APM9968C
N-Channel Enhancement Mode MOSFET
Features
• • • •
20V/6A , RDS(ON)=16mΩ(typ.) @ VGS=4.5V RDS(ON)=20mΩ(typ.) @ VGS=2.5V Super High Dense Cell Design for Extremely Low RDS(ON) Reliable and Rugged TSSOP-8 Packages
Pin Description
D S1 S1 G1 1 2 3 4 8 7 6 5 D S2 S2 G2
TSSOP-8
D
D
Applications
•
Power Management in Notebook Computer ,
G1
G2
S1
S1
S2
S2
Portable Equipment and Battery Powered Systems.
•
N-Channel MOSFET
Zener Diode Protected Gate Provide Human Body Mode Electrostatic Discharge Protection to 2500 V.
Ordering and Marking Information
APM9968C
Handling Code Temp. Range Package Code Package Code O : TSSOP-8 Temp. Range C : -55 to 150°C Handling Code TR : Tape & Reel
APM9968C O :
APM9968C XXXXX
XXXXX - Date Code
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.1 - Jul., 2003 1 www.anpec.com.tw
APM9968C
Absolute Maximum Ratings
Symbol VDSS VGSS ID* IDM PD TJ TSTG RθJA* Drain-Source Voltage Gate-Source Voltage Maximum Drain Current – Continuous Maximum Drain Current – Pulsed TA=25°C Maximum Power Dissipation TA=100°C Parameter
(TA = 25°C unless otherwise noted)
Rating 20 ±8 6 20 1 W 0.4 150 -55 to 150 80 °C °C °C/W A V Unit
Maximum Junction Temperature Storage Temperature Range Thermal Resistance – Junction to Ambient
* Surface Mounted on FR4 Board, t ≤ 10 sec.
Electrical Characteristics
Symbol Static BVDSS IDSS VGS(th) IGSS RDS(ON)a VSDa
b
(TA = 25°C unless otherwise noted)
APM9968C Typ. Max. Min.
Parameter
Test Condition
Unit
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage
VGS=0V , IDS=250µA VDS=16V , VGS=0V VDS=VGS , IDS=250µA VGS=±8V , VDS=0V VGS=4.5V , IDS=6A VGS=2.5V , IDS=5.2A ISD=0.5A , VGS=0V VDS=10V , IDS= 6A VGS=4.5V ,
20 1 0.6 0.7 16 20 0.7 19 2 5 37 68 62 182 100 1 ±10 20 25 1.3 25
V µA V µA mΩ V
Dynamic Qg Total Gate Charge Qgs Qgd td(ON) Tr td(OFF) Tf Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time
nC
VDD=10V , IDS=6A , VGEN=4.5V , RG=6Ω
33 100 54
ns
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APM9968C
Electrical Characteristics Cont.
Symbol Ciss Coss Crss Parameter Input Capacitance Output Capacitance
(TA = 25°C unless otherwise noted)
APM9968C Typ. Max. Min. 1253 340 260 pF
Test Condition VGS=0V VDS=15V
Unit
Reverse Transfer Capacitance Frequency=1.0MHz
Notes
a b
: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2% : Guaranteed by design, not subject to production testing
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APM9968C
Typical Characteristics
Output Characteristics
20
VGS=1.8,2,3,4,5,6,7,8,9,10V
Transfer Characteristics
20
ID-Drain Current (A)
12
VGS=1.5V
ID-Drain Current (A)
16
16
12
TJ=125°C TJ=25°C TJ=-55°C
8
8
4
VGS=1V
4
0
0
2
4
6
8
0 0.0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.6
IDS=250uA
On-Resistance vs. Drain Current
0.022
RDS(ON)-On-Resistance (Ω)
VGS(th)-Threshold Voltage (V) (Normalized)
1.4 1.2 1.0 0.8 0.6 0.4 0.2 -50
0.021 0.020 0.019 0.018 0.017 0.016 0.015 0.014
VGS=4.5V VGS=2.5V
-25
0
25
50
75
100 125 150
0
4
8
12
16
20
Tj - Junction Temperature (°C)
ID - Drain Current (A)
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APM9968C
Typical Characteristics
On-Resistance vs. Gate-to-Source Voltage
0.044
ID=6A
On-Resistance vs. Junction Temperature
1.8
VGS=4.5V ID=6A
RDS(ON)-On-Resistance (Ω) (Normalized)
