APM9930/C
Dual Enhancement Mode MOSFET (N-and P-Channel)
Features
•
N-Channel 20V/15A, RDS(ON)=12mΩ(typ.) @ VGS=10V RDS(ON)=17mΩ(typ.) @ VGS=4.5V RDS(ON)=25mΩ(typ.) @ VGS=2.5V
Pin Description
APM9930
S1 G1 S2 G2 1 2 3 4 8 7 6 5 D1 D1 D2 D2
S1 G1 S2 G2
APM9930C
1 2 3 4 8 7 6 5 D D D D
•
P-Channel -20V/-5A, RDS(ON)=60mΩ(typ.) @ VGS=-10V RDS(ON)=72mΩ(typ.) @ VGS=-4.5V RDS(ON)=98mΩ(typ.) @ VGS=-2.5V SO-8
D1 D1
SO-8
D
• • •
Super High Dense Cell Design for Extremely Low RDS(ON) Reliable and Rugged SO-8 Package
S1 S1 S2 G1 G1 G2
N-Channel MOSFET
Applications
•
Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems.
G2
N- and P-Channel MOSFET
S2
D2
D2
P-Channel MOSFET
Ordering and Marking Information
APM9930/C
Handling Code Temp. Range Package Code Package Code K : SO-8 Operation Junction Temp. Range C : -55 to 150°C Handling Code TR : Tape & Reel
APM9930/C K :
APM9930/C XXXXX
XXXXX - Date Code
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.1 - Sep., 2002 1 www.anpec.com.tw
APM9930/C
Absolute Maximum Ratings
Symbol VDSS VGSS ID* IDM PD TJ TSTG RθjA Parameter Drain-Source Voltage Gate-Source Voltage Maximum Drain Current – Continuous Maximum Drain Current – Pulsed TA=25°C Maximum Power Dissipation Maximum Junction Temperature Storage Temperature Range Thermal Resistance – Junction to Ambient TA=100°C
(TA = 25°C unless otherwise noted)
N-Channel 20 ±12 15 30 2.5 1.0 150 -55 to 150 50 P-Channel -20 ±12 -5 -10 2.5 W 1.0 °C °C °C/W A V Unit
* Surface Mounted on FR4 Board, t ≤ 10 sec.
Electrical Characteristics
Symbol Static BVDSS IDSS VGS(th) IGSS Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Parameter
(TA = 25°C unless otherwise noted)
APM9930/C Min. N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 12 N-Ch 17 25 60 P-Ch 72 98 0.6 -0.6 20 -20 1 -1 1.3 -1.3 ±100 ±100 15 20 30 70 80 105 mΩ nA Typ. Max.
Test Condition
Unit
VGS=0V , IDS=250µA VDS=18V , VGS=0V VDS=-18V , VGS=0V VDS=VGS , IDS=250µA VDS=VGS , IDS=-250µA VGS=±12V , VDS=0V VGS=±10V , VDS=0V VGS=10V , IDS=15A VGS=4.5V , IDS=5A
V µA V
Gate Leakage Current
RDS(ON)a
Drain-Source On-state Resistance
VGS=2.5V , IDS=2A VGS=-10V , IDS=-5A VGS=-4.5V , IDS=-3.2A VGS=-2.5V , IDS=-1A
Notes
a
: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%
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APM9930/C
Electrical Characteristics (Cont.)
