APM9430

APM9430 N-Channel Enhancement Mode MOSFET Features • • • • 20V/4A, RDS(ON) = 40mΩ(typ.) @ VGS = 4.5V RDS(ON) = 110mΩ(typ.) @ VGS = 2.5V Super High Density Cell Design Reliable and Rugged SO-8 Package Pin Description S S S G 1 2 3 4 8 7 6 5 D D D D Applications • Power Management in Notebook Computer, Portable Equipment and Battery Powered Systems G SO − 8 DD DD S SS Ordering and Marking Information APM 9430 H a n d lin g C o d e Tem p. R ange P ackage C ode N-Channel MOSFET P ackage C ode K : S O -8 O p e ra tio n J u n c tio n T e m p . R a n g e C : -5 5 to 1 5 0 ° C H a n d lin g C o d e TU : Tube TR : Tape & Reel APM 9430 APM 9430 XXXXX X X X X X - D a te C o d e Absolute Maximum Ratings Symbol VDSS VGSS ID IDM Drain-Source Voltage Gate-Source Voltage Parameter (TA = 25°C unless otherwise noted) Rating 20 ±16 T A = 2 5°C 4 15 Unit V A Maximum Drain Current – Continuous Maximum Drain Current – Pulsed ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright  ANPEC Electronics Corp. Rev. A.2 - Feb., 2003 1 www.anpec.com.tw APM9430 Absolute Maximum Ratings Symbol PD TJ TSTG RθJA Parameter Maximum Power Dissipation Maximum Junction Temperature Storage Temperature Range Thermal Resistance - Junction to Ambient T A = 2 5°C TA = 100 °C (TA = 25°C unless otherwise noted) Rating 2.5 1.0 150 -55 to 150 50 Unit W °C °C/W Electrical Characteristics Symbol Static BVDSS IDSS VGS(th) IGSS R DS(ON)a VSDa b (TA=25°C unless otherwise noted) Parameter Test Condition APM9430 Min. Typ. Max. Unit Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage VGS=0V , IDS=250µ A VDS =18V , V GS=0V VDS =VGS , IDS=250µ A VGS=± 16V , VDS =0V VGS=4.5V , IDS =4A VGS=2.5V , IDS =2A ISD=2A , VGS=0V 20 1 0.7 0.9 40 110 0.75 6.6 2.8 1 13 26 45 110 85 20 50 20 450 100 60 1.5 ± 100 54 130 1.3 13 V µA V nA mΩ V Dynamic Qg Total Gate Charge Q gs Q gd td(ON) Tr td(OFF) Tf C iss C oss C rss Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance Output Capacitance Reverse Transfer VDS=10V , VGS=4.5V , ID=1A nC VDD=10V , ID =1A , VGEN=4.5V , R G=0.2Ω ns VGS=0V , VDS =15V Frequency=1.0MHz pF Notes a b : Guaranteed by design, not subject to production testing : Pulse test ; pulse width ≤ 500µs, duty cycle ≤ 2% Copyright  ANPEC Electronics Corp. Rev. A.2 - Feb., 2003 2 www.anpec.com.tw APM9430 Typical Characteristics Output Characteristics 15.0 VGS=4,5,6,7,8,9,10V Transfer Characteristics 15.0 12.5 V GS=3V 12.5 ID-Drain Current (A) ID-Drain Current (A) 10.0 VGS=2.5V 10.0 7.5 5.0 2.5 0.0 0.0 TJ=125°C TJ=-55°C TJ=25°C 7.5 5.0 V GS=2V 2.5 0.0 0 1 2 3 4 5 6 7 8 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V) Threshold Voltage vs. Junction Temperature 1.25 IDS=250µA On-Resistance vs. Drain Current 0.20 0.18 VGS(th)-Threshold Voltage (V) (Normalized) 1.00 RDS(on)-On-Resistance (Ω) 0.16 0.14 V GS=2.5V 0.75 0.12 0.10 0.08 0.06 0.04 0.02 V GS=4.5V 0.50 0.25 0.00 -50 -25 0 25 50 75 100 125 150 0.00 0 1 2 3 4 5 6 7 8 Tj - Junction Temperature (°C) ID - Drain Current (A) Copyright  ANPEC Electronics Corp. Rev. A.2 - Feb., 2003 3 www.anpec.com.tw APM9430 Typical Characteristics (Cont.) On-Resistance vs. Gate-to-Source Voltage 0.18 0.16 ID=4A On-Resistance vs. Junction Temperature 1.8 VGS=4.5V ID=4A RDS(on)-On-Resistance (Ω) RDS(on)-On-Resistance (Ω) (Normalized) 0 1 2 3 4 5 6 7 8 9 10 1.5 1.2 0.9 0.6 0.3 0.0 -50 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 -25 0 25 50 75 100 125 150 VGS - Gate-to-Source Voltage (V) TJ - Junction Temperature (°C) Gate Charge 10 Capacitance 750 Frequency=1MHz VGS-Gate-Source Voltage (V) V D=10V ID=1A 8 625 Capacitance (pF) 500 375 250 125 0 Ciss 6 4 2 Coss Crss 0 0 2 4 6 8 10 12 0 5 10 15 20 QG - Gate Charge (nC) VDS - Drain-to-Source Voltage (V) Copyright  ANPEC Electronics Corp. Rev. A.2 - Feb., 2003 4 www.anpec.com.tw APM9430 Typical Characteristics (Cont.) Source-Drain Diode Forward Voltage 15 10 60 Single Pulse Power IS-Source Current (Α) 48 Power (W) 36 1 TJ=150°C TJ=25°C 24 12 0.1 0.00 0.25 0.50 0.75 1.00 1.25 1.50 0 0.01 0.1 1 10 100 VSD-Source-to-Drain Voltage (V ) Time (sec) Normalized Thermal Transient Impedence, Junction to Ambient 2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 D= 0.2 D= 0.1 0.1 D= 0.05 D= 0.02 SINGLE PULSE 1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=50°C/W 3.TJM-TA=PDMZthJA 4.Surface Mounted 0.01 1E-4 1E-3 0.01 0.1 1 10 100 Square Wave Pulse Duration (sec) Copyright  ANPEC Electronics Corp. Rev. A.2 - Feb., 2003 5 www.anpec.com.tw APM9430 Packaging Information SOP-8 pin ( Reference JEDEC Registration MS-012) E H e1 D e2 A1 A 1 L 0.004max. Dim A A1 D E H L e1 e2 φ1 Mi ll im et er s Min . 1. 35 0. 10 4. 80 3. 80 5. 80 0. 40 0. 33 1. 27B S C 8° Max . 1. 75 0. 25 5. 00 4. 00 6. 20 1. 27 0. 51 Min. 0. 053 0. 004 0. 189 0. 150 0. 228 0. 016 0. 013 0.015X45 Inche s Max . 0. 069 0. 010 0. 197 0. 157 0. 244 0. 050 0. 020 0. 50B S C 8° Copyright  ANPEC Electronics Corp. Rev. A.2 - Feb., 2003 6 www.anpec.com.tw APM9430 Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) temperature Peak temperature 183°C Pre-heat temperature Time Classification Reflow Profiles Convection or IR/ Convection Average ramp-up rate(183°C to Peak) 3°C/second max. 120 seconds max Preheat temperature 125 ± 25°C) 60 – 150 seconds Temperature maintained above 183°C Time within 5°C of actual peak temperature 10 –20 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 6 minutes max. Time 25°C to peak temperature VPR 10 °C /second max. 60 seconds 215-219°C or 235 +5/-0°C 10 °C /second max. Package Reflow Conditions pkg. thickness ≥ 2.5mm and all bgas Convection 220 +5/-0 °C VPR 215-219 °C IR/Convection 220 +5/-0 °C pkg. thickness < 2.5mm and pkg. volume ≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 235 +5/-0 °C VPR 235 +5/-0 °C IR/Convection 235 +5/-0 °C www.anpec.com.tw Copyright  ANPEC Electronics Corp. Rev. A.2 - Feb., 2003 7 APM9430 Reliability test program Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 SEC 1000 Hrs Bias @ 125°C 168 Hrs, 100% RH, 121°C -65°C ~ 150°C, 200 Cycles Carrier Tape & Reel Dimensions E Po P P1 D t F W Bo Ao D1 T2 Ko J C A B T1 Application A 330 ± 1 B 62 +1.5 D C 12.75+ 0.15 D1 J 2 ± 0.5 Po T1 12.4 ± 0.2 P1 T2 2 ± 0.2 Ao W 12± 0. 3 Bo 5.2± 0. 1 P 8± 0.1 Ko E 1.75±0.1 t SOP- 8 F 5.5± 1 1.55 +0.1 1.55+ 0.25 4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 2.1± 0.1 0.3±0.013 Copyright  ANPEC Electronics Corp. Rev. A.2 - Feb., 2003 8 www.anpec.com.tw APM9430 Cover Tape Dimensions Application SOP- 8 Carrier Width 12 Cover Tape Width 9.3 Devices Per Reel 2500 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright  ANPEC Electronics Corp. Rev. A.2 - Feb., 2003 9 www.anpec.com.tw