APM9966/C
Dual N-Channel Enhancement Mode MOSFET
Features
•
SOP-8 20V/6A , RDS(ON)=19mΩ(typ.) @ VGS=4.5V RDS(ON)=27mΩ(typ.) @ VGS=2.5V TSSOP-8 20V/6A , RDS(ON)=21mΩ(typ.) @ VGS=4.5V RDS(ON)=29mΩ(typ.) @ VGS=2.5V
Applications
•
Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems.
• • •
Super High Dense Cell Design for Extremely Low RDS(ON) Reliable and Rugged SO-8 and TSSOP-8 Packages
Pin Description
APM9966
S1 G1 S2 G2 1 2 3 4 8 7 6 5 D1 D1 D2 D2
D1 S1 S1 G1 1 2 3 4 8 7 6 5 D2 S2 S2 G2
S1 G1 S2 G2 1 2 3 4 8 7 6 5
APM9966C
D D D D
D S1 S1 G1
1 2 3 4
8 7 6 5
D S2 S2 G2
SO-8
D1 D1
TSSOP-8
D1
SO-8
D
TSSOP-8
D
G1
G1
G1
G1
S1 D2 D2
S1
S1 D2
S1 D
S1 D
S1
G2
G2
G2
G2
S2
S2
S2
S2
S2
S2
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 1 www.anpec.com.tw
APM9966/C
Ordering and Marking Information
APM9966/C
Handling Code Temp. Range Package Code Package Code K : SO-8 O : TSSOP-8 Operation Junction Temp. Range C : -55 to 150 °C Handling Code TR : Tape & Reel
APM9966/C K/O :
APM9966/C XXXXX
XXXXX - Date Code
Absolute Maximum Ratings
Symbol VDSS VGSS ID * IDM Drain-Source Voltage Gate-Source Voltage Parameter
(TA = 25°C unless otherwise noted)
Rating 20 ±10 6 20 SO-8 TSSOP-8 SO-8 TSSOP-8 1.6 1.0 0.625 0.4 150 -55 to 150 50
Unit V A
Maximum Drain Current – Continuous Maximum Drain Current – Pulsed TA=25°C
PD
Maximum Power Dissipation TA=100°C
W
TJ TSTG RθjA
Maximum Junction Temperature Storage Temperature Range Thermal Resistance – Junction to Ambient
°C °C °C/W
* Surface Mounted on FR4 Board, t ≤ 10 sec.
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
2
www.anpec.com.tw
APM9966/C
Electrical Characteristics (Cont.)
Symbol Static BVDSS Drain-Source Breakdown Voltage VGS=0V , IDS=250µA IDSS VGS(th) IGSS Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current SOP-8 VDS=16V , VGS=0V VDS=VGS , IDS=250µA VGS=±10V , VDS=0V VGS=4.5V , IDS=6A RDS(ON)a Drain-Source On-state Resistance TSSOP-8 VSDa Diode Forward Voltage VGS=2.5V , IDS=5.2A VGS=4.5V , IDS=6A VGS=2.5V , IDS=5.2A ISD=1.7A , VGS=0V VDS=10V , IDS= 1A VGS=4.5V , 19 27 21 29 0.8 14 3.5 2.1 25 VDD=10V , IDS=1A , VGEN=4.5V , RG=0.2Ω VGS=0V VDS=15V Frequency=1.0MHz 22 67 36 780 165 105 pF 0.5 0.7 20 1 1 ±100 23 33 25 35 1.1 18 nC 47 42 122 67 ns V mΩ V µA V nA Parameter
(TA = 25°C unless otherwise noted)
APM9966/C Min. Typ. Max.
Test Condition
Unit
Dynamicb Qg Total Gate Charge Qgs Gate-Source Charge Qgd td(ON) Tr td(OFF) Tf Ciss Coss Crss Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
Notes
a b
: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2% : Guaranteed by design, not subject to production testing
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
3
www.anpec.com.tw
APM9966/C
Typical Characteristics
Output Characteristics
20
VGS=2,3,4,5,6,7,8,9,10V 1V
Transfer Characteristics
20
ID-Drain Current (A)
16
ID-Drain Current (A)
15
12
0.5V
10
8
5
TJ=25°C TJ=-55°C TJ=125°C
4
0
0
1
2
3
4
5
0 0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.50
IDS=250uA
On-Resistance vs. Drain Current
0.05
SOP-8
VGS(th)-Threshold Voltage (V) (Normalized)
1.25 1.00 0.75 0.50 0.25 0.00 -50
RDS(ON)-On-Resistance (Ω)
0.04
VGS=4.5V
0.03
VGS=2.5V
0.02
0.01
-25
0
25
50
75
100 125 150
0.00
0
4
8
12
16
20
Tj - Junction Temperature (°C)
ID - Drain Current (A)
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
4
www.anpec.com.tw
APM9966/C
Typical Characteristics (Cont.)
On-Resistance vs. Drain Current
TSSOP-8
On-Resistance vs. Gate-to-Source Voltage
SOP-8
0.05
0.10 0.09
ID=6A
RDS(ON)-On-Resistance (Ω)
RDS(ON)-On-Resistance (Ω)
0.04
VGS=4.5V
0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01
0.03
VGS=2.5V
0.02
0.01
0.00
0.00
0
4
8
12
16
20
0
1
2
3
4
5
6
7
8
9
10
ID - Drain Current (A)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
TSSOP-8
On-Resistance vs. Junction Temperature
2.00
VGS=4.5V ID=6A
0.10
ID=6A
RDS(ON)-On-Resistance (Ω)
0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 0 1 2 3 4 5 6 7 8 9 10
RDS(ON)-On-Resistance (Ω) (Normalized)
0.09
1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -50
-25
0
25
50
75
100 125 150
VGS - Gate-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
5
www.anpec.com.tw
APM9966/C
Typical Characteristics (Cont.)