(TA = 25°C unless otherwise noted)
Symbol VSDa Dynamica Qg Q gs Q gd td(ON)
Parameter Diode Forward Voltage
Test Condition ISD=5A , V GS=0V ISD=-2A , V GS=0V N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch P-Channel N-Ch P-Ch N-Ch P-Ch N-Ch VGS=0V P-Ch N-Ch P-Ch N-Ch P-Ch VDD=-10V , IDS=-1A , VGEN=-4.5V , RG =10Ω
APM9930/C Min. 0.6 -0.6 14 6.8 5 3.6 2.8 1.08 6 21 5 45 16 36 5 20 1225 495 330 130 220 60 12 42 10 85 40 80 20 40 Typ. Max. 1.3 -1.3 22 16
Unit V
Total Gate Charge
N-Channel VDS=10V , IDS= 6A VGS=4.5V P-Channel VDS=-10V , IDS=-1A VGS=-4.5V N-Channel VDD=10V , IDS=1A , VGEN=4.5V , RG=10Ω
Gate-Source Charge
nC
Gate-Drain Charge
Turn-on Delay Time
Tr
Turn-on Rise Time
ns
td(OFF) Tf Ciss Coss Crss
Turn-off Delay Time
Turn-off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS=15V Frequency=1.0MHz
pF
Notes
a
: Guaranteed by design, not subject to production testing
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APM9930/C
Typical Characteristics
N-Channel
Output Characteristics
20
VGS=3,4,5,6,7,8,9,10V
Transfer Characteristics
20
ID-Drain Current (A)
ID-Drain Current (A)
16
VGS=2.5V
15
12
10
8
V GS=2V
TJ=125°C
5
TJ=25°C TJ=-55°C
4
0
0
2
4
6
8
10
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.50
IDS=250uA
On-Resistance vs. Drain Current
0.030
VGS(th)-Threshold Voltage (V) (Normalized)
1.00 0.75 0.50 0.25 0.00 -50
RDS(ON)-On-Resistance (Ω)
1.25
0.025 0.020 0.015 0.010 0.005 0.000
VGS=4.5V
V GS=10V
-25
0
25
50
75
100 125 150
0
4
8
12
16
20
Tj - Junction Temperature (°C)
ID - Drain Current (A)
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APM9930/C
Typical Characteristics (Cont.)
N-Channel
On-Resistance vs. Gate-to-Source Voltage
0.16
ID=15A
On-Resistance vs. Junction Temperature
2.0
VGS=10V ID=15A
RDS(ON)-On-Resistance (Ω)
0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 1 2 3 4 5 6 7 8 9 10
RDS(ON)-On-Resistance (Ω) (Normalized)
0.14
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -50
-25
0
25
50
75
100 125
150
VGS - Gate-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Gate Charge
10
V DS=10V ID=6A
Capacitance
1800
Frequency=1MHz
VGS-Gate-Source Voltage (V)
8
1500
Capacitance (pF)
Ciss
6
1200 900 600
Coss
4
2 300
Crss
0
0
5
10
15
20
25
30
0
0
5
10
15
20
QG - Gate Charge (nC)
VDS - Drain-to-Source Voltage (V)
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APM9930/C
Typical Characteristics (Cont.)
N-Channel
Source-Drain Diode Forward Voltage
20 10 80 70 60
Single Pulse Power
IS-Source Current (A)
Power (W)
50 40 30 20 10
TJ=150°C
TJ=25°C
1
0.1 0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 0.01
0.1
1
10
30
VSD -Source-to-Drain Voltage (V)
Time (sec)
Normalized Thermal Transient Impedence, Junction to Ambient
Normalized Effective Transient Thermal Impedance
1
Duty Cycle=0.5
D=0.2 D=0.1
0.1
D=0.05 1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=50°C/W 3.TJM-TA=PDMZthJA SINGLE PULSE
D=0.02
0.01 1E-4
1E-3
0.01
0.1
1
10
30
Square Wave Pulse Duration (sec)
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APM9930/C
Typical Characteristics
P-Channel
Output Characteristics
10
-VGS=4,5,6,7,8,9,10V
Transfer Characteristics
10
-ID-Drain Current (A)
8
8
-ID-Drain Current (A)
TJ=25°C TJ=125°C TJ=-55°C
6
-V GS=3V
6
4
4
2
2
0
0
2
4
6
8
10
0
0
1
2
3
4
5
-VDS - Drain-to-Source Voltage (V)
-VGS - Gate-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.50
-IDS=250uA
On-Resistance vs. Drain Current
0.10
-VGS(th)-Threshold Voltage (V) (Normalized)
RDS(ON)-On-Resistance (Ω)
1.25 1.00 0.75 0.50 0.25 0.00 -50
0.09 0.08 0.07
-VGS=10V -VGS=4.5V
0.06 0.05 0.04 0.03
-25
0
25
50
75
100 125 150
0
1
2
3
4
5
6
Tj - Junction Temperature (°C)
-ID - Drain Current (A)
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APM9930/C
Typical Characteristics (Cont.)
