AO7405
30V P-Channel MOSFET
General Description
Product Summary
VDS
The AO7405 uses advanced trench technology to
provide excellent RDS(ON), low gate charge, and
operation with gate voltages as low as 2.5V, in the
small SOT363 footprint. It can be used for a wide
variety of applications, including load switching, low
current inverters and low current DC-DC converters.
ID (at VGS=-10V)
-30V
-1.4A
RDS(ON) (at VGS=-10V)
< 115mΩ
RDS(ON) (at VGS =-4.5V)
< 140mΩ
RDS(ON) (at VGS =-2.5V)
< 200mΩ
SC70-6L
(SOT363)
D
Top View
Bottom View
Top View
D
1
6
D
D
2
5
D
G
3
4
S
G
S
Pin1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current
Pulsed Drain Current
Power Dissipation
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Rev 3: April 2011
Steady-State
Steady-State
A
0.35
W
0.22
TJ, TSTG
Symbol
t ≤ 10s
V
-10
PD
TA=70°C
±12
-1.0
IDM
TA=25°C
B
Units
V
-1.4
ID
TA=70°C
C
Maximum
-30
RθJA
RθJL
www.aosmd.com
-55 to 150
Typ
300
340
280
°C
Max
360
425
320
Units
°C/W
°C/W
°C/W
Page 1 of 5
AO7405
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=-250µA, VGS=0V
-30
-1
TJ=55°C
-5
Gate-Body leakage current
VDS=0V, VGS= ±12V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=-250µA
-0.6
ID(ON)
On state drain current
VGS=-10V, VDS=-5V
-10
VGS=-10V, ID=-1.4A
Static Drain-Source On-Resistance
TJ=125°C
92.5
115
130
160
A
mΩ
140
mΩ
mΩ
IS=-1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
6
-0.78
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Gate resistance
V
200
VDS=-5V, ID=-1.4A
Rg
nA
-1.4
110
Diode Forward Voltage
Output Capacitance
±100
-1
150
Forward Transconductance
Reverse Transfer Capacitance
µA
VGS=-2.5V, ID=-1A
VSD
Coss
Units
VGS=-4.5V, ID=-1.2A
gFS
Crss
Max
V
VDS=-30V, VGS=0V
IGSS
RDS(ON)
Typ
260
VGS=0V, VDS=-15V, f=1MHz
S
-1
V
-0.5
A
315
pF
37
pF
20
pF
8
12
Ω
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
5.9
7.2
nC
Qg(4.5V) Total Gate Charge
2.8
3.5
nC
Qgs
Gate Source Charge
Qgd
tD(on)
tr
Turn-On Rise Time
VGS=0V, VDS=0V, f=1MHz
VGS=-10V, VDS=-15V, ID=-1.4A
4
0.7
nC
Gate Drain Charge
1
nC
Turn-On DelayTime
6
ns
3.5
ns
VGS=-10V, VDS=-15V, RL=10Ω,
RGEN=3Ω
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
20
ns
5
ns
trr
Body Diode Reverse Recovery Time
IF=-1.4A, dI/dt=100A/µs
11.5
Qrr
Body Diode Reverse Recovery Charge IF=-1.4A, dI/dt=100A/µs
4.5
15
ns
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedance from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
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