APW7104
1.5MHz, 1A Synchronous Buck Regulator
Features
General Description
•
1A Output Current
•
Wide 2.7V~6.0V Input Voltage
APW7104 is a 1.5MHz high efficiency monolithic synchronous buck regulator. Design with current mode scheme,
•
Fixed 1.5MHz Switching Frequency
•
Low Dropout Operating at 100% Duty Cycle
•
25µA Quiescent Current
•
Integrate Synchronous Rectifier
•
0.6V Reference Voltage
•
Current-Mode Operation with Internal
the APW7104 is stable with ceramic output capacitor. Input voltage from 2.7V to 6.0V makes the APW7104 ideally
suited for single Li-Ion battery powered applications. 100%
duty cycle provides low dropout operation, extending battery life in portable electrical devices. The internally fixed
1.5MHz operating frequency allows the using of small
surface mount inductors and capacitors. The synchronous switches included inside increase the efficiency
Compensation
- Stable with Ceramic Output Capacitors
- Fast Line Transient Response
and eliminate the need of an external Schottky diode.
The APW7104 is available in SOT-23-5/TSOT-23-5A
•
Short-Circuit Protection
packages.
•
Over-Temperature Protection with Hysteresis
•
Available in SOT-23-5/TSOT-23-5A Packages
•
Lead Free and Green Devices Available
(RoHS Compliant)
Pin Configuration
Applications
•
HD STB
•
BT Mouse
RUN 1
•
PND Instrument
GND 2
•
Portable Instrument
APW7104
SW 3
C1
4.7µF
(MLCC)
L1
2.2µH
4 VIN
1
VOUT
SW 3
APW7104
RUN
FB 5
GND
2
4 VIN
SOT-23-5/TSOT-23-5A
(Top View)
Simplified Application Circuit
VIN
5 FB
C2
10µF
(MLCC)
R1
C3
(option)
R2
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2012
1
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APW7104
Ordering and Marking Information
Package Code
BT : TSOT-23-5A B : SOT-23-5
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APW7104
Assembly Material
Handling Code
Temperature Range
Package Code
APW7104 BT :
W04X
X - Date Code
APW7104 B :
W04X
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
VIN
Parameter
Input Bias Supply Voltage (VIN to GND)
RUN, FB, SW to GND Voltage
PD
Power Dissipation
TSDR
Unit
V
-0.3 ~ VIN+0.3
V
Internally Limited
Maximum Junction Temperature
TSTG
Rating
-0.3 ~ 7
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
W
150
o
-65 ~ 150
o
260
o
C
C
C
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Junction-to-Ambient Resistance in Free Air
Typical Value
Unit
(Note 2)
TSOT-23-5A
SOT-23-5
o
C/W
220
250
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operating Conditions (Note 3)
Symbol
VIN
Parameter
Input Bias Supply Voltage (VIN to GND)
Range
Unit
2.7 ~ 6
V
VOUT
Converter Output Voltage
0.6 ~ VIN
V
IOUT
Converter Output Current
0~1
A
L1
Converter Output Inductor
1.0 ~ 10
µH
CIN
Converter Input Capacitor
4.7 ~100
µF
Converter Output Capacitor
4.7 ~100
µF
Ambient Temperature
-40 ~ 85
o
-40 ~ 125
o
COUT
TA
TJ
Junction Temperature
C
C
Note 3: Refer to the typical application circuit
Copyright ANPEC Electronics Corp.
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APW7104
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN=3.6V and TA= 25 oC.
Symbol
Parameter
APW7104
Test Conditions
Unit
Min.
Typ.
Max.
2.7
-
6
V
SUPPLY VOLTAGE AND CURRENT
VIN
Input Voltage Range
IDD
Quiescent Current
VFB = 0.66V
-
25
40
µA
ISD
Shutdown Input Current
RUN = GND
-
-
0.5
µA
UVLO Threshold
2.1
2.35
2.6
V
UVLO Hysteresis
-
0.1
-
V
0.588
0.6
0.612
V
-2.5
-
+2.5
%
-50
-
50
nA
POWER-ON-RESET (POR) and LOCKOUT VOLTAGE THRESHOLDS
REFERENCE VOLTAGE
VREF
IFB
Reference Voltage
VIN=2.7V~6V, TA = -40~85 oC
Output Voltage Accuracy
0A < IOUT < 1A
FB Input Current
INTERNAL POWER MOSFETS
FSW
Switching Frequency
VFB = 0.6V
1.2
1.5
1.8
MHz
Foldback Frequency
VFB = 0.1V
-
210
-
kHz
Foldback Threshold Voltage on FB
VFB Falling
-
0.2
-
V
-
50
-
mV
RP-FET
Foldback Hysteresis
High Side N-FET Switch ON Resistance
ISW =200mA
-
0.28
-
Ω
RN-FET
Low Side P-FET Switch ON Resistance
ISW =200mA
-
0.25
-
Ω
Minimum On-Time
-
-
100
ns
Maximum Duty Cycle
-
-
100
%
1.4
1.6
-
A
PROTECTION
ILIM
TOTP
Maximum Inductor Current-Limit
IP-FET, 2.7V≦VIN≦6V
Over-Temperature Protection
TJ Rising
-
150
-
Over-Temperature Protection Hysteresis
TJ Falling
-
30
-
°C
START-UP AND SHUTDOWN
TSS
Soft-Start Duration
(Note 4)
-
0.7
-
ms
RUN Input High Threshold
VIN = 2.7V~6V
-
-
1
V
RUN Input Low Threshold
VIN = 2.7V~6V
0.4
-
-
V
RUN Leakage Current
VRUN = 5V, VIN = 5V
-1
-
1
µA
Note 4: Guarantee by design, not production test.
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2012
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APW7104
Typical Operating Characteristics
100
100
90
90
80
80
Efficiency (%)
Efficiency (%)
(Refer to the application circuit in the section “Typical Application Circuits”, VIN=3.6V, VOUT=1.8V, TA=25oC unless
otherwise specified )
Efficiency vs. Load Current
Efficiency vs. Load Current
70
60
VIN=3.3V
VIN=5V
50
40
VIN=3.3V
VIN=5V
50
VOUT = 1.2V
L = 2.2µH
COUT = 10µF
30
20
20
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
0
1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Load Current, IOUT(A)
Load Current, IOUT(A)
Supply Voltage v.s. Quiescent Current
Supply Voltage vs. ON Resistance
40
1
0.35
35
RP-FET
0.30
30
ON Resistance(Ω)
Quiescent Current, IDD(µA)
60
40
VOUT = 1.8V
L = 2.2µH
COUT = 10µF
30
70
25
20
15
10
5
0.25
0.20
RN-FET
0.15
0.10
0.05
0
2
2.5
3
3.5
4
4.5
5
5.5
0.00
6
Supply Voltage, V IN(V)
2
2.5
3
3.5
4
4.5
5
5.5
6
Supply Voltage, VIN(V)
Supply Voltage v.s. Reference Voltage
0.65
Reference Voltage, VREF(V)
0.64
0.63
0.62
0.61
0.6
0.59
0.58
0.57
0.56
0.55
2
2.5
3
3.5
4
4.5
5
5.5
6
Supply Voltage, VIN (V)
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APW7104
Operating Waveforms
(Refer to the application circuit in the section “Typical Application Circuits”, VIN=3.6V, VOUT=1.8V, TA=25oC unless
otherwise specified)
Soft Start
Load Transient Response
1A
1
VRUN
300mA
1
VOUT ,1V/Div, DC
2
IOUT, 0.5A/Div, DC
VOUT ,100mV/Div, AC
2
3
IIN, 200mA/Div
L=2.2µH, VIN=5V, VOUT=1.8V, COUT=10µF
L=2.2µH, VIN=5V, COUT=10µF
Time: 100µs/Div
Time: 100µs/Div
Normal Operation
2.5V
1.5V
VIN, 0.5V/Div
1
VSW ,2V/Div, DC
2
VOUT ,20mV/Div, AC
VOUT,200mV/Div,AC
IL, 500mV/Div, DC
3
L=2.2µH, VINI=5V,
VOUT=1.2V, COUT=10µF
= 100mA
OUT
Time: 500ns/Div
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APW7104
Pin Description
PIN
FUNCTION
NO.
NAME
1
RUN
Enable Control Input. Forcing this pin above 1.0V enables the device. Forcing this pin below 0.4V shuts it
down. In shutdown, all functions are disabled to decrease the supply current below 0.5µA. Do not leave
RUN pin floating.
2
GND
Power and Signal Ground.
3
SW
Switch Node Connected to Inductor. This pin connects to the drains of the internal main and synchronous
power MOSFETs switches.
4
VIN
Device and Converter Supply Pin. Must be closely decoupled to GND with a 4.7µF or greater ceramic
capacitor.
