APM4500
Dual Enhancement Mode MOSFET (N-and P-Channel)
Features
•
N-Channel 20V/8A , RDS(ON)=22mΩ(typ.) @ VGS=4.5V RDS(ON)=30mΩ(typ.) @ VGS=2.5V
Pin Description
S1 G1 S2 G2 1 2 3 4 8 7 6 5 D1 D1 D2 D2
•
P-Channel -20V/-4.3A , RDS(ON)=80mΩ(typ.) @ VGS=-4.5V RDS(ON)=105mΩ(typ.) @ VGS=-2.5V
SO-8
• • •
Super High Dense Cell Design for Extremely Low RDS(ON) Reliable and Rugged SO-8 Package
G1 G2 D1 D1 S2
Applications
S1 D2 D2
•
Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems.
N-Channel MOSFET
P-Channel MOSFET
Ordering and Marking Information
APM4500
Handling Code Temp. Range Package Code Package Code K : SO-8 Operation Junction Temp. Range C : -55 to 150°C Handling Code TR : Tape & Reel
APM4500 K :
APM4500 XXXXX
XXXXX - Date Code
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 1 www.anpec.com.tw
APM4500
Absolute Maximum Ratings
Symbol VDSS VGSS ID* IDM PD TJ TSTG RθjA Parameter Drain-Source Voltage Gate-Source Voltage Maximum Drain Current – Continuous Maximum Drain Current – Pulsed Maximum Power Dissipation Maximum Junction Temperature Storage Temperature Range Thermal Resistance – Junction to Ambient TA=25°C TA=100°C
(TA = 25°C unless otherwise noted)
N-Channel 20 ±12 8 35 2.5 1.0 150 -55 to 150 62.5 P-Channel -20 ±12 -4.3 -17 2.5 1.0 Unit V A W °C °C °C/W
* Surface Mounted on FR4 Board, t ≤ 10 sec.
Electrical Characteristics
Symbol Static BVDSS IDSS VGS(th) IGSS Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Parameter
(TA = 25°C unless otherwise noted)
APM4500 Unit Min. Typ. Max. N-Ch P-Ch N-Ch P-Ch N-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 22 30 80 105 0.8 -0.7 0.5 0.7 P-Ch -0.45 20 -20 1 -1 1 -1 ±100 ±100 26 36 90 115 1.3 -1.3 V mΩ nA
Test Condition
VGS=0V , IDS=250µA VDS=16V , VGS=0V VDS=-16V , VGS=0V VDS=VGS , IDS=250µA VDS=VGS , IDS=-250µA VGS=±12V , VDS=0V VGS=±12V , VDS=0V VGS=4.5V , IDS=8A VGS=2.5V , IDS=5.2A VGS=-4.5V , IDS=-4.3A VGS=-2.5V , IDS=-2A ISD=1.7A , VGS=0V ISD=-1.25A , VGS=0V
V µA V
RDS(ON)a
Drain-Source On-state Resistance
VSDa
Diode Forward Voltage
Notes
a
: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%
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APM4500
Electrical Characteristics (Cont.)
Symbol Dynamicb Qg Qgs Qgd td(ON) Tr td(OFF) Tf Ciss Coss Crss Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance VGS=0V Output Capacitance Reverse Transfer Capacitance VDS=15V Frequency=1.0MHz N-Channel VDS=10V , IDS= 8A VGS=4.5V P-Channel VDS=-10V , IDS=-3A VGS=-4.5V N-Channel VDD=10V , IDS=1A , VGEN =4.5V , RG=0.2Ω P-Channel VDD=-10V , IDS=-1A , VGEN =-4.5V , RG=6Ω N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 10 9 3 3 2.5 1 16 13 40 36 42 45 20 37 675 510 178 270 105 120 pF 32 21.5 75 56 78 69.5 35 57.5 ns 13 12 nC Parameter
(TA = 25°C unless otherwise noted)
APM4500 Unit Min. Typ. Max.
