APX9267

APX9267 Single-Phase Full-Wave Motor Driver for Silent Fan Motor Features • • • • • • • • • • Single Phase Full Wave Fan Driver Silent Driver Low Supply Current Low Standby Current (Lock mode TOFF or PWM=0 duty), Supply current less than 220µA Speed Controllable by PWM Input Signal Built-in Quick Start Function Lock Protection and Auto Restart Function Built-in FG Output Built-in Thermal Protection Circuit Lead Free and Green Devices Available (RoHS Compliant) General Description The APX9267 is a single phase full wave motor driver for DC fan motor, and speed controlled by PWM input signal. The output signal of this IC is the amplified hall input signal. It is suitable for both game machine and CPU cooler that need silent drivers. The device is built-in lock protection. When fan is locked, the device will enter the lockup protection mode. It is also with thermal shutdown function. In normal operation, supply current is less than 5mA, but in PWM=0 standby mode, it is just around 150mA. Moreover, this feature will shutdown Amplifier and FG. The APX9267 is available in MSOP-8 package. Pin Configuration OUT2 VCC IN+ IN1 2 3 4 8 7 6 5 GND OUT1 PWM FG Applications • Motor Drivers For Silent Fan Motors MSOP-8 Ordering and Marking Information APX9267 Assembly Material Handling Code Temperature Range Package Code A9267 XXX XX Package Code X : MSOP-8 Operating Ambient Temperature Range I : -40 to 105 °C Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G :Halogen and Lead Free Device XXXXX - Date Code APX9267 X : Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature.ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings (Note 1) Symbol VCC IOUT VOUT VFG IFG VCC Pin Supply Voltage Output Pin Output Current Output Pin Output Voltage FG Pin Output Voltage FG Pin Sink Current Parameter Rating 7 1 7 7 10 Unit V A V V mA ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright © ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 1 www.anpec.com.tw APX9267 Absolute Maximum Ratings (Cont.) Symbol RTH, JA PD TJ TSTG TSDR Parameter Thermal Resistance-Junction to Ambient MSOP-8 Power Dissipation Junction Temperature Storage Temperature Maximum Lead Soldering Temperature, 10 Seconds Rating 225 0.585 -40 to 150 -65 to 150 260 Unit °C/W W °C °C °C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Recommended Operating Conditions Symbol VCC VHall TA VCC Pin Supply Voltage Hall Input Voltage Range Ambient Temperature Parameter Rating 2.3 to 5.5 0.2 to Vcc-1.1 -40 to 105 Unit V V °C Electrical Characteristics Symbol ICC1 ICC2 VPWMH VPWML FPWM VHOFS GIO VOL VOH VFG IFG Parameter Operating Current Standby Supply Current PWM Input High Level Voltage PWM Input Low Level Voltage PWM Input Frequency Input Offset Voltage Input–Output Gain Output Lower Side Saturation Output Upper Side Saturation FG Pin Low Voltage FG Pin Leak Current Over Temperature Shutdown Over Temperature Shutdown Hysteresis TQS Quick Start Enable Time (VCC=5V, TA= 25°C, unless otherwise specified) Test Conditions Rotation Mode Lock Protect TOFF or PWM= 0 APX9267 Min. 2.5 0 0.02 VOUT/H+-H-(ratio) IOUT= 250mA IOUT= 250mA IFG= 3mA VFG= 5V 45 Typ. 3 150 48 0.15 0.15 0.2 170 35 66.5 Max. 5 220 VCC+0.5 1 50 ±6 51 0.22 0.22 0.3 10 90 °C mSec Unit mA µA V V kHz mV dB V V V µA C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 2 www.anpec.com.tw APX9267 Typical Operating Characteristics VCC Supply Current vs. VCC Supply Voltage 4 Operation Mode VCC Supply Current vs. VCC Supply Voltage 250 Standby Mode 3.5 VCC Supply Current (mA) 3 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 VCC Supply Current (µA) 200 150 100 50 0 0 1 2 3 4 5 6 7 VCC Supply Voltage (V) VCC Supply Voltage (V) FG Pin Current vs. FG Pin Low Voltage 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Offset Voltage vs. Ambient Temperature 1.4 1.2 Offset Voltage (mV) FG Pin Current (mA) 1 0.8 0.6 0.4 0.2 0 -40 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 -20 0 20 40 60 80 FG Pin Low Voltage (V) Ambient Temperature (°C) Saturation Voltage vs. Output Current 0.8 0.7 Maximum Power Dissipation vs. Ambient Temperature Maximum