0 1 2 3 4 5 6 7 8
RDS(ON)-On-Resistance (Ω)
0.040 0.036 0.032 0.028 0.024 0.020 0.016 0.012 0.008
1.6 1.4 1.2 1.0 0.8 0.6
0.4 -50
-25
0
25
50
75
100 125 150
VGS - Gate-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Gate Charge
5 2500
V DS =10V ID=6A
Capacitance
Frequency=1MHz
VGS-Gate-Source Voltage (V)
4
2000
3
Capacitance (pF)
1500
Ciss
2
1000
1
500
Coss Crss
0
0
4
8
12
16
20
24
0
0
5
10
15
20
QG - Gate Charge (nC)
VDS - Drain-to-Source Voltage (V)
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APM9968C
Typical Characteristics
Source-Drain Diode Forward Voltage
20 10 60
Single Pulse Power
IS-Source Current (A)
48
Power (W)
1.6
36
TJ=150°C
TJ=25°C
1
24
12
0.1
0.0
0.4
0.8
1.2
0 0.01
0.1
1
10
100
VSD -Source-to-Drain Voltage (V)
Time (sec)
Normalized Thermal Transient Impedence, Junction to Ambient
Normalized Effective Transient Thermal Impedance
2 1
Duty Cycle=0.5
D=0.2 D=0.1
0.1
D=0.05
D=0.02
SINGLE PULSE
1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=50°C/W 3.T JM -T A =P DM ZthJA 4.Surface Mounted
0.01 1E-4
1E-3
0.01
0.1
1
10
100
Square Wave Pulse Duration (sec)
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APM9968C
Packaging Information
TSSOP-8
e 87
2x E/2 E1 E S ( 2)
GAUGE PLANE
12
e/2
D A2 A b A1
0.25
L (L1) ( 3)
1
Dim A A1 A2 b D e E E1 L L1 R R1 S φ1 φ2 φ3
Millimeters Min. 0.00 0.80 0.19 2.9 0.65 BSC 6.40 BSC 4.30 0.45 1.0 REF 0.09 0.09 0.2 0° 0.004 0.004 0.008 0° 4.50 0.75 0.169 0.018 Max. 1.2 0.15 1.05 0.30 3.1 Min. 0.000 0.031 0.007 0.114
Inches Max. 0.047 0.006 0.041 0.012 0.122 0.026 BSC 0.252 BSC 0.177 0.030 0.039REF
12° REF 12° REF
8°
12° REF 12° REF
8°
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APM9968C
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
temperature
Peak temperature
183°C Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/ Convection Average ramp-up rate(183°C to Peak) 3°C/second max. 120 seconds max Preheat temperature 125 ± 25°C) 60 – 150 seconds Temperature maintained above 183°C Time within 5°C of actual peak temperature 10 –20 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 6 minutes max. Time 25°C to peak temperature VPR 10 °C /second max.
60 seconds 215-219°C or 235 +5/-0°C 10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm and all bgas Convection 220 +5/-0 °C VPR 215-219 °C IR/Convection 220 +5/-0 °C pkg. thickness < 2.5mm and pkg. volume ≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 235 +5/-0 °C VPR 235 +5/-0 °C IR/Convection 235 +5/-0 °C
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APM9968C
Reliability test program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 SEC 1000 Hrs Bias @ 125°C 168 Hrs, 100% RH, 121°C -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
E Po P P1 D
t
F W
Bo
Ao
D1 T2
Ko
J C A B
T1
Application
A 330 ± 1
B 62 +1.5 D
C 12.75+ 0.15 D1
J 2 + 0.5 Po
T1 12.4 ± 0.2 P1
T2 2 ± 0.2 Ao
W 12± 0. 3 Bo 3.6 ± 0.3
P 8± 0.1 Ko
E 1.75±0.1 t
TSSOP-8
F
5.5 ± 0. 1 1.5 + 0.1 1.5 + 0.1 4.0 ± 0.1
2.0 ± 0.1 7.0 ± 0.1
1.6 ± 0.1 0.3±0.013
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APM9968C
Cover Tape Dimensions
Application TSSOP- 8 Carrier Width 12 Cover Tape Width 9.3 Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
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