AO4452
100V N-Channel MOSFET
SDMOS TM
General Description
Product Summary
The AO4452 is fabricated with SDMOSTM trench
technology that combines excellent RDS(ON) with low gate
charge.The result is outstanding efficiency with controlled
switching behavior. This universal technology is well
suited for PWM, load switching and general purpose
applications.
VDS
ID (at VGS=10V)
100V
8A
RDS(ON) (at VGS=10V)
< 25mΩ
RDS(ON) (at VGS = 7V)
< 31mΩ
100% UIS Tested
100% Rg Tested
SOIC-8
Top View
D
D
D
Bottom View
D
D
G
G
S
S
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current
C
Units
V
±25
V
8
ID
TA=70°C
Maximum
100
6.5
A
IDM
57
Avalanche Current C
IAR
28
A
Repetitive avalanche energy L=0.1mH C
TA=25°C
EAR
39
mJ
Pulsed Drain Current
Power Dissipation B
TA=70°C
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Rev 3: May 2012
3.1
PD
TJ, TSTG
Symbol
t ≤ 10s
Steady-State
Steady-State
W
2
RθJA
RθJL
www.aosmd.com
-55 to 150
Typ
31
59
16
°C
Max
40
75
24
Units
°C/W
°C/W
°C/W
Page 1 of 6
AO4452
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=250µA, VGS=0V
100
10
TJ=55°C
50
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±25V
Gate Threshold Voltage
VDS=VGS ID=250µA
2
ID(ON)
On state drain current
VGS=10V, VDS=5V
60
nA
4
V
20.5
25
36
43
VGS=7V, ID=6.5A
25
31
mΩ
1
V
5
A
TJ=125°C
A
gFS
Forward Transconductance
VDS=5V, ID=8A
23
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.66
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
Gate Source Charge
S
1400
1770
2200
pF
115
165
215
pF
33
55
80
pF
VGS=0V, VDS=0V, f=1MHz
0.3
0.65
1.0
Ω
14
28
42
nC
4
9
14
nC
10
14
nC
VGS=10V, VDS=50V, ID=8A
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
11
16
21
42
60
78
trr
IF=8A, dI/dt=500A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=8A, dI/dt=500A/µs
IF=8A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
21
27
33
Qrr
Body Diode Reverse Recovery Charge IF=8A, dI/dt=100A/µs
20
28
36
Qrr
mΩ
VGS=0V, VDS=50V, f=1MHz
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qgs
µA
100
Static Drain-Source On-Resistance
Output Capacitance
Units
3.2
VGS=10V, ID=8A
Coss
Max
V
VDS=100V, VGS=0V
VGS(th)
RDS(ON)
Typ
6
VGS=10V, VDS=50V, RL=6Ω,
RGEN=3Ω
12
ns
4
ns
17
ns
5
ns
ns
nC
ns
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
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