P-Channel
On-Resistance vs. Gate-to-Source Voltage
0.50 0.45
-ID=5A
On-Resistance vs. Junction Temperature
1.8
-VGS=10V -ID=5A
RDS(ON)-On-Resistance (Ω)
0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 2 3 4 5 6 7 8 9 10
RDS(ON)-On-Resistance (Ω) (Normalized)
1.6 1.4 1.2 1.0 0.8 0.6
0.4 -50
-25
0
25
50
75
100 125 150
-VGS - Gate-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Gate Charge
10
-V DS=10V -ID=1A
Capacitance
700
Frequency=1MHz
-VGS-Gate-Source Voltage (V)
600 8
6
Capacitance (pF)
500 400 300 200 100
Ciss
4
2
Coss Crss
0
0
2
4
6
8
10
12
14
0
0
5
10
15
20
QG - Gate Charge (nC)
-VDS - Drain-to-Source Voltage (V)
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APM9930/C
Typical Characteristics (Cont.)
P-Channel
Source-Drain Diode Forward Voltage
10 80
Single Pulse Power
-IS-Source Current (A)
60 1
TJ=150°C TJ=25°C
Power (W)
1.2 1.4
40
0.1
20
0.0
0.2
0.4
0.6
0.8
1.0
0 0.01
0.1
1
10
30
-VSD -Source-to-Drain Voltage (V)
Time (sec)
Normalized Thermal Transient Impedence, Junction to Ambient
Normalized Effective Transient Thermal Impedance
1
Duty Cycle=0.5
D=0.2 D=0.1
0.1
D=0.05 1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=50°C/W 3.TJM-TA=PDMZthJA SINGLE PULSE
D=0.02
0.01 1E-4
1E-3
0.01
0.1
1
10
30
Square Wave Pulse Duration (sec)
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APM9930/C
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
E
H
e1 D
e2
A1
A
1 L
0.004max.
Dim A A1 D E H L e1 e2 φ1
Mi ll im et er s Min . 1. 35 0. 10 4. 80 3. 80 5. 80 0. 40 0. 33 1. 27B S C 8° Max . 1. 75 0. 25 5. 00 4. 00 6. 20 1. 27 0. 51 Min. 0. 053 0. 004 0. 189 0. 150 0. 228 0. 016 0. 013
0.015X45
Inche s Max . 0. 069 0. 010 0. 197 0. 157 0. 244 0. 050 0. 020 0. 50B S C 8°
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APM9930/C
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
temperature
Peak temperature
183°C Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/ Convection Average ramp-up rate(183°C to Peak) 3°C/second max. 120 seconds max Preheat temperature 125 ± 25°C) 60 – 150 seconds Temperature maintained above 183°C Time within 5°C of actual peak temperature 10 –20 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 6 minutes max. Time 25°C to peak temperature VPR 10 °C /second max.
60 seconds 215-219°C or 235 +5/-0°C 10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm and all bgas Convection 220 +5/-0 °C VPR 215-219 °C IR/Convection 220 +5/-0 °C pkg. thickness < 2.5mm and pkg. volume ≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 235 +5/-0 °C VPR 235 +5/-0 °C IR/Convection 235 +5/-0 °C
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APM9930/C
Reliability test program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 SEC 1000 Hrs Bias @ 125°C 168 Hrs, 100% RH, 121°C -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
t E Po P P1 D
F W
Bo
Ao
D1 T2
Ko
J C A B
T1
Application
A 330 ± 1
B 62 +1.5 D
C 12.75+ 0.15 D1
J 2 ± 0.5 Po
T1 12.4 ± 0.2 P1 2.0 ± 0.1
T2 2 ± 0.2 Ao 6.4 ± 0.1
W 12± 0. 3 Bo 5.2 ± 0. 1
P 8 ± 0.1 Ko
E 1.75 ±0.1 t
SOP- 8
F 5.5 ± 1
1.55 +0.1 1.55+ 0.25 4.0 ± 0.1
2.1 ± 0.1 0.3 ±0.013
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APM9930/C
Cover Tape Dimensions
Application SOP- 8 Carrier Width 12 Cover Tape Width 9.3 Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
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