AOB10B60D
600V, 10A Alpha IGBT TM with Diode
General Description
Product Summary
The Alpha IGBTTM line of products offers best-in-class
performance in conduction and switching losses, with
robust short circuit capability. They are designed for ease
of paralleling, minimal gate spike under high dV/dt
conditions and resistance to oscillations. The soft copackage diode is targeted for minimal losses in motor
control applications.
VCE
IC (TC=100°C)
600V
10A
VCE(sat) (TC=25°C)
1.53V
Top View
C
TO-263
D2PAK
C
G
E
E
G
AOB10B60D
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Collector-Emitter Voltage
V CE
Gate-Emitter Voltage
V GE
Continuous Collector TC=25°C
TC=100°C
Current
IC
Pulsed Collector Current, Limited by TJmax
I CM
Turn off SOA, VCE ≤ 600V, Limited by TJmax
I LM
Continuous Diode
Forward Current
TC=25°C
TC=100°C
AOB10B60D
600
Units
V
±20
V
20
10
40
A
40
A
20
IF
A
10
A
Diode Pulsed Current, Limited by TJmax
I FM
40
A
Short circuit withstanding time VGE = 15V, VCE
≤ 400V, Delay between short circuits ≥ 1.0s,
TC=25°C
t SC
10
µs
TC=25°C
Power Dissipation
TC=100°C
Junction and Storage Temperature Range
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient
Maximum IGBT Junction-to-Case
Maximum Diode Junction-to-Case
Rev.1.0: Nov 2013
PD
T J , T STG
TL
Symbol
R θ JA
R θ JC
R θ JC
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163
82
W
-55 to 150
°C
300
°C
AOB10B60D
65
0.92
Units
°C/W
°C/W
1.7
°C/W
Page 1 of 9
AOB10B60D
Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
Conditions
STATIC PARAMETERS
BV CES
Collector-Emitter Breakdown Voltage
V CE(sat)
VF
V GE(th)
I CES
Min
IC=250µA, VGE=0V, TJ=25°C
VGE=15V, IC=10A
Collector-Emitter Saturation Voltage
VGE=0V, IC=10A
Diode Forward Voltage
VCE=600V, VGE=0V
Zero Gate Voltage Collector Current
Max
Units
V
600
-
-
TJ=25°C
-
1.53
1.8
TJ=125°C
-
1.75
-
TJ=150°C
-
1.81
-
TJ=25°C
-
1.52
1.85
TJ=125°C
-
1.48
-
TJ=150°C
-
1.44
-
-
5.6
-
TJ=25°C
-
-
10
TJ=125°C
-
-
200
TJ=150°C
-
-
2000
VCE=VGE, IC=250µA
Gate-Emitter Threshold Voltage
Typ
V
V
V
µA
I GES
Gate-Emitter leakage current
VCE=0V, VGE=±20V
-
-
±100
nA
g FS
Forward Transconductance
VCE=20V, IC=10A
-
4.8
-
S
-
824
-
pF
-
68
-
pF
DYNAMIC PARAMETERS
C ies
Input Capacitance
VGE=0V, VCE=25V, f=1MHz
C oes
Output Capacitance
C res
Reverse Transfer Capacitance
-
2.7
-
pF
Qg
Total Gate Charge
-
17.4
-
nC
Q ge
Gate to Emitter Charge
VGE=15V, VCE=480V, IC=10A
-
6.2
-
nC
Gate to Collector Charge
Short circuit collector current, Max.
