APX9270

APX9270 Direct PWM Variable Speed Fan Motor Driver Features • • • • • • • Single Phase Full Wave Fan Driver Low Quiescent Current (6mA Typical) Built-in Variable Speed Function Current Limit Circuit (includes both internal and external Current Limit) Built-in Lock Protection and Auto Restart Function FG (rotation speed detection) Output Soft Switching Circuit (before phase change, enabling low-consumption, low loss and low noise drive.) Over Voltage Protection (16.5V Typical) Built-in Kickback Absorption Circuit Built-in Thermal Protection Circuit Lead Free and Green Devices Available (RoHS Compliant) General Description The APX9270 is a single phase, DC brushless motor driver with PWM variable speed control and current limit features suitable for the fan of personal computer’ power s supply and CPU cooler. The PWM control system includes thermistor input signal and direct PWM input signal, enabling highly silent and low vibration speed control. The device is equipped with a built-in lock protection, which protects the fan when it is locked. It also has rotation speed detection output and thermal protection function. The APX9270 is available in SSOP-20 and TSSOP-20P packages (see Pin Configurations). • • • • Applications • • CPU Coolers Variable Speed Control Fans Ordering and Marking Information APX9270 Assembly Material Handling Code Temperature Range Package Code APX9270 XXXXX Package Code N : SSOP-20 R: TSSOP-20P Operating Ambient Temperature Range I : -40 to 90 oC Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device XXXXX - Date Code APX9270 N/R : Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Pin Configurations PGND 1 OUT2 2 VM 3 VCC 4 OSCH 5 OSCL 6 SET 7 MIN 8 PWM 9 OSC10 SSOP-20 20 PGND 19 PGND 18 OUT1 17 SGND 16 6VREG 15 CT 14 IN 13 HB 12 IN + 11 FG PGND 1 OUT2 2 VM 3 VCC 4 OSCH 5 OSCL 6 SET 7 MIN 8 PWM 9 OSC10 TSSOP-20P 20 PGND 19 PGND 18 OUT1 17 SGND 16 6VREG 15 CT 14 IN 13 HB 12 IN + 11 FG ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 1 www.anpec.com.tw APX9270 Absolute Maximum Ratings Symbol VCC VM IOUT VOUT1/VOUT2 VPGND IHB VSET VMIN VPWM VFG IFG VOSC VCT PD TJ TSTG TSDR Parameter VCC Pin Supply Voltage (VCC to SGND) VM Pin Supply Voltage (VM to SGND) OUT1/OUT2 Pin Maximum Output Current OUT1/OUT2 Pin Output Voltage (OUT1, OUT2 to SGND) PGND to SGND Voltage HB Pin Output Current SET Pin Input Voltage (SET to SGND) MIN Pin Input Voltage (MIN to SGND) PWM Pin Input Voltage (PWM to SGND) FG Pin Output Voltage (FG to SGND) FG Pin Output Current OSC Pin Input Voltage (OSC to SGND) CT Pin Input Voltage (CT to SGND) Power Dissipation SSOP-20 TSSOP-20P Maximum Junction Temperature Storage Temperature Range Maximum Lead Soldering Temperature, 10 Seconds 1.2 1.5 150 -55 to 150 260 °C °C °C W Ratings -0.3 to 18 -0.3 to VCC 1.2 VPGND-0.3 to VM -0.3 to 0.3 0 to 15 -0.3 to 7 -0.3 to 7 -0.3 to VCC -0.3 to VCC 0 to 10 -0.3 to 7 -0.3 to 7 Unit V V A V V mA V V V V mA V V Note 1: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. Thermal Characteristics Symbol RTH,JA Parameter Thermal Resistance-Junction to Ambient SSOP-20 TSSOP-20P Note 2: Mounted on a board (60x38x1.6t mm, Glass epoxy). Value 104 83 Unit ° C/W Recommended Operating Conditions Symbol VCC VM VSET VMIN VPWM VOSCH/VOSCL VICM TA VCC Pin Supply Voltage VM Pin Supply Voltage SET Pin Input Voltage Range MIN Pin Input Voltage Range PWM Pin Input Voltage Range OSC High/Low Level Input Voltage Range Hall Input Common Phase Input Voltage Range Ambient Temperature Parameter Rating 4.5 to 15 3.5 to 15 0 to 6 0 to 6 0 to VCC 0 to 6 0.2 to 3 -40 to 90 Unit V V V V V V V °C