APM4536K
Dual Enhancement Mode MOSFET (N-and P-Channel)
Features
•
N-Channel 30V/5A, RDS(ON) =35mΩ(typ.) @ VGS = 10V RDS(ON) =45mΩ(typ.) @ VGS = 4.5V
Pin Description
D1 D1 D2 D2
•
P-Channel -30V/-5A, RDS(ON) =40mΩ(typ.) @ VGS =-10V RDS(ON) =55mΩ(typ.) @ VGS =-4.5V
S1 G1 S2 G2
Top View of SOP − 8
(8) D1 (7) D1 (3) S2
• • •
Super High Dense Cell Design Reliable and Rugged Lead Free Available (RoHS Compliant)
(2) G1
(4) G2
Applications
•
Power Management in Notebook Computer, Portable Equipment and Battery Powered Systems
S1 (1)
D2 (5)
D2 (6)
N-Channel MOSFET P-Channel MOSFET
Ordering and Marking Information
APM4536 Lead Free Code Handling Code Tem p. Range Package Code Package Code K : SOP-8 Operating Junction Tem p. Range C : -55 to 150°C Handling Code TU : Tube TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device XXXXX - Date Code
APM4536 K :
APM4536 XXXXX
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 1 www.anpec.com.tw
APM4536K
Absolute Maximum Ratings
Symbol VDSS VGSS ID* IDM* IS* TJ TSTG PD* RθJA*
Note: *Surface Mounted on 1in pad area, t ≤ 10sec.
2
(TA = 25°C unless otherwise noted)
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Diode Continuous Forward Current Maximum Junction Temperature Storage Temperature Range Power Dissipation TA=25°C TA=100°C VGS=±10V
N Channel 30 ±16 5 20 1.7
P Channel -30 ±16 -5 -20 -1.7
Unit V A A °C W °C/W
150 -55 to 150 2 0.8 62.5
Thermal Resistance-Junction to Ambient
Electrical Characteristics
Symbol Parameter
(TA = 25°C unless otherwise noted)
APM4536K Min. Typ. Max.
Test Condition
Unit
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA VGS=0V, IDS=-250µA VDS=24V, VGS=0V IDSS Zero Gate Voltage Drain Current TJ=85°C VDS=-24V, VGS=0V TJ=85°C VGS(th) IGSS Gate Threshold Voltage Gate Leakage Current VDS=VGS, IDS=250µA VDS=VGS, IDS=-250µA VGS=±16V, VDS=0V VGS=10V, IDS=5A RDS(ON)
a
N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch
30 -30 1 30 -1 -30 0.7 -1 1.1 -1.5 1.5 -2 ±100 ±100 35 40 45 55 50 55 60 75
V
µA
V
nA
Drain-Source On-State Resistance
VGS=-10V, IDS=-5A VGS=4.5V, IDS=4A VGS=-4.5V, IDS=-4A
mΩ
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APM4536K
Electrical Characteristics (Cont.)
Symbol Parameter
(TA = 25°C unless otherwise noted)
APM4536K Min. Typ. Max.
Test Condition
Unit
Diode Characteristics VSD
a
Diode Forward Voltage
b
ISD=1.7A , VGS=0V ISD=-1.7A , VGS=0V
N-Ch P-Ch
0.8 -0.8
1.3 -1.3
V
Dynamic Characteristics RG Ciss Coss Gate Resistance
VGS=0V,VDS=0V,F=1MHz N-Channel VGS=0V, VDS=25V, Frequency=1.0MHz P-Channel VGS=0V, VDS=-25V, Frequency=1.0MHz N-Channel VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω P-Channel VDD=-15V, RL=15Ω, IDS=-1A, VGEN=-10V, RG=6Ω
b
N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch
3 12 360 650 75 145 35 80 10 10 8 15 20 25 5 15 15 20 20 30 28 50 15 30
Ω
Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time
pF
Crss
td(ON) Tr td(OFF) Tf
ns
Gate Charge Characteristics Qg Qgs Qgd
Notes:
Total Gate Charge Gate-Source Charge Gate-Drain Charge
N-Channel VDS=15V, VGS=10V, IDS=5A P-Channel VDS=-15V, VGS=-10V, IDS=-5A
N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch
14.5 26 4.3 5.1 2.3 3.3
20 35 nC
a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
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APM4536K
Typical Characteristics
N-Channel Power Dissipation
2.5 6
Drain Current
2.0
5
ID - Drain Current (A)
Ptot - Power (W)
4
1.5
3
1.0
2
0.5
1 TA=25 C 0 20 40 60 80 100 120 140 160
o
0.0
0
TA=25 C,VG=10V 0 20 40 60 80 100 120 140 160
o
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Safe Operation Area
Normalized Transient Thermal Resistance
100
2 1
Thermal Transient Impedance
Duty = 0.5 0.2
ID - Drain Current (A)
10
Rd
on )L
im
it
s(
300µs 1ms
0.1
0.05 0.02 0.01
0.1
1
10ms 100ms 1s
0.01
Single Pulse Mounted on 1in pad o RθJA : 62.5 C/W
2
0.1
DC
TA=25 C 0.01 0.01 0.1
O
1
10
100
1E-3 1E-4
1E-3
0.01
0.1
1
10 30
VDS - Drain - Source Voltage (V)
Square Wave Pulse Duration (sec)
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APM4536K
Typical Characteristics (Cont.)