1000 short circuits, Delay between
VGE=15V, VCE=400V, RG=30Ω
I C(SC)
short circuits ≥ 1.0s
VGE=0V, VCE=0V, f=1MHz
Rg
Gate resistance
SWITCHING PARAMETERS, (Load Iductive, TJ=25°C)
-
6.3
-
nC
-
43
-
A
-
3.2
-
Ω
t D(on)
Turn-On DelayTime
-
10
-
ns
tr
Turn-On Rise Time
-
15
-
ns
t D(off)
Turn-Off Delay Time
-
72
-
ns
tf
Turn-Off Fall Time
-
8.8
-
ns
Q gc
TJ=25°C
VGE=15V, VCE=400V, IC=10A,
RG=30Ω,
Parasitic Ιnductance=100nH
E on
Turn-On Energy
-
0.26
-
mJ
E off
Turn-Off Energy
-
0.07
-
mJ
E total
t rr
Total Switching Energy
-
0.33
-
mJ
Diode Reverse Recovery Time
-
105
-
Q rr
Diode Reverse Recovery Charge
-
0.25
-
ns
µC
Diode Peak Reverse Recovery Current
SWITCHING PARAMETERS, (Load Iductive, TJ=175°C)
-
5
-
A
t D(on)
Turn-On DelayTime
-
10.4
-
ns
tr
Turn-On Rise Time
-
15.6
-
ns
t D(off)
Turn-Off Delay Time
-
91
-
ns
tf
Turn-Off Fall Time
-
10.4
-
ns
E on
Turn-On Energy
-
0.35
-
mJ
E off
Turn-Off Energy
-
0.16
-
mJ
E total
t rr
Total Switching Energy
-
0.51
-
mJ
Diode Reverse Recovery Time
-
194
-
Q rr
Diode Reverse Recovery Charge
-
0.55
-
ns
µC
I rm
Diode Peak Reverse Recovery Current
-
6.3
-
A
TJ=25°C
IF=10A,dI/dt=200A/µs,VCE=400V
I rm
TJ=150°C
VGE=15V, VCE=400V, IC=10A,
RG=30Ω,
Parasitic Inductance=100nH
TJ=150°C
IF=10A,dI/dt=200A/µs,VCE=400V
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev.1.0: Nov 2013
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Page 2 of 9
AOB10B60D
□
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
70
60
20V
20V
60
15V
15V
40
IC (A)
IC (A)
50
17V
50
17V
40
13V
13V
30
30
20
VGE= 7V
10
11V
20
9V
10
11V
9V
VGE=7V
0
0
0
1
2
3
4
5
6
7
0
VCE(V)
Fig 1: Output Characteristic
(Tj=25°C )
1
2
3
4
5
6
7
VCE(V)
Fig 2: Output Characteristic
(Tj=150°C )
50
50
VCE=20V
-40°C
-40°C
40
40
150°C
30
30
150°C
IF (A)
20
20
10
10
0
25°C
0
4
7
10
13
0.0
16
VGE(V)
Fig 3: Transfer Characteristic
VCE(sat) (V)
Time (µ
µS)
IC=20A
IC=10A
2
1
1.0
1.5
2.0
2.5
3.0
VF (V)
Fig 4: Diode Characteristic
4
3
0.5
IC=5A
45
45
40
40
35
35
30
30
25
25
20
20
15
15
10
10
5
5
0
0
0
0
25
50
75
100
125
150
175
Temperature (°C)
Fig 5: Collector-Emitter Saturation Voltage vs.
Junction Temperature
Rev.1.0: Nov 2013
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Current(A)
IC (A)
25°C
5
8
11
14
17
20
VGE (V)
Fig 6: VGE vs. Short Circuit Time
(VCE=400V,TC=25°C )
Page 3 of 9
AOB10B60D
□
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
10000
VCE=480V
IC=10A
12
Cies
9
Capacitance (pF)
VGE (V)
1000
6
3
Coes
100
10
0
Cres
1
0
4
8
12
16
20
0
5
Qg(nC)
Fig 7: Gate-Charge Characteristics
10
15
20
25
30
35
40
VCE(V)
Fig 8: Capacitance Characteristic
Ic (A)
100
10
1
150
20
120
16
Current rating IC(A)
Power Disspation (W)
10
90
60
30
0
100
VCE (V)
Fig 10: Reverse Bias SOA
(Tj=150°C,VGE=15V)
1,000
12
8
4
0
25
50
75
100
125
150
TCASE(°C)
Fig 11: Power Disspation as a Function of Case
Rev.1.0: Nov 2013
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25
50
75
100
125
150
TCASE(°C)
Fig 12: Current De-rating
Page 4 of 9
AOB10B60D
≤
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10,000
Td(off)
Tf
Td(on)
Tr
Td(off)
Tf
Switching Time (nS)
Switching Time (nS)
1000
100
10
Tr
100
10
1
1
0
5
10
15
20
IC (A)
Figure 13: Switching Time vs. IC
(Tj=150°C,VGE=15V,VCE=400V,Rg=30Ω
Ω)
1000
25
0
50
100
150
200
250
300
Rg (Ω
Ω)
Figure 14: Switching Time vs. Rg