C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 2 www.anpec.com.tw APX9270 Electrical Characteristics Symbol SUPPLY CURRENT V6VREG VHB ICC1 ICC2 OSCILLATOR IOSC1 IOSC2 OSC Charge Current OSC Discharge Current CCT = 1µF CCT = 1µF VCT = 0V VCT = 3.6V RCT = ICT1/ICT2 IOUT = 400mA IOUT = 400mA IFG = 5mA VFG = 7V Zero to peak including offset and hysteresis 7.5 7.5 10 10 12.5 12.5 µA µA V V µA µA 6VREG Pin Output Voltage HB Pin Output Voltage Operating Current I6VREG = 5mA IHB = 5mA Rotation Mode Lock Protection Mode 5.85 1.2 6 1.3 6 6 6.15 1.4 8 8 V V mA mA Parameter (VCC = 12V, TA = 25°C, RL= 0Ω, unless otherwise specified) APX9270 Min. Typ. Max. Test Conditions Unit LOCK PROTECTION VCTH VCTL ICT1 ICT2 RCT VOL VOH VFG IFGL CT Pin High Level Voltage CT Pin Low Level Voltage CT Charge Current CT Discharge Current CT Charge/Discharge Current Ratio 3.4 1.4 1.65 0.165 8 3.6 1.6 2.2 0.22 10 3.8 1.8 2.75 0.275 12 OUTPUT DRIVERS Output Lower Side Saturation Output Upper Side Saturation FG Pin Low Voltage FG Pin Leak Current 0.2 0.4 0.2 0.1 0.3 0.6 0.4 1 V V V µA HALL SENSITIVITY VHN Hall Input Sensitivity 25 35 mV CURRENT-LIMIT ILIM IRL Internal Current-Limit External Current-Limit RL= 0.5Ω 1200 960 mA mA THERMAL PROTECTION Thermal Protection Temperature Thermal Protection Hysteresis Over-Voltage Protection VOV Over-Voltage Threshold 16.5 V 160 20 °C C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 3 www.anpec.com.tw APX9270 Typical Operating Characteristics VCC Supply Current vs. VCC Supply Voltage 7 Rotation Mode VCC Supply Current vs. VCC Supply Voltage 7 Lock Mode 6 VCC Supply Current (mA) 5 4 3 2 1 0 0 5 10 15 VCC Supply Voltage (V) VCC Supply Current (mA) 6 5 4 3 2 1 0 0 5 10 15 VCC Supply Voltage (V) 11 OSC Charge/Discharge Current (µA) OSC Charge/Discharge Current vs. VCC Supply Voltage CT Charge/Discharge Current (µA) 3 2.5 2 1.5 1 0.5 0 0 CT Charge/Discharge Current vs. VCC Supply Voltage Charge Current 10.5 Charge Current 10 Discharge Current 9.5 Discharge Current 9 0 5 10 15 VCC Supply Voltage (V) 5 10 15 VCC Supply Voltage (V) Output Saturation Voltage vs. Output Current 2000 1800 Output Saturation Voltage (mV) 1400 1200 1000 800 600 400 200 0 0 200 400 Lower Side Saturation Voltage FG Pin Low Voltage vs. Sink Current 300 250 FG Pin Low Voltage (mV) 1600 Upper Side Saturation Voltage 200 150 100 50 0 0 1 2 3 4 5 6 7 8 9 10 FG Pin Sink Current (mA) 600 800 1000 Output Current (mA) C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 4 www.anpec.com.tw APX9270 Typical Operating Characteristics Maximum Power Dissipation vs. Ambient Temperature TSSOP-20P 1.6 Maximum Power Dissipation (W) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 25 SSOP-20 Ambient Temperature ( °C) 50 75 100 125 150 Operating Waveforms Rotation Waveform 1 VOUT1 Rotation Waveform 2 VCC VOUT1 1, 2 VOUT2 1 2, 3 VIN- VOUT2 3, 4 VIN+ 4 IIN Ch1 : VOUT1, 5V/Div, DC Ch2 : VOUT2, 5V/Div, DC Ch3 : VIN+, 100mV/Div, AC Ch4 : VIN-, 100mV/Div, AC Time : 2ms/Div Ch1 : VCC, 5V/Div, DC Ch2 : VOUT1, 5V/Div, DC Ch3 : VOUT2, 5V/Div, DC Ch4 : IIN, 500mA/Div, DC Time : 2ms/Div C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 5 www.anpec.com.tw APX9270 Operating Waveforms (Cont.) Rotation Waveform 3 VCC VOUT1 VOUT2 Power ON Waveform VCC VOUT1 1 2, 3 1 2, 3 VOUT2 4 4 IIN IIN Ch1 : VCC, 5V/Div, DC Ch2 : VOUT1, 5V/Div, DC Ch3 : VOUT2, 5V/Div, DC Ch4 : IIN, 200mA/Div, DC Time : 2ms/Div Ch1 : VCC, 5V/Div, DC Ch2 : VOUT1, 5V/Div, DC Ch3 : VOUT2, 5V/Div, DC Ch4 : IIN, 500mA/Div, DC Time : 50ms/Div Lock Protection Waveform 1 VOUT2 Lock Protection Waveform 2 VOUT2 1, 2 VOUT1 1, 2 VOUT1 3 VCT 3 VCT 4 IIN 4 IIN