AO8820
20V Common-Drain Dual N-Channel MOSFET
General Description
Product Summary
The AO8820 uses advanced trench technology to provide
excellent RDS(ON), low gate charge and operation with gate
voltages as low as 1.8V while retaining a 12V VGS(MAX)
rating. It is ESD protected. This device is suitable for use
as a uni-directional or bi-directional load switch, facilitated
by its common-drain configuration.
VDS
20V
7A
ID (at VGS=10V)
RDS(ON) (at VGS=10V)
< 21mΩ
RDS(ON) (at VGS=4.5V)
< 24mΩ
RDS(ON) (at VGS=3.6V)
< 28mΩ
RDS(ON) (at VGS=2.5V)
< 32mΩ
RDS(ON) (at VGS=1.8V)
< 50mΩ
ESD protected!
Top View
Top View
D1/D2
S1
S1
G1
1
2
3
4
8
7
6
5
D1/D2
S2
S2
G2
G2
G1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25°C
TA=25°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Rev 7: April. 2012
Steady-State
Steady-State
V
A
1.5
W
0.96
TJ, TSTG
Symbol
t ≤ 10s
±12
30
PD
Junction and Storage Temperature Range
Units
V
5.5
IDM
TA=70°C
Maximum
20
7
ID
TA=70°C
Pulsed Drain Current C
Power Dissipation B
S2
S1
Pin 1
Continuous Drain
Current
D2
D1
TSSOP8
Bottom View
RθJA
RθJL
www.aosmd.com
-55 to 150
Typ
64
89
53
°C
Max
83
120
70
Units
°C/W
°C/W
°C/W
Page 1 of 5
AO8820
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=250µA, VGS=0V
TJ=55°C
Gate-Body leakage current
VDS=0V, VGS= ±10V
VDS=VGS ID=250µA
0.5
ID(ON)
On state drain current
VGS=10V, VDS=5V
30
VGS=10V, ID=7A
13
TJ=125°C
10
µA
0.8
1.1
V
17.2
21
24
29
A
VGS=4.5V, ID=6.6A
15
19.4
24
VGS=3.6V, ID=6A
16
20.7
28
VGS=2.5V, ID=5.5A
18
VGS=1.8V, ID=2A
25
32
35
50
gFS
Forward Transconductance
VDS=5V, ID=7A
25
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.65
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VGS=0V, VDS=10V, f=1MHz
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
µA
5
Gate Threshold Voltage
mΩ
S
1
V
2.5
A
500
pF
100
pF
52
pF
6
VGS=4.5V, VDS=10V, ID=7A
Units
V
1
VGS(th)
Static Drain-Source On-Resistance
Max
20
VDS=16V, VGS=0V
IGSS
RDS(ON)
Typ
9
nC
2
nC
Qgd
Gate Drain Charge
1
nC
tD(on)
Turn-On DelayTime
0.2
us
tr
Turn-On Rise Time
1.5
us
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
Qrr
VGS=5V, VDS=10V, RL=1.4Ω,
RGEN=3Ω
7.4
us
18
us
IF=7A, dI/dt=100A/µs
9
Body Diode Reverse Recovery Charge IF=7A, dI/dt=100A/µs
10
ns
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
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