Power Dissipation (mW) 700 600 500 400 300 200 100 0 0 25 50 75 100 125 150 Saturation Voltage (V) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 100 200 300 400 500 600 700 800 Low Side MOSFET Upper Side MOSFET Output Current (mA) C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 3 Ambient Temperature (°C) www.anpec.com.tw APX9267 Operating Waveforms Rotation Waveform 1 VIN+(50mV/div) VIN-(50mV/div) Rotation Waveform 2 VIN+(50mV/div) VIN-(50mV/div) VOUT1(2V/div) VOUT2(2V/div) VOUT1(2V/div) VOUT2(2V/div) Time (0.2ms/div) Time (0.2ms/div) Rotation Waveform 3 Rotation Waveform 4 IIN(100mA/div) IIN(100mA/div) VOUT1(5V/div) VOUT2(5V/div) VOUT1(5V/div) VOUT2(5V/div) VFG(5V/div) VFG(5V/div) Time (2ms/div) Time (0.2ms/div) Lock Protection Waveform 1 Lock Protection Waveform 2 IOUT(200mA/div) VOUT1(5V/div) VOUT2(5V/div) IOUT(200mA/div) VOUT1(5V/div) VOUT2(5V/div) VFG(5V/div) VFG(5V/div) Time (2s/div) Time (2s/div) C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 4 www.anpec.com.tw APX9267 Pin Description PIN No. 1 2 3 4 5 6 7 8 Name OUT2 VCC IN+ INFG PWM OUT1 GND H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Supply Voltage Input Pin. Hall Input +. Hall Input -. Rotation Speed Output. PWM Signal Input Terminal. H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Ground. Description Block Diagram OUT2 150kΩ OSC 500Ω GND VCC Lock Protection Control Vcc 5µA OUT1 TSD 90KΩ 10kΩ PWM IN+ 500Ω 150kΩ FG IN- C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 5 www.anpec.com.tw APX9267 Typical Application Circuit 1 Zener D2 2 C1 6V 3 OUT2 GND 8 D1 VIN VCC OUT1 7 PWM control signal Hall IN+ PWM 6 10kΩ 4 INFG 5 RFG Pull High Voltage FG Output Note 2: In hot plug application, it’ necessary to protect against a hot plug input voltage overshoot. Add an input zener diode, between s the VCC and GND, to clamp the overshoot. In normal operation diode, the zener diode isn’ stressed because output current t doesn’ reverse to VCC. t Function Description Lockup Protection and Automatic Restart This IC detects the rotation of the motor by hall signal, and adjusts lock detection ON time (TON) and lock detection OFF time (TOFF) by internal counter. These times (TON, TOFF) are showed below. IN+ IN- Quick Start and Standby mode This IC would enter standby mode when the PWM input keeps low level for more than 66.5ms (typ.). In standby mode, it will shutdown amplifier and FG. Thus, the supply current is around 150µA. In standby mode, the lock protection function doesn’ work, therefore, starting fan is t unobstructed when releasing standby mode. OUT2 TOFF TOFF PWM 66.5ms (typ.) TON OUT1 Lock protect enable (internal) enable disable enable Figure 2. Quick Start Waveform FG Frequency Generator Function Lock Lock Detection Release Reset The FG pin is an open collector output, connecting a pull up resistor to a high level voltage for the frequency gen- Figure 1. Lock Protection and Automatic Protection Waveform C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 6 www.anpec.com.tw APX9267 Function Description (Cont.) Frequency Generator Function (Cont.) erator function. During the Lock Mode, the FG will be always high (switch off) (See Truth Table). Open the terminal when not in using. Thermal Protection The APX9267 has thermal protection, when internal junction temperature reaches 170°C, the output devices will be switched off. When the IC’ junction temperature s cools by 35 °C, the thermal sensor will turn the output devices on again, resulting in a pulsed output during continuous thermal protection. Truth Table Input INL H H L L H IN+ H L L H H L PWM H OUT1 H L L L L L OFF Output OUT2 L H L L L L OFF FG L OFF OFF L OFF OFF OFF Lock Mode Standby Mode Operation Mode Mode L L Application Information Input Protection Diode & Capacitor The APX9267 should be added a protection diode (D1) to protect the damage from the power reverse connection. However, the protection diode will cause a voltage drop on the supply voltage. The current rating of the diode must be greater than the maximum output current. For the noise reduction purpose, a capacitor (C1) 1µF is connected