AOT430 N-Channel Enhancement Mode Field Effect Transistor
General Description
The AOT430 uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. This device is suitable for use in PWM, load switching and general purpose applications. Standard Product AOT430 is Pb-free (meets ROHS & Sony 259 specifications).
Features
VDS (V) = 75V ID = 80 A (VGS = 10V) RDS(ON) < 11.5mΩ (VGS = 10V)
UIS TESTED!
TO-220 D
Top View Drain Connected to Tab
G S
G
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol VDS Drain-Source Voltage VGS Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Avalanche Current
C C C
Maximum 75 ±25 80 78 200 45 300 268 134 -55 to 175
Units V V A A mJ W °C
TC=25°C TC=100°C
G
ID IDM IAR EAR PD TJ, TSTG
Repetitive avalanche energy L=0.3mH TC=25°C Power Dissipation B TC=100°C
Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Case B
Steady-State Steady-State
Symbol RθJA RθJC
Typ 45 0.45
Max 60 0.56
Units °C/W °C/W
Alpha & Omega Semiconductor, Ltd.
AOT430
Electrical Characteristics (T J=25°C unless otherwise noted) Parameter Symbol STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS IGSS VGS(th) ID(ON) RDS(ON) gFS VSD IS Zero Gate Voltage Drain Current Gate-Body leakage current Gate Threshold Voltage On state drain current Static Drain-Source On-Resistance Conditions ID=250uA, VGS=0V VDS=60V, VGS=0V TJ=55°C VDS=0V, VGS=±25V VDS=VGS, ID=250µA VGS=10V, VDS=5V VGS=10V, ID=30A TJ=125°C 2 200 9.8 16.0 90 0.7 1 80 4700 VGS=0V, VDS=30V, f=1MHz VGS=0V, VDS=0V, f=1MHz 400 180 3 114 VGS=10V, VDS=30V, ID=30A 33 18 21 VGS=10V, VDS=30V, RL=1Ω, RGEN=3Ω IF=30A, dI/dt=100A/µs 39 70 24 53 143 11.5 19.0 2.7 Min 75 1 5 1 4 Typ Max Units V µA uA V A mΩ S V A pF pF pF Ω nC nC nC ns ns ns ns ns nC
VDS=5V, ID=80A Transconductance Diode Forward Voltage IS=1A, VGS=0V Maximum Body-Diode Continuous Current G
DYNAMIC PARAMETERS Ciss Input Capacitance Coss Crss Rg Output Capacitance Reverse Transfer Capacitance Gate resistance
SWITCHING PARAMETERS Qg(10V) Total Gate Charge Qgs Gate Source Charge Qgd tD(on) tr tD(off) tf trr Qrr Gate Drain Charge Turn-On DelayTime Turn-On Rise Time Turn-Off DelayTime Turn-Off Fall Time Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=30A, dI/dt=100A/µs
A: The value of R θJA is measured with the device in a still air environment with T A =25°C. B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using
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