AO4801AL
30V Dual P-Channel MOSFET
General Description
Product Summary
The AO4801AL combines advanced trench MOSFET
technology with a low resistance package to provide
extremely low RDS(ON).This device is suitable for use as
a load switch or in PWM applications.
ID (at VGS=-10V)
-30V
-5.6A
RDS(ON) (at VGS=-10V)
< 42mΩ
VDS
RDS(ON) (at VGS = -4.5V)
< 52mΩ
RDS(ON) (at VGS = -2.5V)
< 75mΩ
100% UIS Tested
100% Rg Tested
SOIC-8
D1
D2
SOIC-8
Top View
S2
G2
S1
G1
1
2
3
4
8
7
6
5
D2
D2
D1
D1
G1
G2
S1
Absolute Maximum Ratings TA=25°C unless otherwise noted
10 Sec
Symbol
Parameter
Drain-Source Voltage
VDS
-30
Gate-Source Voltage
±12
Continuous Drain
Current
VGS
TA=25°C
IDSM
TA=70°C
Steady State
-5.6
S2
Units
V
V
-4.2
-4.5
-3.4
A
Pulsed Drain Current C
IDM
Avalanche Current C
IAS, IAR
11
A
Avalanche energy L=0.3mH C
TA=25°C
EAS, EAR
18
mJ
Power Dissipation B
PDSM
TA=70°C
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Rev 2: Dec 2010
-30
Steady-State
Steady-State
1.4
0.9
TJ, TSTG
Symbol
t ≤ 10s
2
1.3
RθJA
RθJL
www.aosmd.com
-55 to 150
Typ
48
74
32
W
°C
Max
62.5
90
40
Units
°C/W
°C/W
°C/W
Page 1 of 5
AO4801AL
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=-250µA, VGS=0V
-30
IGSS
VGS(th)
Gate-Body leakage current
VDS=0V, VGS= ±12V
Gate Threshold Voltage
VDS=VGS ID=-250µA
-0.6
ID(ON)
On state drain current
VGS=-4.5V, VDS=-5V
-25
TJ=55°C
±100
nA
-0.95
-1.3
V
34
42
48
60
VGS=-4.5V, ID=-3.5A
41
52
mΩ
VGS=-2.5V, ID=-2.5A
60
75
mΩ
14
TJ=125°C
gFS
Forward Transconductance
VDS=-5V, ID=-5.6A
VSD
Diode Forward Voltage
IS=-1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=-15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg(4.5V) Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
µA
-5
VGS=-10V, ID=-5.6A
Coss
Units
-1
Zero Gate Voltage Drain Current
Static Drain-Source On-Resistance
Max
V
VDS=-30V, VGS=0V
IDSS
RDS(ON)
Typ
VGS=-4.5V, VDS=-15V, ID=-5.6A
A
-0.74
mΩ
S
-1
V
-2
A
750
933
1120
pF
75
108
140
pF
50
81
110
pF
3
6
9
Ω
7.4
9.3
11
nC
1.2
1.5
1.8
nC
2.2
3.7
5.2
nC
5.2
VGS=-10V, VDS=-15V, RL=2.7Ω,
RGEN=6Ω
IF=-5.6A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=-5.6A, dI/dt=100A/µs
ns
6.8
ns
42
ns
15
ns
16.8
21
25.2
11.4
14.3
17.2
ns
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The value in
any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
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