
40
30
V GS=3V
20
TJ=125°C TJ=25°C TJ=-55°C
10
VGS=2.5V
10
0
0
2
4
6
8
10
0
0
1
2
3
4
5
-VDS-Drain-to-Source Voltage (V)
-VGS-Gate-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.50
-IDS=250µA
On-Resistance vs. Drain Current
0.035
-VGS(th)-Threshold Voltage (V) (Normalized)
RDS(ON)-On-Resistance (Ω)
1.25 1.00 0.75 0.50 0.25 0.00 -50
0.030
-VGS=5V
0.025 0.020 0.015 0.010 0.005
-VGS=10V
-25
0
25
50
75
100 125 150
0
5
10
15
20
25
30
Tj-Junction Temperature (°C)
-IDS-Drain Current (A)
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APM3020P
Typical Characteristics Cont.
On-Resistance vs. Gate-to-Source Voltage
0.15
-IDS=7A
On-Resistaence vs. Junction Temperature
0.030
-V GS=10V -IDS=11A
RDS (ON)-On-Resistance (Ω)
0.12
RDS(ON)-On-Resistance (Ω) (Normalized)
0.025 0.020 0.015 0.010 0.005 0.000 -50
0.09
0.06
0.03
0.00
0
2
4
6
8
10
-25
0
25
50
75
100 125 150
-VGS - Gate-to-Source Voltage (V)
Tj-Junction Temperature (°C)
Gate Charge
10 3000
-VDS =15V -IDS=4.6A
Capacitance Characteristics
-VGS-Gate-to-Source Voltage (V)
C-Capacitance (pF)
8
2500
Ciss
2000 1500 1000 500 0
Coss Crss
6
4
2
0 0
10
20
30
40
0
5
10
15
20
25
30
QG-Total Gate Charge (nC)
-VDS-Drain-to-Source Voltage (V)
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2002
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APM3020P
Typical Characteristics Cont.
Source-Drain Diode Forward Voltage
50
Single Pulse Power
3000 2500 2000
10
-ISD-Source Current (A)
Power (W)
1
TJ=150°C TJ=25°C
1500 1000 500
0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0 -5 10
10
-4
10
-3
10
-2
10
-1
10
0
10
1
-VSD-Source-to-Drain Voltage (V )
Time (sec)
Normalized Transient Thermal Transient Impedence, Junction to Ambient
1
Normalized Effective Transient Thermal Impedance
Duty Cycle=0.5
D=0.2
0 .1
D=0.1
D=0.05 D=0.02 D=0.01 SINGLE PULSE
1. Duty Cycle , D=t1/t2 2. Per Unit Base=RthJA=50°C/W 3. TJM-TA=PDMZthJA
0 .0 1 -5 10
10
-4
10
-3
10
-2
10
-1
10
0
10
1
Square Wave Pulse Duration (sec)
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APM3020P
Packaging Information
TO-252( Reference JEDEC Registration TO-252)
E b2 L2 A C1
D H L1 L b e1 C A1
Dim A A1 b b2 C C1 D E e1 H L L1 L2
Mi ll im et er s Min . 2. 1 8 0. 8 9 0. 5 08 5. 2 07 0. 4 6 0. 4 6 5. 3 34 6. 3 5 3. 9 6 9. 3 98 0. 5 1 0. 6 4 0. 8 9 1. 0 2 2. 0 32
6
Inc he s Ma x . 2. 3 9 1. 2 7 0. 8 9 5. 4 61 0. 5 8 0. 5 8 6. 2 2 6. 7 3 5. 1 8 10 . 41 Min . 0. 0 86 0. 0 35 0. 0 20 0. 2 05 0. 0 18 0. 0 18 0. 2 10 0. 2 50 0. 1 56 0. 3 70 0. 0 20 0. 0 25 0. 0 35 0. 0 40 0. 0 80
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Ma x . 0. 0 94 0. 0 50 0. 0 35 0. 2 15 0. 0 23 0. 0 23 0. 2 45 0. 2 65 0. 2 04 0. 4 10
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2002
APM3020P
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
temperature
Peak temperature
183°C Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/ Convection Average ramp-up rate(183°C to Peak) 3°C/second max. 120 seconds max Preheat temperature 125 ± 25°C) 60 – 150 seconds Temperature maintained above 183°C Time within 5°C of actual peak temperature 10 –20 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 6 minutes max. Time 25°C to peak temperature VPR 10 °C /second max. 60 seconds 215-219°C or 235 +5/-0°C 10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm and all bgas Convection 220 +5/-0 °C VPR 215-219 °C IR/Convection 220 +5/-0 °C pkg. thickness < 2.5mm and pkg. volume ≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 235 +5/-0 °C VPR 235 +5/-0 °C IR/Convection 235 +5/-0 °C
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APM3020P
Reliability test program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 SEC 1000 Hrs Bias @ 125°C 168 Hrs, 100% RH, 121°C -65°C ~ 150°C, 200 Cycles
Carrier Tape
Po E P P1 D
t
F W
Bo
Ao
Ko D1
T2
J C A B
T1
Application
A 330 ±3
B 100 ± 2 D 1.5 +0.1
C 13 ± 0. 5 D1 1.5± 0.25
J 2 ± 0.5 Po 4.0 ± 0.1
T1 16.4 + 0.3 -0.2 P1 2.0 ± 0.1
T2 2.5± 0.5 Ao 6.8 ± 0.1
W 16+ 0.3 - 0.1 Bo 10.4± 0.1
P 8 ± 0.1 Ko 2.5± 0.1
E 1.75± 0.1 t 0.3±0.05
TO-252
F 7.5 ± 0.1
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APM3020P
Cover Tape Dimensions
Application TO- 252 Carrier Width 16 Cover Tape Width 13.3 Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2002
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