AOB20C60PL

AOT20C60P/AOB20C60P 600V,20A N-Channel MOSFET General Description Product Summary • Trench Power AlphaMOS-II technology • Low RDS(ON) • Low Ciss and Crss • High Current Capability VDS @ Tj,max 700V IDM 80A RDS(ON),max < 0.26Ω Qg,typ 52nC Eoss @ 400V 8.2µJ Applications 100% UIS Tested 100% Rg Tested • General Lighting for LED and CCFL • AC/DC Power supplies for Industrial, Consumer, and Telecom TO-263 D2PAK D TO-220 G D D S AOT20C60P S G G S AOB20B60P Orderable Part Number Package Type Form Minimum Order Quantity AOT20C60PL AOB20C60PL TO-220 Green TO-263 Green Tube Tape & Reel 1000 800 Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Drain-Source Voltage Symbol VDS Gate-Source Voltage Continuous Drain Current VGS TC=25°C TC=100°C Pulsed Drain Current C Avalanche Current C ID IDM L=1mH Maximum 600 Units V ±30 V 20 16 A 80 IAR 20 A Repetitive avalanche energy C EAR 200 mJ Single pulsed avalanche energy G MOSFET dv/dt ruggedness Peak diode recovery dv/dt TC=25°C Power Dissipation B Derate above 25°C Junction and Storage Temperature Range Maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds EAS 1599 100 20 463 3.7 -55 to 150 mJ W W/°C °C 300 °C Maximum Units Thermal Characteristics Parameter Maximum Junction-to-Ambient A,D Maximum Case-to-sink A Maximum Junction-to-Case Rev.2.0: January 2015 dv/dt PD TJ, TSTG TL Symbol RθJA RθCS RθJC www.aosmd.com V/ns 65 °C/W 0.5 0.27 °C/W °C/W Page 1 of 6 Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter Conditions Min ID=250µA, VGS=0V, TJ=25°C 600 Typ Max Units STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage BVDSS /∆TJ Breakdown Voltage Temperature Coefficient IDSS Zero Gate Voltage Drain Current ID=250µA, VGS=0V, TJ=150°C 700 ID=250µA, VGS=0V 0.54 VDS=600V, VGS=0V 1 10 Gate-Body leakage current VDS=0V, VGS=±30V VDS=5V, ID=250µA RDS(ON) VGS=10V, ID=10A gFS Forward Transconductance VDS=40V, ID=10A 20 VSD Diode Forward Voltage IS=1A,VGS=0V 0.7 IS ISM ±100 nA 5 V 0.225 0.26 Ω 1 V Maximum Body-Diode Continuous Current 20 A Maximum Body-Diode Pulsed Current C 80 A Coss Output Capacitance Co(er) Effective output capacitance, energy related H Crss Effective output capacitance, time related I Reverse Transfer Capacitance Rg Gate resistance VGS=0V, VDS=100V, f=1MHz Gate Source Charge S 3607 pF 140 pF 95 pF 182 pF 3.3 pF 2 Ω VGS=0V, VDS=0 to 480V, f=1MHz VGS=0V, VDS=100V, f=1MHz f=1MHz SWITCHING PARAMETERS Qg Total Gate Charge Qgs 3 µA 3.8 DYNAMIC PARAMETERS Input Capacitance Ciss Co(tr) V/ oC VDS=480V, TJ=125°C Gate Threshold Voltage Static Drain-Source On-Resistance IGSS VGS(th) V 52 VGS=10V, VDS=480V, ID=20A 80 nC 20 nC Qgd Gate Drain Charge 14 nC tD(on) Turn-On DelayTime 77 ns tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf trr Body Diode Reverse Recovery Time Qrr Body Diode Reverse Recovery Charge IF=20A,dI/dt=100A/µs,VDS=100V VGS=10V, VDS=300V, ID=20A, RG=25Ω 67 ns 120 ns 43 ns IF=20A,dI/dt=100A/µs,VDS=100V 599 ns µC Turn-Off Fall Time 11 A. The value of R θJA is measured with the device in a still air environment with T A =25°C. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using