Ch1 : VOUT1, 5V/Div, DC Ch2 : VOUT2, 5V/Div, DC Ch3 : VCT, 2V/Div, DC Ch4 : IIN, 1A/Div, DC Time : 1s/Div Ch1 : VOUT1, 5V/Div, DC Ch2 : VOUT2, 5V/Div, DC Ch3 : VCT, 2V/Div, DC Ch4 : IIN, 1A/Div, DC Time : 1s/Div C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 6 www.anpec.com.tw APX9270 Pin Description PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NAME PGND OUT2 VM VCC OSCH OSCL SET MIN PWM OSC FG IN+ HB INCT 6VREG SGND OUT1 PGND PGND Power Stage GND. H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Supply Voltage for Output Stage Input Pin. Supply Voltage Input Pin. Setting of the OSC Waveform High Level Voltage. Use a voltage divider from 6VREG to set OSC waveform high-level voltage. Setting of the OSC Waveform Low Level Voltage. Use a voltage divider from 6VREG to set OSC waveform low-level voltage. Speed Setting. An external voltage into SET pin to set fan speed. Minimum Speed Setting. Use a voltage divider from 6VREG to set MIN pin voltage for setting minimum speed. PWM Signal Input Terminal. Oscillator Frequency Setting. Connect a capacitor to SGND to set oscillation frequency. Rotation Speed Output. This is an open-collector output. Hall Input +. Connect to hell element positive output. Hall Bias. This is a 1.3V constant-voltage output for hall element bias. Hall Input -. Connect to hell element negative output. Shutdown Time and Restart Time Setting. Connect a capacitor to SGND to set shutdown time and restart time in lock mode. 6V Regulator Output. This is a 6V constant-voltage output for application circuit biases. Control Stage GND. H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Power Stage GND. Power Stage GND. FUNCTION C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 7 www.anpec.com.tw APX9270 Block Diagram FG Thermal Protection VCC VM 6VREG 6V Regulator External Current Limiter Level Shift HB Hall Bias Control circuit Internal Current Limiter Level Shift OUT 1 HALL IN+ IN - M OUT 2 Charge/discharge circuit Oscillating circuit SGND CT PWM MIN SET OSCH OSCL OSC PGND Typical Application Circuits 1. With external current limiter IIN VIN RL Pull High R1=1Ω Voltage CM=4.7µF /25V VCC 6VREG R6 PWM PWM input R7 R2 OSCH R4 R5 R3 OSCL VM RFG=10KΩ FG OUT1 M OUT2 MIN HB SET IN+ INSGND PGND H OSC Thermistor COSC=100pF CT CCT=0.47 to 1µF C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 8 www.anpec.com.tw APX9270 Typical Application Circuits (Cont.) 2. Without external current limiter IIN VIN R1=2Ω C1=4.7µF/25V VCC 6VREG R6 PWM PWM input R7 R2 OSCH R4 R5 OUT2 MIN HB SET Thermistor COSC=100pF Pull High Voltage VM RFG=10KΩ FG OUT1 R3 OSCL M IN+ INSGND PGND H OSC CT CCT=0.47 to 1µF Note 3: In hot plug application, it’ necessary to protect against a hot plug input voltage overshoot. Placing a s resistor (R1) in series with a capacitor (C1 or CM) dampens the overshoot. C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 9 www.anpec.com.tw APX9270 Function Description Variable Speed Control The APX9270 is designed with a variable speed controller which has two external input signals, a temperature signal sensed by a thermistor and an external PWM signal. Temperature Speed Control Using thermistor get temperature to make SET pin voltage. The fan’ speed is decided by comparing OSC and s SET pin voltage. In addition, the lowest drive duty is set by comparing the OSC oscillating voltage and MIN pin voltage (only for temperature speed control side). Temperature control system works by comparing the voltage of SET and OSC. When SET voltage is lower than OSC voltage, one OUT pulled high and another OUT pulled low. On the contrary, when