Test Condition
Notes
b
: Guaranteed by design, not subject to production testing
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APM4500
Typical Characteristics
N-Channel MOSFET Output Characteristics
20
VGS=3,4,5,6,7,8,9,10V VGS=2.5V
Transfer Characteristics
20
ID-Drain Current (A)
ID-Drain Current (A)
16
16
12
12
8
VGS=2V
8
TJ=125°C TJ=25°C TJ=-55°C
4
VGS=1.5V
4
0
0
1
2
3
4
5
6
7
8
0 0.0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.50 0.06
IDS=250µA
On-Resistance vs. Drain Current
VGS(th)-Threshold Voltage (V) (Normalized)
1.25 1.00 0.75 0.50 0.25 0.00 -50
RDS(ON)-On-Resistance (Ω)
0.05 0.04
VGS=2.5V
0.03
VGS=4.5V
0.02 0.01 0.00
-25
0
25
50
75
100 125 150
0
2
4
6
8
10
Tj - Junction Temperature (°C)
ID - Drain Current (A)
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APM4500
Typical Characteristics (Cont.)
On-Resistance vs. Gate-to-Source Voltage
0.10 0.09
ID=8A
On-Resistance vs. Junction Temperature
2.00
VGS=4.5V ID=8A
RDS(ON)-On-Resistance (Ω)
0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 1 2 3 4 5 6 7 8 9 10
RDS(ON)-On-Resistance (Ω) (Normalized)
1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -50
-25
0
25
50
75
100 125 150
VGS - Gate-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Gate Charge
10
VDS=10V ID=1A
Capacitance
1000
Frequency=1MHz
VGS-Gate-Source Voltage (V)
8
800
6
Capacitance (pF)
Ciss
600
4
400
Coss Crss
2
200
0
0
4
8
12
16
20
0
0
4
8
12
16
20
QG - Gate Charge (nC)
VDS - Drain-to-Source Voltage (V)
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APM4500
Typical Characteristics (Cont.)
Source-Drain Diode Forward Voltage
20 10 60
Single Pulse Power
IS-Source Current (A)
48
Power (W)
1.2 1.4
36
1
TJ=150°C
TJ=25°C
24
12
0.1 0.0
0.2
0.4
0.6
0.8
1.0
0 0.01
0.1
1
10
100
VSD -Source-to-Drain Voltage (V)
Time (sec)
Normalized Thermal Transient Impedence, Junction to Ambient
2
Normalized Effective Transient Thermal Impedance
1
Duty Cycle = 0.5
D= 0.2 D= 0.1
0.1
D= 0.05
D= 0.02
SINGLE PULSE
1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=62.5°C/W 3.T JM -T A =P DM Z thJA 4.Surface Mounted
0.01 1E-4
1E-3
0.01
0.1
1
10
100
Square Wave Pulse Duration (sec)
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APM4500
Typical Characteristics
P-Channel MOSFET Output Characteristics
10
-VGS=3,4.5,6,7,8V
Transfer Characteristics
10
-ID-Drain Current (A)
6
-ID-Drain Current (A)
8
-VGS=2V
8
6
4
-VGS=1.5V
4
TJ=25°C TJ=-55°C
2
-VGS=1V
2
TJ=125°C
0
0
1
2
3
4
5
6
7
8
9
10
0 0.0
0.5
1.0
1.5
2.0
2.5
-VDS - Drain-to-Source Voltage (V)
-VGS - Gate-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.50 0.16
-IDS=250µA
On-Resistance vs. Drain Current
-VGS(th)-Threshold Voltage (V) (Normalized)
RDS(ON)-On-Resistance (Ω)
1.25 1.00 0.75 0.50 0.25 0.00 -50
0.14 0.12 0.10
-VGS=4.5V -VGS=2.5V
0.08 0.06 0.04 0.02 0 2 4 6 8 10
-25
0
25
50
75
100 125 150
Tj - Junction Temperature (°C)
-ID - Drain Current (A)
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APM4500
Typical Characteristics (Cont.)