N-Channel Output Characteristics
20 18 16 VGS= 4, 5, 6, 7, 8, 9, 10V
55 60
Drain-Source On Resistance
RDS(ON) - On - Resistance (mΩ)
3V
50 45 40 VGS=10V 35 30 25 20
ID - Drain Current (A)
14 12 10 8 6 4 2 0 0 1 2 3 2V
VGS=4.5V
4
5
0
4
8
12
16
20
VDS - Drain-Source Voltage (V)
ID - Drain Current (A)
Transfer Characteristics
30
1.8 1.6
Gate Threshold Voltage
IDS=250µΑ
Normalized Threshold Voltage
25
1.4 1.2 1.0 0.8 0.6 0.4
ID - Drain Current (A)
20 Tj=125 C
o
15
10
Tj=25 C
o
Tj=-55 C
o
5
0
0
1
2
3
4
5
0.2 -50 -25
0
25
50
75
100 125 150
VGS - Gate - Source Voltage (V)
Tj - Junction Temperature (°C)
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APM4536K
Typical Characteristics (Cont.)
N-Channel Drain-Source On Resistance
2.0 1.8 VGS = 10V IDS = 5A
10 Tj=150 C
o
Source-Drain Diode Forward
20
Normalized On Resistance
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -50 -25 RON@Tj=25 C: 35mΩ 0 25 50 75 100 125 150
o
IS - Source Current (A)
Tj=25 C 1
o
0.1 0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Tj - Junction Temperature (°C)
VSD - Source - Drain Voltage (V)
Capacitance
600 Frequency=1MHz 10 VDS=15V IDS= 5A
Gate Charge
VGS - Gate - source Voltage (V)
500
8
C - Capacitance (pF)
400
Ciss
6
300
4
200
100 Crss 0
Coss
2
0 0 5 10 15 20 25 30
0
3
6
9
12
15
VDS - Drain - Source Voltage (V)
QG - Gate Charge (nC)
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APM4536K
Typical Characteristics (Cont.)
P-Channel Power Dissipation
2.5 6
Drain Current
2.0
5
-ID - Drain Current (A)
o
Ptot - Power (W)
4
1.5
3
1.0
2
0.5
1 TA=25 C 0 20 40 60 80 100 120 140 160 TA=25 C,VG=-10V 0 20 40 60 80 100 120 140 160
o
0.0
0
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Safe Operation Area
Normalized Transient Thermal Resistance
100 2 1
Thermal Transient Impedance
Duty = 0.5 0.2
it
-ID - Drain Current (A)
s(
on )L
10
Rd
300µs 1ms 10ms
im
0.1
0.1 0.05 0.02 0.01
1
100ms 1s
0.01
Single Pulse
2
0.1
DC
0.01 0.01
TA=25 C
O
0.1
1
10
100
1E-3 1E-4
Mounted on 1in pad o RθJA : 62.5 C/W
1E-3
0.01
0.1
1
10 30
-VDS - Drain - Source Voltage (V)
Square Wave Pulse Duration (sec)
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APM4536K
Typical Characteristics (Cont.)
P-Channel Output Characteristics
20 18 16 VGS= -5,-6,-7,-8,-9,-10V
Drain-Source On Resistance
80 75
RDS(ON) - On - Resistance (mΩ)
-4V
70 65 60 55 50 45 40 35 30 25 VGS= -10V VGS= -4.5V
-ID - Drain Current (A)
14 12 10 8 6 4 2 0 0 1 2 3 4 5 -2V -3V
6
7
8
20
0
2
4
6
8
10 12 14 16 18 20
-VDS - Drain - Source Voltage (V)
-ID - Drain Current (A)
Transfer Characteristics
20 18 16 1.8
Gate Threshold Voltage
IDS= -250µΑ 1.6
Normalized Threshold Voltage
1.4 1.2 1.0 0.8 0.6 0.4 0.2 -50 -25
-ID - Drain Current (A)
14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 Tj=25 C
o
Tj=125 C Tj=-55 C
o
o
0
25
50
75
100 125 150
-VGS - Gate - Source Voltage (V)
Tj - Junction Temperature (°C)
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APM4536K
Typical Characteristics (Cont.)