SET voltage is higher than OSC voltage, upper side transistors are OFF; meanwhile, the coil current re-circulates lower side transistor. Therefore, with decreasing SET voltage, the output ON-Duty will be increasing, which results in the increasing of the coil current and motor rotation speed. External PWM Speed Control This is a pin for the direct PWM speed control. PWM pin input is pulled down to GND when it is not used. The minimum duty is performed by R6 and R7 resistances (see Typical Application Circuit). R7 is left open if you want to stop rotation when PWM duty is 0%. (see Figure 1: Rotation Control Curve) OUT -DUTY(%) External PWM-Duty Duty 100% VCT VOUT1 TON the fan is locked. Connecting the capacitor from CT pin to GND determines the shutdown time and restart time. As the fan is locked, the charge/discharge circuit will charge the CT capacitor to 3.6V by a 2.2µA source current for a locked detection time, and then the circuit will switch the capacitor to discharge. During the discharging interval, the output drivers are switched off until the CT voltage is discharged to 1.6V by a 0.22 µA sink current, and the circuit will switch the capacitor to charge. In the charging interval, the IC enters the restart time; one output is high and another is low, which makes a torque for fan rotation until the CT voltage is charged to 3.6V by a 2.2µA source current. If the locked condition still remains, the charge/ discharge process will be recurred until the locked condition is released (see Figure 2: Lock/Auto Restart Waveform). VINVIN+ VOUT2 TOFF TOFF VFG Lock Lock Detection Release Figure 2: Lock/Auto Restart Waveform Current Limit The APX9270 includes both internal and external current limiters. External current limiter value is programmed by RL which is located between VCC pin and VM pin. The external current limiter works when the voltage difference Duty 50 % Duty 0% between both sides of RL raises to be 0.48V or higher. For example, the RL=0.5 Ω , the external current limiter value is fixed and internally set at 960mA. The internal current limiter value is different in rotation mode and lock mode. It is 1.2A in rotation mode, but it decreases to 0.6A in lock mode. This feature can reduce power consumption while the fan is locked. In general application, it is TA (oC) Figure 1: Rotation Control Curve Lockup Protection and Automatic Restart The APX9270 provides the lockup protection and automatic restart functions to prevent the coil burnout while C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 10 www.anpec.com.tw APX9270 Function Description (Cont.) Current Limit (Cont.) recommended to short RL resistance and remove CM capacitor to disable external current limiter because the internal current limiter is sufficient to avoid overload. FG Output The FG pin is an open drain output connecting a pull up resistor to a high level voltage for the speed detection function. When VIN- is larger than VIN+, the VFG is low (switch on); when VIN- is smaller than VIN+, the VFG is high (switch off). Leave it open when not in using. Thermal Protection The APX9270 is designed with a thermal protection to protect the IC from the damage of over temperature. When internal junction temperature reaches 160°C, the output devices will be switched off. When the IC’ juncs tion temperature cools by 20°C, the thermal sensor will turn the output devices on again resulting in a pulsed output during continuous thermal overload. Truth Table SET L H PWM L L L L H H Input INH L H L H L H L IN+ L H L H L H L H CT OUT1 H L OFF L OFF L OFF L Output OUT2 L H L OFF L OFF L OFF FG L OFF L OFF L