AOTF16N50

AOT16N50/AOTF16N50 500V, 16A N-Channel MOSFET General Description Product Summary The AOT16N50 & AOTF16N50 have been fabricated using an advanced high voltage MOSFET process that is designed to deliver high levels of performance and robustness in popular AC-DC applications. By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability these parts can be adopted quickly into new and existing offline power supply designs. VDS TO-220 G D Top View ID (at VGS=10V) 600V@150℃ 16A RDS(ON) (at VGS=10V) < 0.37W 100% UIS Tested 100% Rg Tested TO-220F D G G D S S AOT16N50 S AOTF16N50 Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol AOT16N50 Drain-Source Voltage VDS 500 Gate-Source Voltage ±30 VGS TC=25°C Continuous Drain Current Pulsed Drain Current TC=100°C C ID AOTF16N50 V 16 16* 11 11* IDM Units V A 64 Avalanche Current C IAR 6 A Repetitive avalanche energy C EAR 540 mJ Single plused avalanche energy G Peak diode recovery dv/dt TC=25°C B Power Dissipation Derate above 25oC EAS dv/dt 1080 5 mJ V/ns W Junction and Storage Temperature Range Maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds Thermal Characteristics Parameter Maximum Junction-to-Ambient A,D TJ, TSTG PD 50.0 0.4 -55 to 150 W/ oC °C 300 °C TL Symbol RqJA RqCS AOT16N50 65 AOTF16N50 65 Units °C/W 0.5 0.45 -2.5 °C/W °C/W Maximum Case-to-sink A Maximum Junction-to-Case RqJC * Drain current limited by maximum junction temperature. Rev.4.0: January 2021 278 2.2 www.aosmd.com Page 1 of 6 AOT16N50/AOTF16N50 Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter Conditions Min ID=250μA, VGS=0V, TJ=25°C 500 Typ Max Units STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage BVDSS /∆TJ Breakdown Voltage Temperature Coefficient IDSS Zero Gate Voltage Drain Current IGSS Gate-Body leakage current VDS=0V, VGS=±30V VGS(th) VDS=5V, ID=250mA RDS(ON) Gate Threshold Voltage Static Drain-Source On-Resistance gFS Forward Transconductance VSD Diode Forward Voltage IS=1A,VGS=0V IS ISM ID=250μA, VGS=0V, TJ=150°C 600 V ID=250μA, VGS=0V 0.5 V/ C o VDS=500V, VGS=0V 1 VDS=400V, TJ=125°C 10 ±100 mA 4 4.5 nA V VGS=10V, ID=8A 0.29 0.37 W VDS=40V, ID=8A 20 3.3 S 1 V Maximum Body-Diode Continuous Current 16 A Maximum Body-Diode Pulsed Current 64 A DYNAMIC PARAMETERS Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance 0.71 1531 1914 2297 pF 153 191 229 pF 11 16 20 pF VGS=0V, VDS=0V, f=1MHz 1.75 3.5 5.3 W 34 42.8 51 nC VGS=10V, VDS=400V, ID=16A 7.5 9.3 11 nC 16 20.3 24 nC VGS=0V, VDS=25V, f=1MHz SWITCHING PARAMETERS Qg Total Gate Charge Qgs Gate Source Charge Qgd Gate Drain Charge tD(on) Turn-On DelayTime tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf trr Turn-Off Fall Time IF=16A,dI/dt=100A/ms,VDS=100V 265 334 400 Qrr Body Diode Reverse Recovery Charge IF=16A,dI/dt=100A/ms,VDS=100V 4.5 6 7.5 Body Diode Reverse Recovery Time VGS=10V, VDS=250V, ID=16A, RG=25W 44 ns 84 ns 92 ns 50 ns ns mC A. The value of R qJA is measured with the device in a still air environment with T A =25°C. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The R qJA is the sum of the thermal impedance from junction to case R qJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using