APM4430
N-Channel Enhancement Mode MOSFET
Features
• • • •
30V/23A , RDS(ON)=4.5mΩ(typ.) @ VGS=10V RDS(ON)=7mΩ(typ.) @ VGS=5V Super High Dense Cell Design for Extremely Low RDS(ON) Reliable and Rugged SO-8 Package
Pin Description
4 3 2 1
5 6 7 8
Applications
•
Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems .
SO − 8
Ordering and Marking Information
APM 4430
H a n d lin g C o d e Tem p. R ange P ackage C ode P ackage C ode K : S O -8 O p e ra tin g J u n c tio n T e m p . R a n g e C : -5 5 to 1 5 0 ° C H a n d lin g C o d e TU : Tube TR : Tape & Reel
APM 4430 K :
APM 4430 XXXXX
X X X X X - D a te C o d e
Absolute Maximum Ratings
Symbol VDSS VGSS ID IDM Drain-Source Voltage Gate-Source Voltage Maximum Drain Current – Continuous Maximum Drain Current – Pulsed Parameter
(TA = 25°C unless otherwise noted)
Rating 30 V ±20 23 A ± 60 Unit
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001 1 www.anpec.com.tw
APM4430
Absolute Maximum Ratings
Symbol PD TJ TSTG RthJA Parameter Maximum Power Dissipation* Maximum Junction Temperature Storage Temperature Range Thermal Resistance – Junction to Ambient TA = 25°C TA = 70°C
(TA = 25°C unless otherwise noted)
Rating 1.6 W 0.625 150 °C -55 to 150 80 °C/W Unit
* Surface Mounted on FR4 Board, t ≤ 10 sec.
Electrical Characteristics
Symbol Static BVDSS Drain-Source Breakdown IDSS Zero Gate Voltage Drain Current Parameter
(TA=25°C unless otherwise noted)
Test Condition
APM4430 Min. Typ. Max.
Unit
VGS=0V, ID=250µA VDS=24V, VGS=0V VDS =24V, VGS =0V, T j = 55°C VDS=VGS, ID=250µA VGS=±20V, VDS=0V VGS=10V, ID=23A VGS=5V, ID=17A IS=6A, VGS=0V
30 1 5 1 3
V µA µA V
VGS(th) Gate Threshold Voltage IGSS RDS(ON) VSD Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage
±100 nA 4.5 7 0.6 5 8 1.1 mΩ V
Dynamic Qg Qgs Qgd td(ON) tr td(OFF) tf Ciss Coss Crss Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance VGS=0V VDS=15V Frequency=1.0MHz
2
VDS=15V, VGS=4.5V, ID=23A
40 17 14 30
55
nC nC nC
45 24
ns ns ns ns pF pF pF
VDD=15V, ID=1A, VGEN=10V, RG=0.2Ω
16
100 150 55 4800 900 320 70
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
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APM4430
Typical Characteristics
Output Characteristics
80 70
VGS=5,6,7,8,9,10V VGS=4.5V V GS=4V
Transfer Characteristics
60 48 36
TJ=25°C
ID-Drain Current (A)
60 50 40 30 20 10
ID-Drain Current (A)
24
TJ=125°C TJ=-55°C
12 0 1.0
V GS=3V
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1.5
2.0
2.5
3.0
3.5
4.0
VDS-Drain-to-Source Voltage (V)
VGS-Gate-to-Source Voltage (V)
Threshold Voltage
0.4
ID=250uA
On-Resistance vs. Drain Current
0.010
RDS(on)-On-Resistance(Ω)
0.2
VGS(th)-Variance (V)
0.008 0.006
V GS=5V
0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -50 -25 0 25 50 75 100 125 150
VGS=10V
0.004 0.002 0.000
0
10
20
30
40
50
60
TJ-Junction Temperature (°C)
ID-Drain Current (A)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
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APM4430
Typical Characteristics
On-Resistance vs. Gate-to-Source Voltage
0.016
ID=23A
On-Resistance vs. Junction Temperature
0.008
V GS=10V ID = 23A
RDS(on)-On Resistance (Ω)
0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 2 4 6 8 10
RDS(on)-On Resistance (Ω)
0.007 0.006 0.005 0.004 0.003 0.002 0.001
0.000 -50 -25
0
25 50 75 100 125 150
VGS-Gate-to-Source Voltage (V)
TJ-Junction Temperature (°C )
On-Resistance vs. Junction Temperature
1.8
Gate Charge
10
VDS=15V ID = 23A
1.6 1.4 1.2 1.0 0.8 0.6 -50 -25