P-Channel Drain-Source On Resistance
1.8 VGS = -10V 1.6 IDS = -5A 10 Tj=150 C
o
Source-Drain Diode Forward
20
Normalized On Resistance
1.2 1.0 0.8 0.6 0.4 -50 -25 R ON@Tj=25 C: 40mΩ 0 25 50 75 100 125 150
o
-IS - Source Current (A)
1.4
1
Tj=25 C
o
0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Tj - Junction Temperature (°C)
-VSD - Source - Drain Voltage (V)
Capacitance
1000 Frequency=1MHz
Gate Charge
10 VDS= -15V IDS= -5A 8
800
Ciss 600
-VGS - Gate - source Voltage (V)
30
C - Capacitance (pF)
6
400
4
200 Crss 0
Coss
2
0
5
10
15
20
25
0
0
5
10
15
20
25
30
-VDS - Drain - Source Voltage (V)
QG - Gate Charge (nC)
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APM4536K
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
E
H
e1 D
e2
A1
A
1 L
0.004max.
Dim A A1 D E H L e1 e2 φ1
Mi ll im et er s Min. 1. 35 0. 10 4. 80 3. 80 5. 80 0. 40 0. 33 1. 27B S C 8° Max . 1. 75 0. 25 5. 00 4. 00 6. 20 1. 27 0. 51 Min. 0. 053 0. 004 0. 189 0. 150 0. 228 0. 016 0. 013
0.015X45
Inche s Max . 0. 069 0. 010 0. 197 0. 157 0. 244 0. 050 0. 020 0. 50B S C 8°
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APM4536K
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
TP
(IR/Convection or VPR Reflow)
tp C ritical Zone T L to T P
R am p-up
T e m p e ra tu re
TL T sm ax
tL
T sm in R am p-down ts Preheat
25
t 2 5 °C to Peak
T im e
Classificatin Reflow Profiles
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds See table 2 20-40 seconds
6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25°C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface.
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APM4536K
Classificatin Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – P ackage Peak Reflow Tem peratures 3 3 P ackage Thickness Volum e m m Volum e m m < 350 ≥ 350 < 2.5 m m 240 +0/-5 ° C 225 +0/-5 ° C ≥ 2.5 m m 225 +0/-5 ° C 225 +0/-5 ° C T able 2. Pb-free Process – P ackage Classification Reflow Tem peratures 3 3 3 P ackage Thickness Volum e mm Volum e mm Volum e mm < 350 3 50-2000 > 2000 < 1.6 m m 260 +0 ° C* 260 +0 ° C* 260 +0 ° C* 1 .6 m m – 2 .5 m m 260 +0 ° C* 250 +0 ° C* 245 +0 ° C* ≥ 2.5 m m 250 +0 ° C* 245 +0 ° C* 245 +0 ° C* * Tolerance: The device m anufacturer/supplier s hall a ssure process com patibility up to and including the stated classification tem perature (this m eans Peak reflow tem perature +0 ° C. For exam ple 260 ° C+0 ° C) at the rated MSL level.
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 SEC 1000 Hrs Bias @ 125°C 168 Hrs, 100% RH, 121°C -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
t E Po P P1 D
F W
Bo
Ao
D1
Ko
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APM4536K
Carrier Tape & Reel Dimensions(Cont.)
T2
J C A B
T1
Application
A 330±1 F 5.5 ± 0.1
B 62 ± 1.5
C 12.75 + 0.1 5
J 2 + 0.5
T1 12.4 +0.2 P1 2.0 ± 0.1
T2 2± 0.2 Ao 6.4 ± 0.1
W 12 + 0.3 - 0.1 Bo 5.2± 0.1
P 8± 0.1
E 1.75± 0.1
SOP-8
D D1 Po 1.55±0.1 1.55+ 0.25 4.0 ± 0.1
Ko t 2.1± 0.1 0.3±0.013
Cover Tape Dimensions
Application SOP- 8 Carrier Width 12 Cover Tape Width 9.3
(mm)
Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
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