(Tj=150°C,VGE=15V,VCE=400V,IC=10A)
350
10
Td(off)
Tf
Td(on)
Tr
8
100
VGE(TH)(V)
Switching Time (nS)
Td(on)
1,000
6
4
10
2
0
1
0
100
150
TJ (°C)
Figure 15: Switching Time vs.Tj
( VGE=15V,VCE=400V,IC=10A,Rg=30Ω
Ω)
Rev.1.0: Nov 2013
50
200
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0
30
60
90
TJ (°C)
Figure 16: VGE(TH) vs. Tj
120
150
Page 5 of 9
AOB10B60D
≤
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1.5
1.5
Eoff
Eoff
SwitchIng Energy (mJ)
1.2
Switching Energy (mJ)
Eon
Etotal
0.9
0.6
0.3
Eon
1.2
Etotal
0.9
0.6
0.3
0
0.0
0
5
10
15
20
IC (A)
Figure 17: Switching Loss vs. IC
(Tj=150°C,VGE=15V,VCE=400V,Rg=30Ω
Ω)
25
0
0.8
100
200
300
Rg (Ω
Ω)
Figure 18: Switching Loss vs. Rg
(Tj=150°C,VGE=15V,VCE=400V,IC=10A)
1.0
Eoff
Eoff
Eon
0.6
Eon
0.8
Etotal
Switching Energ y (mJ)
Switching Energy (mJ)
400
0.4
0.2
0
Etotal
0.6
0.4
0.2
0.0
0
25
75
100
125
150
TJ (°C)
Figure 19: Switching Loss vs. Tj
(VGE=15V,VCE=400V,IC=10A,Rg=30Ω
Ω)
Rev.1.0: Nov 2013
50
175
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200
250
300
350
400
450
VCE (V)
Figure 20: Switching Loss vs. VCE
(Tj=150°C,VGE=15V,IC=10A,Rg=30Ω
Ω)
500
Page 6 of 9
AOB10B60D
□
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1.E-03
2.2
15A
1.E-04
1.7
10A
VSD (V)
5A
IF=1A
1.E-06
VCE=400V
0.7
1.E-07
1.E-08
0.2
0
25
50
75
100
125
150
175
0
50
75
100
125
150
Temperature (°C )
Fig 22: Diode Forward voltage vs. Junction
Temperature
Temperature (°C )
Fig 21: Diode Reverse Leakage Current vs.
Junction Temperature
1000
100
900
90
150°C
60
Qrr
500
50
400
40
300
30
25°C
200
25°C
0
150
150°C
2
25°C
0
0
0
5
10
15
20
25
IS (A)
Fig 24: Diode Reverse Recovery Time and Softness
Factor vs. Conduction Current
(VGE=15V,VCE=400V, di/dt=200A/µ
µs)
20
200
80
70
150°C
160
16
Qrr
50
400
40
300
30
25°C
200
20
150°C
Irm
100
25°C
0
100
200
80
25°C
Trr
8
S
150°C
40
4
10
0
25°C
0
300
400 500 600 700 800 900
di/dt (A/µ
µS)
Fig 25: Diode Reverse Recovery Charge and Peak
Current vs. di/dt
(VGE=15V,VCE=400V,IF=10A)
Rev.1.0: Nov 2013
12
120
S
500
Trr (nS)
60
Irm(A)
Qrr (nC)
600
4
50
0
5
10
15
20
25
IF(A)
Fig 23: Diode Reverse Recovery Charge and Peak
Current vs. Conduction Current
(VGE=15V,VCE=400V, di/dt=200A/µ
µs)
150°C
6
25°C
10
800
8
S
0
700
Trr
100
20
Irm
150°C
10
150°C
200
Trr (nS)
70
600
175
12
250
80
700
25
300
Irm(A)
Qrr (nC)
800
100
13V
1.2
S
ICE(S) (A)
VCE=600V
1.E-05
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100
200
300
0
400
500 600 700 800 900
di/dt (A/µ
µS)
Fig 26: Diode Reverse Recovery Time and Softness
Factor vs. di/dt
(VGE=15V,VCE=400V,IF=10A)
Page 7 of 9
AOB10B60D
□
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
Zθ JC Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=0.92°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PD
0.01
Ton
T
Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 27: Normalized Maximum Transient Thermal Impedance for IGBT
Zθ JC Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=1.7°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PD
0.01
Single Pulse
Ton
T
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 28: Normalized Maximum Transient Thermal Impedance for Diode
Rev.1.0: Nov 2013
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Page 8 of 9
AOB10B60D
Rev.1.0: Nov 2013
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Page 9 of 9