On-Resistance vs. Gate-to-Source Voltage
0.20
-ID=4.3A
On-Resistance vs. Junction Temperature
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4
-VGS=4.5V -ID=4.3A
RDS(ON)-On-Resistance (Ω)
0.16 0.14 0.12 0.10 0.08 0.06 0.04 1 2 3 4 5 6 7 8
RDS(ON)-On-Resistance (Ω) (Normalized)
0.18
0.2 -50
-25
0
25
50
75
100 125 150
-VGS - Gate-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Gate Charge
5
Capacitance
800 700
Frequency=1MHz
-VGS-Gate-Source Voltage (V)
-VDS=10V -ID=3A
4
Capacitance (pF)
600
Ciss
3
500 400 300 200
Coss
2
1
Crss
0
0
2
4
6
8
10
100
0
5
10
15
20
QG - Gate Charge (nC)
-VDS - Drain-to-Source Voltage (V)
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APM4500
Typical Characteristics (Cont.)
Source-Drain Diode Forward Voltage
10 14 12
Single Pulse Power
-IS-Source Current (A)
10
Power (W)
1.4 1.6
8 6 4 2
TJ=150°C
TJ=25°C
1 0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 0.01
0.1
1
10
100
-VSD -Source-to-Drain Voltage (V)
Time (sec)
Normalized Thermal Transient Impedence, Junction to Ambient
Normalized Effective Transient Thermal Impedance
1
Duty Cycle=0.5
D=0.2 D=0.1
0.1
D=0.05 D=0.02 1.Duty Cycle, D=t1/t2 2.Per Unit Base=R thJA=62.5°C/W 3.T JM-T A=P DMZ thJA SINGLE PULSE
D=0.01
0.01 1E-4
1E-3
0.01
0.1
1
10
100
Square Wave Pulse Duration (sec)
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APM4500
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
E
H
e1 D
e2
A1
A
1 L
0.004max.
Dim A A1 D E H L e1 e2 φ1
Mi ll im et er s Min . 1. 35 0. 10 4. 80 3. 80 5. 80 0. 40 0. 33 1. 27B S C 8° Max . 1. 75 0. 25 5. 00 4. 00 6. 20 1. 27 0. 51 Min. 0. 053 0. 004 0. 189 0. 150 0. 228 0. 016 0. 013
0.015X45
Inche s Max . 0. 069 0. 010 0. 197 0. 157 0. 244 0. 050 0. 020 0. 50B S C 8°
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APM4500
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
temperature
Peak temperature
183°C Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/ Convection Average ramp-up rate(183°C to Peak) 3°C/second max. 120 seconds max Preheat temperature 125 ± 25°C) 60 – 150 seconds Temperature maintained above 183°C Time within 5°C of actual peak temperature 10 –20 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 6 minutes max. Time 25°C to peak temperature VPR 10 °C /second max. 60 seconds 215-219°C or 235 +5/-0°C 10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm and all bgas Convection 220 +5/-0 °C VPR 215-219 °C IR/Convection 220 +5/-0 °C pkg. thickness < 2.5mm and pkg. volume ≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 235 +5/-0 °C VPR 235 +5/-0 °C IR/Convection 235 +5/-0 °C
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APM4500
Reliability test program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 SEC 1000 Hrs Bias @ 125°C 168 Hrs, 100% RH, 121°C -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
E Po P P1 D
t
W
F
Bo
Ao
D1 T2
Ko
J C A B
T1
Application
A 330 ± 1
B 62 +1.5 D
C 12.75+ 0.15 D1
J 2 ± 0.5 Po
T1 12.4 ± 0.2 P1 2.0 ± 0.1
T2 2 ± 0.2 Ao 6.4 ± 0.1
W 12± 0. 3 Bo 5.2 ± 0. 1
P 8 ± 0.1 Ko
E 1.75 ±0.1 t
SOP- 8
F 5.5 ± 1
1.55 +0.1 1.55+ 0.25 4.0 ± 0.1
2.1 ± 0.1 0.3 ±0.013
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APM4500
Cover Tape Dimensions
Application SOP- 8 Carrier Width 12 Cover Tape Width 9.3 Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
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