AO4612
60V Complementary Enhancement
Mode Field Effect Transistor
General Description
Features
The AO4612 uses advanced trench technology MOSFETs
to provide excellent RDS(ON) and low gate charge. The
complementary MOSFETs may be used in H-bridge,
Inverters and other applications.
n-channel
VDS (V) = 60V
ID = 4.5A (VGS=10V)
p-channel
-60V
-3.2A (VGS = -10V)
RDS(ON)
< 56mW (VGS=10V)
< 77mW (VGS=4.5V)
RDS(ON)
< 105mW (VGS = -10V)
< 135mW (VGS = -4.5V)
100% Rg tested
SOIC-8
Top View
D1
D2
Bottom View
S2
G2
S1
G1
1
2
3
4
D2
D2
D1
D1
8
7
6
5
G2
G1
S2
SOIC-8
n-channel
S1
p-channel
Pin1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Pulsed Drain Current
TA=70°C
B
TA=25°C
Power Dissipation
±20
4.5
-3.2
ID
3.6
-2.6
IDM
20
-20
Junction and Storage Temperature Range
Thermal Characteristics: n-channel and p-channel
Parameter
Maximum Junction-to-Ambient A t ≤ 10s
Maximum Junction-to-Ambient A Steady-State
Steady-State
Maximum Junction-to-Lead C
Rev 4.0: August. 2019
Units
V
V
A
2
2
1.28
1.28
TJ, TSTG
-55 to 150
-55 to 150
°C
Symbol
Typ
48
74
35
Max
62.5
90
40
Units
°C/W
°C/W
°C/W
PD
TA=70°C
Max p-channel
-60
±20
TA=25°C
Continuous Drain
Current A
Max n-channel
60
RqJA
RqJL
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W
Page 1 of 9
AO4612
N Channel Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=250mA, VGS=0V
Typ
Max
60
V
VDS=48V, VGS=0V
1
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250mA
1
ID(ON)
On state drain current
VGS=10V, VDS=5V
20
TJ=55°C
VGS=10V, ID=4.5A
5
100
nA
3
V
46
56
A
Static Drain-Source On-Resistance
VGS=4.5V, ID=3A
64
gFS
Forward Transconductance
VDS=5V, ID=4.5A
11
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
mA
2.1
RDS(ON)
TJ=125°C
Units
79
77
mW
mW
S
0.74
1
V
3
A
450
pF
VGS=0V, VDS=30V, f=1MHz
60
pF
VGS=0V, VDS=0V, f=1MHz
1.65
2
W
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
8.5
12
nC
Qg(4.5V) Total Gate Charge
4.3
7
nC
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
25
VGS=10V, VDS=30V, ID=4.5A
Qgs
Gate Source Charge
Qgd
tD(on)
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
Body Diode Reverse Recovery Charge IF=4.5A, dI/dt=100A/ms
pF
1.6
nC
Gate Drain Charge
2.2
nC
Turn-On DelayTime
4.7
ns
Body Diode Reverse Recovery Time
VGS=10V, VDS=30V, RL=6.7W,
RGEN=3W
2.3
ns
15.7
ns
1.9
ns
IF=4.5A, dI/dt=100A/ms
27.5
ns
nC
32
A: The value of R qJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The value in any
a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R qJA is the sum of the thermal impedence from junction to lead R qJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 ms pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA curve
provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Rev 4.0: August. 2019
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Page 2 of 9
AO4612
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: N-CHANNEL
20
15
VDS=5V
10V
5.0V
15
125°C
ID(A)
ID (A)
10
4.5V
10
4.0V
5
5
25°C
VGS=3.5V
0
0
0
1
2
3
4
2
5
2.5
VDS (Volts)
Fig 1: On-Region Characteristics
3.5
4
4.5
5
VGS(Volts)
Figure 2: Transfer Characteristics
100
2
80
Normalized On-Resistance
90
RDS(ON) (mW)
3
VGS=4.5V
70
60
50
VGS=10V
40
30
20
0
5
10
15
VGS=10V
ID=4.5A
1.8
1.6
1.4
VGS=4.5V
ID=3.0A
1.2