between VCC and GND (See Typical Application Circuit). Hall input Please adjust hall input voltage by value of resistance so that hall signal contains amplitude input within range GND~VCC -1.1. The output signal of this IC is the amplified hall input signal, therefore, the output signal depends on hall input. When the hall input is small, the output signal becomes gentle. Oppositely, when the input signal is large, the output becomes steep (See Figure 3. Differences of output signal depending on the shape of hall input signal) .The input/output gain is 48dB (typ.). Thus, please adjust the amplitude of hall input to meet the adequate output voltage. C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 7 www.anpec.com.tw OUT1 (IN+)-(IN-) OUT1 (IN+)-(IN-) Figure 3. Differences of Output Signal Depending on the Shape of Hall Input Signal APX9267 Application Information (Cont.) PWM input It is possible to change rotation speed of the motor by switching high side output transistor. The on-duty of switching depends on the input signal to PWM terminal. (See Figure 4. PWM Input Waveform) The value of resistor in the range of 1k Ω t o 10k Ω i s recommended. Thermal Consideration Refer to “Maximum Power Dissipation vs. Ambient Temperature”, the IC is safe to operate below the curve and it will cause the thermal protection if the operating area is above the line. For example, T A = 75°C, the maximum power dissipation is about 0.35W. The power dissipation can be calculated by the following equation: PD = (VCC - |VOUT1 - VOUT2|) x IOUT + VCC x ICC PWM IN+ For example: VCC = 5V, ICC = 4mA, IOUT = 270mA, VOUT1 = 4.83V, VOUT2 = 0.17V, then PD = 0.111W OUT1 The GND pin provides an electrical connection to ground and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissipates most of the heat into ambient air. OUT2 FG Figure 4. PWM Input Waveform The input level of PWM terminal is H : High side output transistor is ON L : High side output transistor is OFF When PWM terminal is open, it is equal to H. FG Resistor The value of the FG resistor could be decided by the following equation: − RFG = V CC V FG IFG For example: VCC=5V, IFG=3mA, VFG=0.2V, RFG=1.6kΩ C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 8 www.anpec.com.tw APX9267 Package Information MSOP-8 D SEE VIEW A E1 e b E c A2 0.25 VIEW A MSOP-8 INCHES MIN. MAX. 0.043 0.000 0.030 0.009 0.003 0.114 0.185 0.114 0.026 BSC 0.80 8° 0.016 0° 0.031 8° 0.006 0.037 0.015 0.009 0.122 0.201 0.122 MAX. 1.10 0.15 0.95 0.38 0.23 3.10 5.10 3.10 A A1 S Y M B O L A A1 A2 b c D E E1 e L 0 MILLIMETERS MIN. 0.00 0.75 0.22 0.08 2.90 4.70 2.90 0.65 BSC 0.40 0° Note: 1. Follow JEDEC MO-187 AA. 2. Dimension “D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E1”does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 5 mil per side. C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 9 0 L GAUGE PLANE SEATING PLANE www.anpec.com.tw APX9267 Carrier Tape & Reel Dimensions OD0 P0 P2 P1 A E1 F K0 B SECTION A-A T B0 A0 OD1 B A SECTION B-B d Application MSOP- 8 T1 C d 12.4+2.00 13.0+0.50 330.0± 2.00 50 MIN. 1.5 MIN. -0.00 -0.20 P0 P1 P2 D0 D1 1.5+0.10 4.00± 0.10 8.00± 0.10 2.00± 0.10 1.5 MIN. -0.00 A H H A T1 D W E1 W F 5.5± 0.10 0.30 1.75± 0.10 20.2 MIN. 12.0± T A0 B0 K0 0.6+0.00 6.70± 0.20 3.30± 0.20 1.40± 0.20 -0.40 (mm) Devices Per Unit Package Type MSOP- 8 Unit Tape & Reel Quantity 3000 C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 10 www.anpec.com.tw APX9267 Reflow Condition TP (IR/Convection or VPR Reflow) tp Critical Zone TL to TP Ramp-up TL Temperature tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Time Description 245°C, 5 sec 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Time 25°C to Peak Temperature Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds See table 1 10-30 seconds 6°C/second max. 6 minutes max. Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds See table 2 20-40 seconds 6°C/second max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface. C opyright © A NPEC Electronics Corp. Rev. A.6 - Mar., 2008 11 www.anpec.com.tw APX9267 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness