APX9145

APX9145 High Sensitivity Hall Effect Sensor IC with FG Output Features • • • • • • • On-chip Hall Sensor Build-in Output Zener Diodes to Clamp the Peak Output Voltage Build-in Frequency Generation Output High Output Sinking Capability up to 400mA High Sensitivilty Hall Effect Senser IC: ±65G 4 pin TO-92M Package Lead Free Available (RoHS Compliant) General Description The APX9145 is an integrated Hall Effect Sensor IC wit h frequenc y generat ion out put for elec t ric commut ation of DC brushless motor applications. The AP X9145 is available in a low c os t TO-92M4 package. Pin Outs APX9145 Applications • Brushless DC Fan Front View 1 : FG 2 : DO 3 : DOB 4 : GND 12 34 Ordering and Marking Information APX9145 Lead Free Code Handling Code Temp. Range Package Code APX 9145 XXXXX Package Code E : TO - 92M4 Operating Ambient Temp. Range E : - 20 to 70 ° C Handling Code PB : Plastic Bag TB : Tape & Box TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device XXXXX - Date Code APX9145 E : No te: ANPEC lea d-free prod ucts contain mo ld ing co mpo und s/d ie attach m ate ria ls an d 1 00% ma tte tin pla te te rmin atio n fi nish ; wh ich are full y compl iant with Ro HS and compa tibl e wi th both SnPb an d le ad-free sold ieri ng op era tio ns. AN PEC le ad-free produ cts me et or exceed th e l ead -free req uireme nts of IPC /JEDEC J STD -02 0C fo r MSL classi ficati on at lea d-fre e p eak re flo w temp era ture. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 1 www.anpec.com.tw APX9145 Block Diagram APX9145 Temperature Compensated Current Amplifier Zener Diodes Voltage Regulator Hall Element Latch Circuit Output Buffer 1 Output Buffer 2 Zener Diodes DO DOB Rotation Frequency Detection Hysteresis Control Sensitivity Control Gnd FG Pin Description PIN No. 1 2 3 4 Name FG DO DOB GND Coil output / Power input Coil output / Power input IC ground (TA = 25°C unless otherwise noted) Description Open collector pin for rotation frequency detection Absolute Maximum Ratings Symbol VCC VOFF IFG IOUT PD TJ TSTG T SOL FG Pin Off Voltage FG Sink Current Output Current Maximum Power Dissipation Junction Temperature Range Storage Temperature Range Soldering Temperature (10 Sec.) Parameter Supply Voltage (DO/DOB Voltage) Rating 25 25 10 500 500 -20 to 150 -65 to 150 260 Unit V V mA mA mW °C Note 1: Stresses beyond the absolute maximum rating may damage the devic e and operating in the absolute maximum rating conditions may affect device reliability. Note 2: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) = (TJ – TA) / θJA ; TJ = 125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature. C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 2 www.anpec.com.tw APX9145 Recommended Operating Conditions S ymbol VC C I OUT I FG VOFF TJ TA Parameter Supply voltage (DO/DOB Voltage) Maximum Output Sink Current Maximum FG Sink Current Maximum FG Pin Off Voltage Operating Ambient Temperature Junction Temperature Range (TA = 25°C) Rating 3.7 to 20 400 5 20 -20 to 70 -20 to 125 Unit V mA mA V °C °C Electrical Characteristics Symbol VSAT ICC IOFF VON Vclamp tr tf td Parameter Output Saturation Voltage Supply Current FG OFF Leakage Current FG ON Saturation Voltage Clamp Output Voltage Output Rise Time Output Fall Time Propagation Delay Time (TA = 25°C, VCC=12V unless otherwise noted) Test Condition IOUT = 400mA APX9145 Min. Typ. 700 11 Max. 9 00 15 1 0 .4 Unit mV mA µA V V µS µS µS IFG = 5mA RL = 200Ω, CL = 10pF RL = 200Ω, CL = 10pF RL = 200Ω, CL = 10pF 0.2 33 0.4 0.1 2 Magnetic Characteristics Symbol Bop Brp Parameter Magnetic Operate Points Magnetic Release Points (TA = 25°C, VCC=12V unless otherwise noted) Test Condition APX9145 Min. 10 -65 Typ. Max. 65 -10 Unit Gauss Gauss C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 3 www.anpec.com.tw APX9145 Test Circuit V1 +B -B V2 IFG A IOFF A ICC VON V V VCC Note 1: Measure VCC, ICC when DO is off. Note 2: Measure VON, IFG when FG is on. Note 3: Measure IOFF when FG is off. Application Circuit Typical DC brushless fan applicat ion circuit VFG VDD APX9145 +B -B 1 234 L1 L2 C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 4 www.anpec.com.tw APX9145 Typical Characteristics (TA = 25°C, VCC=12V unless otherwise noted) Supply Current vs. Supply Voltage 12 12 Supply Current vs. Temperature 10 