Gate Charge
5
VDS=10V ID=1A
Capacitance
1200
Frequency=1MHz
VGS-Gate-Source Voltage (V)
4
1000
Capacitance (pF)
800 600 400 200 0
Ciss
3
2
1
Coss Crss
0
0
2
4
6
8
10
12
14
16
0
4
8
12
16
20
QG - Gate Charge (nC)
VDS - Drain-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
20
Single Pulse Power
80
10
IS-Source Current (A)
60
TJ=150°C
Power (W)
1
TJ=25°C
40
20
0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0 0.01
0.1
1
10
30
VSD -Source-to-Drain Voltage (V)
Time (sec)
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
6
www.anpec.com.tw
APM9966/C
Typical Characteristics (Cont.)
Normalized Thermal Transient Impedence, Junction to Ambient
Normalized Effective Transient Thermal Impedance
1
Duty Cycle=0.5
D=0.2 D=0.1
0.1
D=0.05 1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=50°C/W 3.T JM -T A =P DM ZthJA SINGLE PULSE
D=0.02
0.01 1E-4
1E-3
0.01
0.1
1
10
30
Square Wave Pulse Duration (sec)
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
7
www.anpec.com.tw
APM9966/C
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
E
H
e1 D
e2
A1
A
1 L
0.004max.
Dim A A1 D E H L e1 e2 φ1
Mi ll im et er s Min . 1. 35 0. 10 4. 80 3. 80 5. 80 0. 40 0. 33 1. 27B S C 8° Max . 1. 75 0. 25 5. 00 4. 00 6. 20 1. 27 0. 51 Min. 0. 053 0. 004 0. 189 0. 150 0. 228 0. 016 0. 013
0.015X45
Inche s Max . 0. 069 0. 010 0. 197 0. 157 0. 244 0. 050 0. 020 0. 50B S C 8°
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
8
www.anpec.com.tw
APM9966/C
Packaging Information (Cont.)
TSSOP-8
e 87
2x E/2 E1 E S ( 2)
GAUGE PLANE
12
e/2
D A2 A b A1
0.25
L (L1) ( 3)
1
Dim A A1 A2 b D e E E1 L L1 R R1 S φ1 φ2 φ3
Millimeters Min. 0.00 0.80 0.19 2.9 0.65 BSC 6.40 BSC 4.30 0.45 1.0 REF 0.09 0.09 0.2 0° 0.004 0.004 0.008 0° 4.50 0.75 0.169 0.018 Max. 1.2 0.15 1.05 0.30 3.1 Min. 0.000 0.031 0.007 0.114
Inches Max. 0.047 0.006 0.041 0.012 0.122 0.026 BSC 0.252 BSC 0.177 0.030 0.039REF
12° REF 12° REF
8°
12° REF 12° REF
8°
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
9
www.anpec.com.tw
APM9966/C
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
temperature
Peak temperature
183°C Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/ Convection Average ramp-up rate(183°C to Peak) 3°C/second max. 120 seconds max Preheat temperature 125 ± 25°C) 60 – 150 seconds Temperature maintained above 183°C Time within 5°C of actual peak temperature 10 –20 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 6 minutes max. Time 25°C to peak temperature VPR 10 °C /second max.
60 seconds 215-219°C or 235 +5/-0°C 10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm and all bgas Convection 220 +5/-0 °C VPR 215-219 °C IR/Convection 220 +5/-0 °C pkg. thickness < 2.5mm and pkg. volume ≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 235 +5/-0 °C VPR 235 +5/-0 °C IR/Convection 235 +5/-0 °C
www.anpec.com.tw
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
10
APM9966/C
Reliability test program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 SEC 1000 Hrs Bias @ 125°C 168 Hrs, 100% RH, 121°C -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
E Po P P1 D
t
F W
Bo
Ao
D1 T2
Ko
J C A B
T1
A p p lic a tio n
A 330 ± 1
B 6 2 + 1 .5 D
C 1 2 .7 5 + 0 .1 5 D1
J 2 ± 0 .5 Po
T1 1 2 .4 ± 0 .2 P1 2 .0 ± 0 .1 T1 1 2 .4 ± 0 .2 P1 2 .0 ± 0 .1
T2 2 ± 0 .2 Ao 6 .4 ± 0 .1 T2 2 ± 0 .2 Ao 7 .0 ± 0 .1
W 12± 0. 3 Bo 5 .2 ± 0 . 1 W 12± 0. 3 Bo 3 .6 ± 0 .3
P 8 ± 0 .1 Ko
E 1 .7 5 ± 0 .1 t
SOP- 8
F 5 .5 ± 1
1 .5 5 + 0 .1 1 .5 5 + 0 .2 5 4 .0 ± 0 .1 B 6 2 + 1 .5 D 1 .5 + 0 .1 C 1 2 .7 5 + 0 .1 5 D1 1 .5 + 0 .1 J 2 + 0 .5 Po 4 .0 ± 0 .1
2 .1 ± 0 .1 0 .3 ± 0 .0 1 3 P 8 ± 0 .1 Ko E 1 .7 5 ± 0 .1 t
A p p lic a tio n
A 330 ± 1
T S S O P -8
F 5 .5 ± 0 . 1
1 .6 ± 0 .1 0 .3 ± 0 .0 1 3
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
11
www.anpec.com.tw
APM9966/C
Cover Tape Dimensions
Application SOP- 8 TSSOP- 8 Carrier Width 12 12 Cover Tape Width 9.3 9.3 Devices Per Reel 2500 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003
12
www.anpec.com.tw