AO3162
600V,0.034A N-Channel MOSFET
General Description
Product Summary
The AO3162 is fabricated using an advanced high voltage
MOSFET process that is designed to deliver high levels
of performance and robustness in popular AC-DC
applications.
By providing low RDS(on), Ciss and Crss along with
guaranteed avalanche capability this device can be
adopted quickly into new and existing offline power supply
designs.
Top View
VDS
700V@150℃
ID (at VGS=10V)
0.034A
RDS(ON) (at VGS=10V)
< 500Ω
SOT23A
Bottom View
D
D
D
G
S
G
S
S
G
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
VGS
Gate-Source Voltage
Continuous Drain
CurrentA,F
TA=25°C
Pulsed Drain Current B
Peak diode recovery dv/dt
TA=25°C
Power Dissipation A
IDM
dv/dt
PD
TA=70°C
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead
Rev0: May 2012
C
Steady-State
Steady-State
±30
V
0.028
A
0.16
5
1.39
V/ns
W
0.89
TJ, TSTG
Symbol
t ≤ 10s
Units
V
0.034
ID
TA=70°C
Maximum
600
RθJA
RθJL
www.aosmd.com
-50 to 150
Typ
70
100
63
°C
Max
90
125
80
Units
°C/W
°C/W
°C/W
Page 1 of 5
AO3162
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
ID=250µA, VGS=0V, TJ=25°C
ID=250µA, VGS=0V, TJ=150°C
600
-
-
-
700
-
Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
BVDSS
/∆TJ
Zero Gate Voltage Drain Current
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
VGS(th)
Gate Threshold Voltage
VDS=5V, ID=8µA
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=0.016A
gFS
Forward Transconductance
VDS=40V, ID=0.016A
VSD
Diode Forward Voltage
IS=0.016A,VGS=0V
IS
Maximum Body-Diode Continuous Current
ISM
Maximum Body-Diode Pulsed Current
-
ID=250µA, VGS=0V
-
0.69
VDS=600V, VGS=0V
-
VDS=480V, TJ=125°C
-
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=25V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg
Total Gate Charge
VGS=10V, VDS=400V, ID=0.01A
V
o
-
V/ C
-
1
-
10
µA
-
-
±100
2.8
3.2
4.1
nΑ
V
-
154
500
Ω
-
0.045
-
S
-
0.74
1
V
-
-
0.034
A
-
0.16
A
-
4.2
6
pF
-
0.45
0.6
pF
-
0.05
0.07
pF
14
28
42
Ω
-
0.1
0.15
nC
-
0.03
0.05
nC
nC
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
-
0.05
0.08
tD(on)
Turn-On DelayTime
-
13.8
20
ns
tr
Turn-On Rise Time
-
10
15
ns
-
39.2
57
ns
-
13
19
ns
-
105
160
-
9.5
14.3
ns
nC
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
VGS=10V, VDS=300V, ID=0.01A,
RG=6Ω
IF=0.016A,dI/dt=100A/µs,VDS=300V
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=0.016A,dI/dt=100A/µs,VDS=300V
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in
any given application depends on the user's specific board design.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using
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