11.5 Supply Current (mA) Supply Current (mA) 8 11 6 10.5 4 10 2 9.5 0 0 5 10 15 20 25 9 -20 0 20 40 60 80 100 120 140 Supply Voltage (V) Temperature (°C) Magnetic Switching Points vs. Supply Voltage 60 Magnetic Switching Points vs. Temperature 60 Magnetic Switching Points (G) Magnetic Switching Points (G) 3 7 11 15 19 23 45 30 15 0 -15 -30 -45 -60 45 30 15 0 -15 -30 -45 -60 -20 0 20 40 60 80 100 120 140 Supply Voltage (V) Temperature (°C) C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 5 www.anpec.com.tw APX9145 Typical Characteristics (Cont.) Output Current vs. Output Saturation Voltage 400 350 300 250 200 150 100 50 0 0.15 0.3 0.45 0.6 0.75 FG Sink Current vs FG On Saturation Voltage 5 FG Sink Current (mA) Output Current (mA) 4 3 2 1 0 0.1 0.15 0.2 0.25 Output Saturation Voltage (V) FG On Saturation Voltage(V) Power Dissipation vs. Temperature 600 500 400 300 200 100 0 0 25 50 75 100 125 Power Dissipation (mW) Temperature (°C) C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 6 www.anpec.com.tw APX9145 Package Information TO-92M4 Marking Surface S E L A L1 b1 e1 D J 1.35mm 1.75mm IC chip C e Sensitive Area (0.286× 0.286mm2) Position of Hall Sensor reference to the top-left of package x= 1.35 ± 0.1mm y= 1.75± 0.1mm Dim A b1 C D e e1 E J L L1 S Millimeters Min. 3.60 0.35 0.351 5.17 3.78 1.24 1.50 4.04 14.0 1.342 0.45 Max. 3.70 0.41 0.411 5.27 3.84 1.30 1.60 4.34 15.0 1.542 0.55 Min. 0.141 0.014 0.014 0.203 0.148 0.049 0.059 0.158 0.549 0.053 0.018 Inches Max. 0.145 0.016 0.016 0.207 0.150 0.051 0.063 0.170 0.588 0.060 0.022 C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 7 www.anpec.com.tw APX9145 Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. (IR/Convection or VPR Reflow) Reflow Condition TP tp Critical Zone T L to T P Ramp-up TL Temperature tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25 C to Peak ° Time Classificatin Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate 3°C/second max. 3°C/second max. (TL to T P) Preheat 100°C 150°C - Temperature Min (Tsmin) °C 150 200°C - Temperature Max (Tsmax) 60-120 seconds 60-180 seconds - Time (min to max) (ts) Time maintained above: 183°C 217°C - Temperature (TL) 60-150 seconds 60-150 seconds - Time (t L) Peak/Classificatioon Temperature (Tp) See table 1 See table 2 Time within 5 °C of actual 10-30 seconds 20-40 seconds Peak Temperature (tp) Ramp-down Rate 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25 °C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface. C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 8 www.anpec.com.tw APX9145 Classificatin Reflow Profiles (Cont.) T able 1. SnPb Entectic Process – Package Peak Reflow Temperatures 3 3 P ackage Thickness Volume mm Volume mm < 350 ≥ 350 < 2.5 mm 240 +0/-5 °C 225 +0/- 5 ° C ≥ 2.5 mm 225 +0/-5 °C 225 +0/- 5 ° C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 P ackage Thickness Volume mm Volume mm Volume mm < 350 3 50 -2000 > 2000 < 1.6 mm 260 +0 ° C * 260 +0° C* 260 +0 ° C * 1 .6 mm – 2.5 mm 260 +0 ° C * 250 +0° C* 245 +0 ° C * ≥ 2.5 mm 250 +0 ° C * 245 +0° C* 245 +0 ° C * * Tolerance: The device manufacturer/supplier s hall a ssure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0 °C. For example 260 ° C+0 °C) at the rated MSL level. Reliability test program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245° C , 5 SEC 1000 Hrs Bias @ 125 °C 168 Hrs, 100 % RH , 121 ° C -65° C ~ 150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms , Itr > 1 00mA Carrier Tape & Reel Dimensions t P P1 D Po E F W Bo Ao Ko D1 C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 9 www.anpec.com.tw APX9145 Carrier Tape & Reel Dimensions (Cont.) T2 J C A B T1 Application A0 3.18~12 C2 7.8 A1 9 0±1 D 4.0±0.2 H2A A2 76±1 D1 0.36~0.53 H3 A3 30±1 D2 9.0 MAX H4 B0 90±1 F1=F2 2.5+0.2 -0.1 H5=H0+M 18.5±0.5 T3 15 B1 31±1 F 1-F2 ±0.3 L 11.0 MAX T4 1.7 B2 76±1 M 2.5±0.5 L1 2.5 MIN W 18.0±0.2 C0 5.8 H 16±0.5 P 12.7±0.3 W1 6.0±0.2 C1 3.8 H1 9±0.5 P1 6.35±0.4 W2 ≤1 TO-92 H2 0.5 MAX 0.5 MAX 27.0 MAX 20.0 MAX P2 T T1 T2 50.8±0.5 0.55 MAX 1.42 MAX 0.36~0.68 (mm) Cover Tape Dimensions Application TO-92 Carrier Width 17.5~19 Cover Tape Width 5.0~7.0 Devices Per Reel 2000 (mm) Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 C opyright © A NPEC Electronics C orp. Rev. A.2 - Nov., 2005 10 www.anpec.com.tw