1
0.8
20
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
140
1.0E+01
ID=4.5A
1.0E+00
120
100
IS (A)
RDS(ON) (mW)
125°C
1.0E-01
125°C
1.0E-02
80
25°C
1.0E-03
25°C
60
1.0E-04
40
2
4
6
8
10
1.0E-05
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Rev 4.0: August. 2019
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0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
Page 3 of 9
AO4612
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: N-CHANNEL
10
800
VDS=30V
ID= 4.5A
Capacitance (pF)
VGS (Volts)
8
6
4
2
600
Ciss
400
Coss
200
0
0
2
4
6
8
Crss
0
10
0
10
Qg (nC)
Figure 7: Gate-Charge Characteristics
30
40
50
60
VDS (Volts)
Figure 8: Capacitance Characteristics
100.0
40
RDS(ON)
limited
10ms
1.0
1ms
0.1
TJ(Max)=150°C
TA=25°C
10ms
0.1s
1s
10s
DC
1
10
20
10
0.0
0.1
TJ(Max)=150°C
TA=25°C
30
Power (W)
10.0
ID (Amps)
20
0
0.001
100
VDS (Volts)
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating
Junction-to-Ambient (Note E)
Figure 9: Maximum Forward Biased
Safe Operating Area (Note E)
ZqJA Normalized Transient
Thermal Resistance
10
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TA+PDM.ZqJA.RqJA
RqJA=62.5°C/W
1
0.1
PD
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Rev 4.0: August. 2019
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Page 4 of 9
AO4612
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
90%
+ Vdd
VDC
-
Rg
10%
Vgs
Vgs
td(on)
tr
td(off)
ton
tf
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
EAR= 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
Ig
Rev 4.0: August. 2019
Vgs
L
Isd
+ Vdd
t rr
dI/dt
I RM
Vdd
VDC
-
IF
Vds
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Page 5 of 9
AO4612
P-Channel Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=-250mA, VGS=0V
-60
-1
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS=±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=-250mA
-1
ID(ON)
On state drain current
VGS=-10V, VDS=-5V
-20
RDS(ON)
Static Drain-Source On-Resistance
TJ=55°C
VGS=-10V, ID=-3.2A
VGS=-4.5V, ID=-2.8A
gFS
Forward Transconductance
VSD
Diode Forward Voltage
IS=-1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
Units
-2.1
mA
±100
nA
-3
V
A
105
145
106
135
9
-0.73
mW
mW
S
-1
V
-3
A
930
pF
VGS=0V, VDS=-30V, f=1MHz
85
pF
VGS=0V, VDS=0V, f=1MHz
9.5
15
W
16
22
nC
8
12
nC
35
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge (10V)
Qg(4.5V) Total Gate Charge (4.5V)
-5
84
TJ=125°C
VDS=-5V, ID=-3.2A
Max
V
VDS=-48V, VGS=0V
IDSS
Coss
Typ
VGS=-10V, VDS=-30V, ID=-3.2A
pF
2.5
nC
3.2
nC
8
ns
3.8
ns
31.5
ns
7.5
ns
IF=-3.2A, dI/dt=100A/ms
27
Body Diode Reverse Recovery Charge IF=-3.2A, dI/dt=100A/ms
32
ns
nC
Body Diode Reverse Recovery Time
VGS=-10V, VDS=-30V, RL=9.4W,
RGEN=3W
A: The value of R qJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The
The value
value
in any
in aany
given
a given
application
application
depends
depends
on the
onuser's
the user's
specific
specific
board
board
design.
design.
The current
The current
rating
rating
is based
is based
on the
ont the
≤ 10s
t ≤ thermal
10s thermal
resistance rating.
resistance
B:
Repetitive
rating.
rating, pulse width limited by junction temperature.
B: Repetitive
pulse
width
limitedimpedence
by junctionfrom
temperature.