OFF L OFF Mode Rotation (Drive) Rotation (Regeneration) Output Regeneration Mode by External Signal Lock Mode L H SET or PWM=[L], “L” means that SET or PWM voltage is smaller than OSC voltage. Also, SET or PWM=[H], “H” means that SET or PWM voltage is greater than OSC voltage. Application Information Input Protection Diode & Capacitor The input protection diode (D1) between supply voltage and VCC pin has to be used to prevent the reverse current flowing into the supply power. However, the protection diode will cause a voltage drop on the supply voltage. The current rating of the diode must be larger than the maximum output current. For the noise reduction purpose, a capacitor (C1/CM) must be connected between VCC/VM and SGND/PGND. The C1/CM should be placed near the device VCC/VM pin as close as possible. Setting of the Oscillator Frequency and Output Voltage The oscillator is used for PWM speed control. Compare the OSC and SET pin voltages can decide PWM duty and PWM frequency depends on the oscillator frequency. The oscillator is based on internal charge/discharge circuit. The circuit charges COSC to VOSCH by a 10µA source current, and then it will discharge C OSC t o V OSCL b y 10 µA sink current. The circuit can generate a triangular waveform. The triangular waveform is determinded by COSC, R2, R3, R4, and R4. (see Typical Application Circuit) VOSCH = V 6 VREG × VOSCL = V 6 VREG × R3 R2 + R3 R5 R 4 + R5 fOSC = 0.5 × ISOC1 ( VOSCH − VOSCL) × COSC For example: COSC=100pF, R2 = R5 = 10kΩ , R3 = R4 = 20kΩ, IOSC1=10µA VOSCH= 4V, VOSCL= 2V, fOSC=25kHz The recommended OSC frequency range is from 22kHz to 32kHz. C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 11 www.anpec.com.tw APX9270 Application Information (Cont.) HB Bias Output and Hall Input Signals The IC outputs a 1.3V voltage on HB pin to provide bias for the external hall element. The IC also has two pins IN+ and IN- to receive the hall signals from the hall element. The hall signals are very weak so the layout tracks must be short and far away from those noise sources to avoid noise coupling. The hall input amplifier has 20mV hysteresis. Therefore, the recommended differential hall input voltage should be more than 60mV. CT Capacitor The capacitor that is connected from CT pin to GND determines the shutdown time and restart time. Locked Detection Time = Restart Time = CCT × (V CT1 − 0.2 V ) ICT1 Thermal Pad Consideration The thermal pad on the bottom of the TSSOP-20P package should be soldered down to a copper pad on the circuit board. Heat can be conducted away from the thermal pad through the copper plane to ambient. If the copper plane is not on the top surface of the circuit board, 8 to 10 vias of 13 mil or smaller in diameter should be used to thermally couple the thermal pad to the bottom plane. For good thermal conduction, the vias must be plated through and solder filled. The copper plane is used to conduct heat away from the thermal pad should be as large as practical. If the ambient temperature is higher than 25οC, a larger copper plane or forced-air cooling will be required to keep the APX9270 junction temperature below the thermal protection temperature (160οC). Thermal Consideration Refer to “Maximum Power Dissipation vs. Ambient Temperature”, the IC is safe to operate below the curve and it will cause the thermal protection if the operating area is above the line. For example, TA= 50οC, the SSOP20 package maximum power dissipation is about 0.95W. Power dissipation can be calculated by the following equation: CCT × (V CT1 − V CT2 ) ICT1 CCT × (V CT1 − V CT2 ) ICT2 Shutdown Time = where