5
FB
Feedback Input Pin. The buck regulator senses feedback voltage via FB and regulates the FB voltage at
0.6V. Connecting FB with a resistor-divider from the output sets the output voltage of the buck converter.
Block Diagram
Current
Sense
Amplifier
RUN
VIN
Shutdown
Control
Logic Control
SW
OverTemperature
Protection
Gate
Driver
Current
-Limit
Slope
Compensation
ZeroCrossing
Comparator
∑
GND
Oscillator
ICMP
Error
Amplifier
FB
COMP
EAMP
SoftStart
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2012
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VREF
0.6V
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APW7104
Typical Application Circuit
IIN
VIN
L1
2.2µH
4
SW
VIN
VOUT
3
2.7~6V
C1
4.7µF
(MLCC)
APW7104
1
RUN
FB
R1
5
C3
(option)
GND
2
0.6V~VIN
C2
0~1A
10µF
(MLCC)
R2
R1 ≤ 1MΩ is recommended
R2 ≤ 200kΩ is recommended
C1 closed to IC. Less than 2mm is recommended.
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APW7104
Function Description
Main Control Loop
tion to reduce the dominant switching losses. In PFM
The APW7104 is a constant frequency, synchronous rec-
operation, the inductor current may reach zero or reverse
on each pulse. A zero current comparator turn off the N-
tifier and current-mode switching regulator. In normal
operation, the internal P-channel power MOSFET is
FET, forcing DCM operation at light load. These controls
get very low quiescent current, help to maintain high effi-
turned on each cycle. The peak inductor current at which
ICMP turn off the P-FET is controlled by the voltage on the
ciency over the complete load range.
COMP node, which is the output of the error amplifier
(EAMP). An external resistive divider connected between
Slope Compensation and Inductor Peak Current
The APW7104 is a peak current mode PWM step down
converter. To prevent sub-harmonic oscillations, the
VOUT and ground allows the EAMP to receive an output
feedback voltage VFB at FB pin. When the load current
APW7104 sense the peak current and add slope compensation to stable the converter. It is accomplished in-
increases, it causes a slightly decrease in VFB relative to
the 0.6V reference, which in turn causes the COMP volt-
ternally by adding a compensating ramp to the inductor
current signal at duty cycles in excess of 40%. Normally,
age to increase until the average inductor current matches
the new load current.
Under-Voltage Lockout
this results in a reduction of maximum inductor peak current for duty cycles > 40%. However, the APW7104 uses a
An under-voltage lockout function prevents the device from
operating if the input voltage on VIN is lower than approxi-
special scheme that counteracts this compensating
ramp, which allows the maximum inductor peak current
mately 1.8V. The device automatically enters the shutdown mode if the voltage on VIN drops below approxi-
to remain unaffected throughout all duty cycles.
Adaptive Shoot-Through Protection
mately 1.8V. This under-voltage lockout function is implemented in order to prevent the malfunctioning of the
The gate driver incorporates adaptive shoot-through pro-
converter.
tection to high-side and low-side MOSFETs from conducting simultaneously and shorting the input supply.
Soft-Start
This is accomplished by ensuring the falling gate has
turned off one MOSFET before the other is allowed to
The APW7104 has a built-in soft-start to control the output voltage rise during start-up. During soft-start, an in-
rise.
During turn-off the low-side MOSFET, the internal LGATE
ternal ramp voltage, connected to the one of the positive
inputs of the error amplifier, raises up to replace the ref-
voltage is monitored until it is below 1.5V threshold, at
which time the UGATE is released to rise after a constant
erence voltage (0.6V typical) until the ramp voltage
reaches the reference voltage. Then, the voltage on FB
delay. During turn-off the high-side MOSFET, the UGATE
voltage is also monitored until it is above 1.5V threshold,
regulated at reference voltage.
at which time the LGATE is released to rise after a constant delay.
Enable/Shutdown
Driving RUN to the ground places the APW7104 in shutdown mode. When in shutdown, the internal power
Dropout Operation
As the input supply voltage decreases to a value ap-
MOSFETs turn off, all internal circuitry shuts down and
the quiescent supply current reduces to 0.5µA maximum.
proaching the output voltage, the duty cycle increases
toward the maximum on time. Further, reduction of the
Pulse Frequency Modulation Mode (PFM)
The APW7104 is a fixed frequency, peak current mode
supply voltage forces the main switch to remain on for
more than one cycle until it reaches 100% duty cycle. The
PWM step-down converter. At light loads, the APW7104
will automatically enter in pulse frequency mode opera-
input voltage minus the voltage drop will determine the
output voltage across the P-FET and the inductor.
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2012
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APW7104
Function Description (Cont.)
Dropout Operation (Cont.)
An important detail to remember is that on resistance of
P-FET switch will increase at low input supply voltage.
Therefore, the user should calculate the power dissipation when the APW7104 is used at 100% duty cycle with
low input voltage.
Over-Temperature Protection (OTP)
The over-temperature circuit limits the junction temperature of the APW7104. When the junction temperature exceeds 150oC, a thermal sensor turns off the both power
MOSFETs, allowing the devices to cool. The thermal sensor allows the converters to start a soft-start process and
regulate the output voltage again after the junction temperature cools by 30oC. The OTP is designed with a 30oC
hysteresis to lower the average Junction Temperature
(TJ) during continuous thermal overload conditions, increasing the lifetime of the device.
Short-Circuit Protection
When the output is shortened to the ground, the frequency
of the oscillator is reduced to about 210kHz, 1/7 of the
nominal frequency. This frequency foldback ensures that
the inductor current has more time to decay, thereby preventing runaway. The oscillator’s frequency will progressively increase to 1.5MHz when VFB or VOUT rises above
0V.
Copyright ANPEC Electronics Corp.
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APW7104
Application Information
Input Capacitor Selection
shown in “Typical Application Circuits”. A suggestion of
Because buck converters have a pulsating input current,
a low ESR input capacitor is required. This results in the
maximum value of R2 is 200kΩ to keep the minimum
current that provides enough noise rejection ability through
best input voltage filtering, minimizing the interference
with other circuits caused by high input voltage spikes.
the resistor divider. The output voltage can be calculated
as below:
R1
R1
VOUT = VREF ⋅ 1 +
= 0.6 ⋅ 1 +
R2
R2
Also, the input capacitor must be sufficiently large to stabilize the input voltage during heavy load transients. For
good input voltage filtering, usually a 4.7µF input capacitor is sufficient. It can be increased without any limit for
VOUT
better input-voltage filtering. Ceramic capacitors show
better performance because of the low ESR value, and
R1≤1MΩ
they are less sensitive against voltage transients and
spikes compared to tantalum capacitors. Place the input
FB
R2 ≤ 200kΩ
APW7104
capacitor as close as possible to the input and GND pin of
the device for better performance.
GND
Inductor Selection
Output Capacitor Selection
For high efficiencies, the inductor should have a low DC
The current-mode control scheme of the APW7104 allows the use of tiny ceramic capacitors. The higher ca-
resistance to minimize conduction losses. Especially at
high-switching frequencies, the core material has a
pacitor value provides the good load transients response.
higher impact on efficiency. When using small chip
inductors, the efficiency is reduced mainly due to higher
Ceramic capacitors with low ESR values have the lowest
output voltage ripple and are recommended. If required,
inductor core losses. This needs to be considered when
selecting the appropriate inductor. The inductor value de-
tantalum capacitors may be used as well. The output
ripple is the sum of the voltages across the ESR and the
termines the inductor ripple current. The larger the inductor value, the smaller the inductor ripple current and the
ideal output capacitor.
lower the conduction losses of the converter. Conversely,
larger inductor values cause a slower load transient
∆VOUT
response. A reasonable starting point for setting ripple
current, ∆IL, is 40% of maximum output current. The rec-
V
VOUT ⋅ 1 − OUT
VIN
≅
FSW ⋅ L
1
⋅ ESR +
8 ⋅ FSW ⋅ COUT
When choosing the input and output ceramic capacitors,
ommended inductor value can be calculated as below:
choose the X5R or X7R dielectric formulations. These
dielectrics have the best temperature and voltage char-
V
VOUT 1 − OUT
VIN
L≥
FSW ⋅ ∆IL
acteristics of all the ceramics for a given value and size.
VIN
IL(MAX) = IOUT(MAX) + 1/2 x ∆IL
IIN
IP-FET
To avoid the saturation of the inductor, the inductor should
IL
be rated at least for the maximum output current of the
converter plus the inductor ripple current.
CIN
Output Voltage Setting
P-FET
VOUT
SW
N-FET
In the adjustable version, the output voltage is set by a
resistive divider. The external resistive divider is con-
IOUT
ESR
COUT
nected to the output, allowing remote voltage sensing as
Copyright ANPEC Electronics Corp.
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APW7104
Application Information (Cont.)
Output Capacitor Selection (Cont.)
The maximum power dissipation on the device can be
shown as follow figure:
IL
0.8
Maximum Power Disspation (W)
ILIM
IPEAK
∆IL
IOUT
IP-FET
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-50 -25
0
25
50
75
100 125 150
Junction Temperature (oC)
Thermal Consideration
Layout Consideration
In most applications, the APW7104 does not dissipate
much heat due to its high efficiency. But, in applications
For all switching power supplies, the layout is an impor-
where the APW7104 is running at high ambient temperature with low supply voltage and high duty cycles, the heat
tant step in the design; especially at high peak currents
and switching frequencies. If the layout is not carefully
dissipated may exceed the maximum junction tempera-
done, the regulator might show noise problems and duty
cycle jitter.
ture of the part. If the junction temperature reaches approximately 150°C, both power switches will be turned
1. The input capacitor should be placed close to the VIN
and GND. Connecting the capacitor and VIN/GND with
off and the SW node will become high impedance.
To avoid the APW7104 from exceeding the maximum junc-
short and wide trace without any via holes for good
input voltage filtering. The distance between VIN/GND
tion temperature, the user will need to do some thermal
analysis. The goal of the thermal analysis is to deter-
to capacitor less than 2mm respectively is
recommended.
mine whether the power dissipated exceeds the maximum junction temperature of the part. The power dissi-
2. To minimize copper trace connections that can inject
noise into the system, the inductor should be placed
pated by the part is approximated:
as close as possible to the SW pin to minimize the
noise coupling into other circuits.
PD ≅ IOUT2 x (RP-FET x D+RN-FET x (1-D))
The temperature rise is given by:
3. The output capacitor should be place closed to converter VOUT and GND.
TR = (PD)(θJA)
4. Since the feedback pin and network is a high impedance circuit the feedback network should be routed
Where PD is the power dissipated by the regulator, D is
duty cycle of main switch
away from the inductor. The feedback pin and feedback network should be shielded with a ground plane
D = VOUT/VIN
The θJA is the thermal resistance from the junction of the
die to the ambient temperature. The junction temperature,
or trace to minimize noise coupling into this circuit.
5. A star ground connection or ground plane minimizes
TJ, is given by:
ground shifts and noise is recommended.
TJ = TA + TR
Where TA is the ambient temperature.
Copyright ANPEC Electronics Corp.
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APW7104
Layout Consideration (cont.)
Via to GND
R2
FB
VRUN
R1
L1
Via to VOUT
VOUT
SW
COUT
CIN
VIN
GND
APW7104 Layout Suggestion
Copyright ANPEC Electronics Corp.
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APW7104
Package Information
TSOT-23-5A
D
e
E
E1
SEE VIEW A
b
c
0.25
A
GAUGE PLANE
SEATING PLANE
A1
A2
e1
L
VIEW A
TSOT-23-5A
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
MILLIMETERS
INCHES
A
0.70
1.00
0.028
0.039
A1
0.01
0.10
0.000
0.004
A2
0.70
0.90
0.028
0.035
b
0.30
0.50
0.012
0.020
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
e
0.95 BSC
e1
0.071
0.037 BSC
1.90BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Followed from JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per
side.
Copyright ANPEC Electronics Corp.
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APW7104
Package Information
SOT-23-5
D
e
E
E1
SEE
VIEW A
b
c
0.25
A
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-5
INCHES
MILLIMETERS
MIN.
MAX.
MIN.
A
MAX.
1.45
0.057
A1
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
0.020
b
0.30
0.50
0.012
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
0.118
0.071
E
2.60
3.00
0.102
E1
1.40
1.80
0.055
e
0.95 BSC
e1
1.90 BSC
0.037 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2012
14
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APW7104
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TSOT-23-5A
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
Application
SOT-23-5
4.0±0.10
4.0±0.10
(mm)
Devices Per Unit
Package Type
Unit
Quantity
TSOT-23-5A
Tape & Reel
3000
SOT-23-5
Tape & Reel
3000
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2012
15
www.anpec.com.tw
APW7104
Taping Direction Information
TSOT-23-5A
USER DIRECTION OF FEED
SOT-23-5
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2012
16
www.anpec.com.tw
APW7104
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3 °C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2012
17
www.anpec.com.tw
APW7104
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness