AOL1206
30V N-Channel MOSFET
General Description
Product Summary
The AOL1206 uses trench MOSFET technology that is
uniquely optimized to provide the most efficient high
frequency switching performance.Power losses are
minimized due to an extremely low combination of RDS(ON)
and Crss.In addition,switching behavior is well controlled
with a "Schottky style" soft recovery body diode.
VDS
RDS(ON) (at VGS=10V)
30V
54A
< 6m:
RDS(ON) (at VGS = 4.5V)
< 8.5m:
ID (at VGS=10V)
100% UIS Tested
100% Rg Tested
UltraSO-8
Top View
TM
D
Bottom View
D
G
S
G
G
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
Continuous Drain
Current G
TC=25°C
Pulsed Drain Current
C
Avalanche Current C
Avalanche energy L=0.1mH
C
TC=25°C
Power Dissipation
B
TA=25°C
Power Dissipation A
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
AD
Maximum Junction-to-Ambient
Maximum Junction-to-Case
Rev0 : Feb 2010
IAS, IAR
30
A
EAS, EAR
45
mJ
62
Steady-State
Steady-State
W
31
2.7
RTJA
RTJC
www.aosmd.com
W
1.7
TJ, TSTG
Symbol
t 10s
A
13
PDSM
TA=70°C
A
16
PD
TC=100°C
V
250
IDSM
TA=70°C
±20
42
IDM
TA=25°C
Continuous Drain
Current
Units
V
54
ID
TC=100°C
Maximum
30
-55 to 175
Typ
16
38
2
°C
Max
20
46
2.4
Units
°C/W
°C/W
°C/W
Page 1 of 6
AOL1206
Electrical Characteristics (T J=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Conditions
Min
ID=250PA, VGS=0V
VDS=30V, VGS=0V
Zero Gate Voltage Drain Current
5
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±20V
Gate Threshold Voltage
On state drain current
VDS=VGS ID=250PA
1.3
VGS=10V, VDS=5V
250
RDS(ON)
Static Drain-Source On-Resistance
100
VGS=10V, ID=20A
TJ=125°C
VGS=4.5V, ID=15A
Forward Transconductance
VSD
Diode Forward Voltage
IS=1A,VGS=0V
G
Maximum Body-Diode Continuous Current
VDS=5V, ID=20A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qg(4.5V) Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
VGS=10V, VDS=15V, ID=20A
Units
V
1
TJ=55°C
gFS
Max
30
VGS(th)
ID(ON)
IS
Typ
1.8
2.3
PA
nA
V
A
5
6
7.4
9
6.8
8.5
70
0.7
m:
m:
S
1
V
54
A
1110
1390
1670
pF
350
510
670
pF
32
53
90
pF
0.4
0.9
1.5
:
15.5
19.6
23.5
nC
7
8.7
10.5
nC
2.8
3.6
4.5
nC
1.8
3
4.2
nC
6
VGS=10V, VDS=15V, RL=0.75:,
RGEN=3:
ns
2
ns
20
ns
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
IF=20A, dI/dt=500A/Ps
12
15
18
Qrr
Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/Ps
30
37
45
3.5
ns
ns
nC
2
A. The value of RTJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R TJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on
the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep initial
TJ =25°C.
D. The RTJA is the sum of the thermal impedence from junction to case RTJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
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