CCT = CT pin capacitor For example: VCC=12V, CCT=1µF Locked Detection Time = 1.545 s Restart Time = 0.909 s Shutdown Time = 9.091 s The value of charge capacitor in the range of 0.47µF to 1µF is recommended. FG Resistor The value of the FG resistor could be decided by the following equation PD = VCC − VOUT1 − VOUT2 × IOUT + VCC × ICC For example: When VCC = 12V, ICC = 6mA, IOUT = 300mA, VOUT1 = 11.66V, VOUT2 = 0.13V, then PD = 0.213W According the power dissipation issue, we could adapt this SSOP-20 package. ( ) RFG = V 6VREG − VFG IFG For example: V6VREG = 6V, IFG = 5mA, VFG = 0.2V, RFG = 1.16kΩ The value of resistor in the range of 1k Ω t o 10k Ω i s recommended. C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 12 www.anpec.com.tw APX9270 Package Information SSOP-20 D SEE VIEW A E1 E h X 45 e b c A 0. 25 A2 A1 GAUGE PLANE SEATING PLANE VIEW A 0 L S Y M B O L A A1 A2 b c D E E1 e L h 0 SSOP-20 MILLIMETERS MIN. MAX. 1.75 0.10 1.24 0.20 0.15 8.56 5.80 3.80 0.635 BSC 0.40 0.25 0° 1.27 0.50 8° 0.016 0.010 0° 0.30 0.25 8.76 6.20 4.00 0.25 0.004 0.049 0.008 0.006 0.337 0.228 0.150 0.025 BSC 0.050 0.020 8° 0.012 0.010 0.345 0.244 0.157 MIN. INCHES MAX. 0.069 0.010 Note : 1. Follow JEDEC MO-137 AD. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 13 www.anpec.com.tw APX9270 Package Information TSSOP-20P D SEE VIEW A D1 EXPOSE D PAD E2 E1 b A2 e E c 0.25 GAUGE PLANE SEATING PLANE VIEW A 0 A1 A L S Y M B O L A A1 A2 b c D D1 E E1 E2 e L 0 TSSOP-20P MILLIMETERS MIN. MAX. 1.20 0.05 0.80 0.19 0.09 6.40 2.20 6.40 BSC 4.30 1.50 0.65 BSC 0.45 0 0.75 8 0.018 0 4.50 4.00 0.169 0.059 0.026 BSC 0.030 8 0.15 1.05 0.30 0.20 6.60 5.00 0.002 0.031 0.007 0.004 0.252 0.087 0.252 BSC 0.177 0.157 MIN. INCHES MAX. 0.047 0.006 0.041 0.012 0.008 0.260 0.197 o o o o Note : 1. Follow JEDEC MO-153 ACT. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 14 www.anpec.com.tw APX9270 Carrier Tape & Reel Dimensions OD0 P0 P2 P1 A E1 F K0 B SECTION A-A T B0 A0 OD1 B A SECTION B-B d Application A 3 30 ± 2.00 H 5 0 MIN. P1 8 .0 ± 0.10 H 5 0 MIN. P1 H A T1 T1 C 1 6.4+2.00 1 3.0+0.50 - 0.00 - 0.20 P2 2 .0 ± 0.10 D0 1 .5+0.10 - 0.00 d 1 .5 MIN. D1 1 .5 MIN. D W W E1 F 7 .5 ± 0.1 K0 2 0.2 MIN. 1 6.0 ± 0.30 1 .75 ± 0.10 T 0 .6+0.00 - 0.40 D A0 B0 S SOP-20 P0 4 .0 ± 0.10 6 .40 ± 0.20 9 .00 ± 0.20 2 .10 ± 0.20 W E1 F 7 .50 ± 0.10 K0 A pplication A 3 30.0 ± 2.00 T1 C d 1 6.4+2.00 1 3.0+0.50 - 0.00 - 0.20 1 .5 MIN. P2 D0 1 .5+0.10 - 0.00 D1 2 0.2 MIN. 1 6.0 ± 0.30 1 .75 ± 0.10 T A0 6 .9 ± 0.20 B0 T SSOP-20P P0 4 .00 ± 0.10 8 .00 ± 0.10 2 .00 ± 0.10 1 .5 MIN. 0 .30 ± 0.05 6 .90 ± 0.20 1 .60 ± 0.20 ( mm) Devices Per Reel Package Type SSOP-20 TSSOP-20P Unit Tape & Reel Tape & Reel Quantity 2500 2000 C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 15 www.anpec.com.tw APX9270 Reflow Condition (IR/Convection or VPR Reflow) TP Ramp-up TL Tsmax tp Critical Zone TL to TP Temperature tL Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Time Reliability Test Program Test item S OLDERABILITY H OLT P CT T ST E SD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245 ° C, 5 sec 1000 Hrs Bias @125 °C 168 Hrs, 100% RH, 121 ° C -65 °C~150 ° C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1 tr > 1 00mA Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds See table 2 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25°C to Peak Temperature Note: All temperatures refer to topside of the package. Measured on the body surface. 16 www.anpec.com.tw C opyright © A NPEC Electronics Corp. Rev. A.3 - Jun., 2008 APX9270 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures 3 Package Thickness Volume mm