VGS-Gate-Source Voltage (V)
25 50 75 100 125 150
RDS(on)-On-Resistance(Ω) (Normalized)
V GS=10V ID = 23A
8 6 4 2 0 0 10 20 30 40 50 60 70 80 90
0
TJ-Junction Temperature (°C)
QG-Gate Charge (nC)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
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APM4430
Typical Characteristics
Capacitance
7000 6000 70
Source-Drain Diode Forward Voltage
Capacitance (pF)
5000 4000 3000 2000 1000 0 0 5 10 15 20
Ciss
IS-Source Current (Α)
10
TJ=150°C TJ=25°C
Coss Crss
25
30
1 0.0
0.2
0.4
0.6
0.8
1.0
1.2
VDS-Drain-to-Source Voltage (V)
VDS-Source-to-Drain Voltage (V )
Single Pulse Power
60 100 50
ID M ID
Safe Operation Area
ID-Drain Current (A)
10us
Power (W)
40 30 20 10 0 -2 10
10
100us 1ms
1
10ms 100ms
VG S =10V Single Pulse TC=25°C
0.1
DC
10
-1
10
0
10
1
10
2
0.01 0.01
0.1
1
10
100
Time (sec)
VDS-Drain-to-Source Voltage (V)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
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APM4430
Typical Characteristics
S
2
Normalized Effective Transient Thermal Impedance
1
Duty Cycle=0.5 0.2 0.1
0.1
0.05 0.02 SINGLE PULSE
0.01 -4 10 10
-3
1.Duty Cycle,D=t1/t2 2.Per Unit Base=R thJA=80°C 3.TJM-TA=PD MZ t h J A 4.Surface Mounted
10
-2
10
-1
10
0
10
1
10
2
Square Wave Pulse Duration (sec)
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APM4430
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
E
H
e1 D
e2
A1
A
1 L
0.004max.
Dim A A1 D E H L e1 e2 φ1
Mi ll im et er s Min . 1. 35 0. 10 4. 80 3. 80 5. 80 0. 40 0. 33 1. 27B S C 8° Max . 1. 75 0. 25 5. 00 4. 00 6. 20 1. 27 0. 51 Min. 0. 053 0. 004 0. 189 0. 150 0. 228 0. 016 0. 013
0.015X45
Inche s Max . 0. 069 0. 010 0. 197 0. 157 0. 244 0. 050 0. 020 0. 50B S C 8°
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
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APM4430
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb). Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
temperature
Peak temperature
183°C Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/ Convection Average ramp-up rate(183°C to Peak) 3°C/second max. 120 seconds max Preheat temperature 125 ± 25°C) 60 – 150 seconds Temperature maintained above 183°C Time within 5°C of actual peak temperature 10 –20 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 6 minutes max. Time 25°C to peak temperature VPR 10 °C /second max.
60 seconds 215-219°C or 235 +5/-0°C 10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm and all bgas Convection 220 +5/-0 °C VPR 215-219 °C IR/Convection 220 +5/-0 °C pkg. thickness < 2.5mm and pkg. volume ≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 235 +5/-0 °C VPR 235 +5/-0 °C IR/Convection 235 +5/-0 °C
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APM4430
Reliability test program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 SEC 1000 Hrs Bias @ 125°C 168 Hrs, 100% RH, 121°C -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
t E Po P P1 D
F W
Bo
Ao
D1 T2
Ko
J C A B
T1
Application
SOP-8 Application SOP-8
A 330±1 F 5.5 ± 0.1
B 62 ± 1.5
C 12.75 + 0.1 5
J 2 + 0.5
T1 12.4 +0.2 P1 2.0 ± 0.1
T2 2± 0.2 Ao 6.4 ± 0.1
W 12 + 0.3 - 0.1 Bo 5.2± 0.1
P 8± 0.1
E 1.75± 0.1
D D1 Po 1.55±0.1 1.55+ 0.25 4.0 ± 0.1
Ko t 2.1± 0.1 0.3±0.013
(mm)
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APM4430
Cover Tape Dimensions
Application SOP- 8 Carrier Width 12 Cover Tape Width 9.3 Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
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