C.
The R qJA israting,
the sum
of the
thermal
junction to lead R qJL and lead to ambient.
C. The static
R qJA ischaracteristics
the sum of theinthermal
from
lead R
lead duty
to ambient.
D.
Figuresimpedence
1 to 6,12,14
arejunction
obtainedtousing
80qJL
msand
pulses,
cycle 0.5% max.
D.
The static
characteristics
Figures
1 to 6,12,14
are on
obtained
usingboard
80 mswith
pulses,
cyclein0.5%
E. These
tests
are performedinwith
the device
mounted
1 in 2 FR-4
2oz.duty
Copper,
a stillmax.
air environment with T A=25°C. The SOA
E. These
tests are
performed
with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
curve
provides
a single
pulse rating.
SOA curve provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Rev 4.0: August. 2019
www.aosmd.com
Page 6 of 9
AO4612
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: P-CHANNEL
30
20
-10V
VDS=-5V
-4.5V
25
-4.0V
10
20
-ID(A)
-ID (A)
15
-3.5V
15
10
5
125°C
VGS=-3.0V
5
0
25°C
0
0
1
2
3
4
5
1
1.5
-VDS (Volts)
Fig 1: On-Region Characteristics
3
3.5
4
Normalized On-Resistance
2
120
RDS(ON) (mW)
2.5
-VGS(Volts)
Figure 2: Transfer Characteristics
130
VGS=-4.5V
110
100
90
VGS=-10V
80
70
0
2
4
6
8
ID=-3.2A
1.8
VGS=-10V
1.6
VGS=-4.5V
1.4
ID=-2.8A
1.2
1
0.8
10
0
-ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
250
1.0E+01
ID=-3.2A
1.0E+00
125°C
200
1.0E-01
125°C
-IS (A)
RDS(ON) (mW)
2
150
100
1.0E-02
1.0E-03
1.0E-04
25°C
25°C
1.0E-05
50
2
3
4
5
6
7
8
9
10
1.0E-06
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Rev 4.0: August. 2019
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0.0
0.2
0.4
0.6
0.8
1.0
-VSD (Volts)
Figure 6: Body-Diode Characteristics
Page 7 of 9
AO4612
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: P-CHANNEL
1400
10
VDS=-30V
ID=-3.2A
1200
Ciss
Capacitance (pF)
-VGS (Volts)
8
6
4
1000
800
600
400
Coss
2
Crss
200
0
0
4
8
12
16
0
20
0
10
-Qg (nC)
Figure 7: Gate-Charge Characteristics
30
40
50
60
-VDS (Volts)
Figure 8: Capacitance Characteristics
100.0
40
TJ(Max)=150°C
TA=25°C
10ms
RDS(ON)
limited
100ms
1.0
1ms
0.1
10ms
0.1s
1s
10s
TJ(Max)=150°C
TA=25°C
30
Power (W)
10.0
-ID (Amps)
20
10
DC
0
0.001
0.0
0.1
1
10
20
100
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
-VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
ZqJA Normalized Transient
Thermal Resistance
10
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TA+PDM.ZqJA.RqJA
RqJA=62.5°C/W
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Rev 4.0: August. 2019
www.aosmd.com
Page 8 of 9
AO4612
Gate Charge Test Circuit & Waveform
Vgs
Qg
-10V
-
-
VDC
+
VDC
Qgs
Vds
Qgd
+
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
toff
ton
td(on)
Vgs
-
DUT
Vgs
td(off)
tr
tf
90%
Vdd
VDC
+
Rg
Vgs
10%
Vds
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
2
L
EAR= 1/2 LIAR
Vds
Vds
Id
-
Vgs
Vgs
VDC
+
Rg
BVDSS
Vdd
Id
I AR
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vgs
Vds Isd
Vgs
Ig
Rev 4.0: August. 2019
L
-Isd
+ Vdd
t rr
dI/dt
-I RM
Vdd
VDC
-
-I F
-Vds
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Page 9 of 9