AOD294A/AOI294A
100V N-Channel AlphaSGT TM
General Description
Product Summary
VDS
• Trench Power AlphaSGTTM technology
• Low RDS(ON)
• Logic Level Driving
• Excellent QG x RDS(ON) Product (FOM)
• Pb-Free lead Plating, RoHS and Halogen-Free
Compliant
Applications
ID (at VGS=10V)
100V
55A
RDS(ON) (at VGS=10V)
< 12mΩ
RDS(ON) (at VGS=4.5V)
< 15.5mΩ
100% UIS Tested
100% Rg Tested
• High Frequency Switching and Synchronous
Recfification
TO-251A
IPAK
TO-252
DPAK
Top View
Top View
Bottom View
D
Bottom View
D
D
G
S
S
G
G
AOD294A
D
S
S
D
G
G
S
AOI294A
Orderable Part Number
Package Type
Form
Minimum Order Quantity
AOD294A
AOI294A
TO-252
TO-251A
Tape & Reel
Tube
2500
4000
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
Gate-Source Voltage
Continuous Drain
Current
VGS
TC=25°C
Pulsed Drain Current C
TA=25°C
Continuous Drain
Avalanche energy
VDS Spike
I
Power Dissipation B
L=0.1mH
C
10μs
TC=25°C
TA=25°C
Power Dissipation A
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Case
Rev.3.0: August 2020
IAS
25
A
EAS
31
mJ
VSPIKE
120
V
AD
73
t ≤ 10s
Steady-State
Steady-State
RqJA
RqJC
W
30
6.2
W
4.0
TJ, TSTG
Symbol
A
A
13
PDSM
TA=70°C
A
16
PD
TC=100°C
V
138
IDSM
Avalanche Current C
±20
35
IDM
TA=70°C
Current
Units
V
55
ID
TC=100°C
Maximum
100
-55 to 150
Typ
15
40
1.35
www.aosmd.com
Max
20
50
1.7
°C
Units
°C/W
°C/W
°C/W
Page 1 of 6
AOD294A/AOI294A
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=250mA, VGS=0V
100
Typ
Zero Gate Voltage Drain Current
IGSS
VGS(th)
Gate-Body leakage current
VDS=0V, VGS=±20V
Gate Threshold Voltage
VDS=VGS, ID=250mA
1
TJ=55°C
1.5
±100
nA
2.0
2.5
V
10
12
18
22
15.5
RDS(ON)
Static Drain-Source On-Resistance
VGS=4.5V, ID=20A
12
gFS
Forward Transconductance
VDS=5V, ID=20A
67
VSD
Diode Forward Voltage
IS=1A, VGS=0V
0.71
IS
Maximum Body-Diode Continuous Current
TJ=125°C
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
μA
5
VGS=10V, ID=20A
Coss
Units
V
VDS=100V, VGS=0V
IDSS
Max
VGS=0V, VDS=50V, f=1MHz
mΩ
mΩ
S
1
V
55
A
2305
pF
180
pF
11.5
pF
0.5
1.0
Ω
SWITCHING PARAMETERS
Qg(10V)
Total Gate Charge
32.5
50
nC
Qg(4.5V)
Total Gate Charge
15.5
25
nC
Qgs
Gate Source Charge
Qgd
f=1MHz
VGS=10V, VDS=50V, ID=20A
0.2
6.5
nC
Gate Drain Charge
5
nC
tD(on)
Turn-On DelayTime
7
ns
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
3
ns
27
ns
4
ns
IF=20A, di/dt=500A/ms
29.5
Body Diode Reverse Recovery Charge IF=20A, di/dt=500A/ms
160
ns
nC
Body Diode Reverse Recovery Time
VGS=10V, VDS=50V, RL=2.5W,
RGEN=3W
A. The value of RqJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The Power
dissipation PDSM is based on R qJA t≤ 10s and the maximum allowed junction temperature of 150°C. The value in any given application depends on
the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C. Single pulse width limited by junction temperature TJ(MAX)=150°C.
D. The RqJA is the sum of the thermal impedance from junction to case RqJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using or equal to 4.5V
Figure 9: Maximum Forward Biased
Safe Operating Area (Note F)
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toCase (Note F)
ZqJC Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TC+PDM.ZqJC.RqJC
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RqJC=1.7°C/W
1
0.1
PDM
Single Pulse
Ton
T
0.01
1E-05
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Rev.3.0: August 2020
www.aosmd.com
Page 4 of 6
AOD294A/AOI294A
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
60
50
Current rating I D (A)
Power Dissipation (W)
80
60
40
20
40
30
20
10
0
0
0
25
50
75
100
125
150
0
TCASE (°C)
Figure 12: Power De-rating (Note F)
25
50
75
100
125
150
TCASE (°C)
Figure 13: Current De-rating (Note F)
10000
TA=25°C
Power (W)
1000
100
10
1
1E-05
0.001
0.1
10
1000
ZqJA Normalized Transient
Thermal Resistance
Pulse Width (s)
Figure 14: Single Pulse Power Rating Junction-to-Ambient (Note H)
10
D=Ton/T
TJ,PK=TA+PDM.ZqJA.RqJA
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RqJA=50°C/W
0.1
0.01
PDM
Single Pulse
Ton
0.001
0.0001
0.001
0.01
0.1
1
10
T
100
1000
Pulse Width (s)
Figure 15: Normalized Maximum Transient Thermal Impedance (Note H)
Rev.3.0: August 2020
www.aosmd.com
Page 5 of 6
AOD294A/AOI294A
Figure
A: Charge
Gate Charge
Test Circuit
& Waveforms
Gate
Test Circuit
& Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
-
DUT
Vgs
Ig
Charge
Figure B:Resistive
ResistiveSwitching
Switching Test
Test Circuit
Circuit&&Waveforms
Waveforms
RL
Vds
Vds
DUT
Vgs
90%
+ Vdd
VDC
-
Rg
10%
Vgs
Vgs
td(on)
tr
td(off)
ton
tf
toff
Figure C:
Unclamped
InductiveSwitching
Switching (UIS)
(UIS) Test
Unclamped
Inductive
Test Circuit
Circuit&&Waveforms
Waveforms
L
2
EAR= 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Figure
D: Recovery
Diode Recovery
Test Circuit
& Waveforms
Diode
Test Circuit
& Waveforms
Q rr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
Ig
Rev.3.0: August 2020
Vgs
L
Isd
+ Vdd
t rr
dI/dt
I RM
Vdd
VDC
-
IF
Vds
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Page 6 of 6
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