AO4701
30V P-Channel MOSFET with Schottky Diode
General Description
Product Summary
The AO4701 uses advanced trench technology to provide
excellent RDS(ON) and low gate charge. A Schottky diode is
provided to facilitate the implementation of a bidirectional
blocking switch.
VDS
ID (at VGS=-10V)
-30V
-5A
RDS(ON) (at VGS=-10V)
< 48mΩ
RDS(ON) (at VGS =-4.5V)
< 57mΩ
RDS(ON) (at VGS =-2.5V)
< 80mΩ
100% UIS Tested
100% Rg Tested
Schottky
VDS(V)=30V, IF=3A, VF=0.5V@1A
SOIC-8
Top View
Bottom View
Top View
A
A
S
G
D
K
K
K
D
D
G
A
S
Pin1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
MOSFET
Symbol
Drain-Source Voltage
VDS
-30
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current
Pulsed Drain Current
Avalanche Current C
Avalanche energy L=0.1mH
C
Schottky reverse voltage
Continuous Forward TA=25°C
Power Dissipation
Junction and Storage Temperature Range
Thermal Characteristics
Parameter: MOSFET
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Parameter: Schottky
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Rev 5: May 2011
-25
IAS, IAR
18
EAS, EAR
16
t ≤ 10s
Steady-State
Steady-State
t ≤ 10s
Steady-State
Steady-State
A
A
mJ
30
4.4
3.2
V
A
2
2
1.3
1.3
TJ, TSTG
-55 to 150
-55 to 150
°C
Symbol
Typ
48
74
32
Max
62.5
90
40
Units
°C/W
°C/W
°C/W
49
72
31
62.5
90
40
°C/W
°C/W
°C/W
PD
TA=70°C
V
-4
IDM
IF
TA=25°C
B
Units
V
-5
VKA
TA=70°C
Current
±12
ID
TA=70°C
C
Schottky
RθJA
RθJL
RθJA
RθJL
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Page 1 of 6
AO4701
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=-250µA, VGS=0V
-30
Typ
-1
Zero Gate Voltage Drain Current
IGSS
VGS(th)
Gate-Body leakage current
VDS=0V, VGS=±12V
Gate Threshold Voltage
VDS=VGS ID=-250µA
-0.5
ID(ON)
On state drain current
VGS=-10V, VDS=-5V
-25
TJ=55°C
±100
nA
-0.9
-1.3
V
40
48
60
72
VGS=-4.5V, ID=-4A
45
57
mΩ
80
mΩ
TJ=125°C
A
RDS(ON)
Static Drain-Source On-Resistance
VGS=-2.5V, ID=-1A
60
gFS
Forward Transconductance
VDS=-5V, ID=-5A
18
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
-0.7
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Rg
Gate resistance
645
VGS=0V, VDS=-15V, f=1MHz
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
S
-1
V
-2.5
A
780
pF
80
pF
VGS=0V, VDS=0V, f=1MHz
VGS=-4.5V, VDS=-15V, ID=-5A
4
7.8
pF
Ω
12
7
nC
1.5
nC
2.5
nC
6.5
ns
VGS=-10V, VDS=-15V, RL=3Ω,
RGEN=3Ω
3.5
ns
41
ns
9
ns
IF=-5A, dI/dt=100A/µs
11
Body Diode Reverse Recovery Charge IF=-5A, dI/dt=100A/µs
3.5
ns
nC
Body Diode Reverse Recovery Time
SCHOTTKY PARAMETERS
VF
Forward Voltage Drop
IF=1A
0.45
0.5
0.007
0.05
Irm
VR=30V
VR=30V, TJ=125°C
3.2
10
VR=30V, TJ=150°C
12
37
20
CT
mΩ
55
SWITCHING PARAMETERS
Qg(4.5V) Total Gate Charge
Qgs
µA
-5
VGS=-10V, ID=-5A
Crss
Units
V
VDS=-30V, VGS=0V
IDSS
Coss
Max
Maximum reverse leakage current
Junction Capacitance
VR=15V
V
mA
pF
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
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