AOTF7T60
600V,7A N-Channel MOSFET
General Description
Product Summary
• Latest Trench Power AlphaMOS-II technology
• Low RDS(ON)
• Low Ciss and Crss
• High Current Capability
• RoHS and Halogen Free Compliant
VDS @ Tj,max
700V
IDM
28A
RDS(ON),max
< 1.1Ω
Applications
Qg,typ
16nC
Eoss @ 400V
2.5µJ
100% UIS Tested
100% Rg Tested
• General Lighting for LED and CCFL
• AC/DC Power supplies for Industrial, Consumer, and
Telecom
Top View
TO-220F
D
G
AOTF7T60
G
D
S
S
Orderable Part Number
Package Type
Form
Minimum Order Quantity
AOTF7T60
AOTF7T60L
TO-220F Pb Free
TO-220F Green
Tube
Tube
1000
1000
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
AOTF7T60
Symbol
Drain-Source Voltage
VDS
VGS
Gate-Source Voltage
Continuous Drain
Current
TC=25°C
TC=100°C
AOTF7T60L
600
±30
7*
ID
Units
V
V
7*
5*
5*
A
Pulsed Drain Current C
IDM
Avalanche Current C,J
IAR
7
A
Repetitive avalanche energy C,J
EAR
25
mJ
270
50
5
mJ
28
Single pulsed avalanche energy G
EAS
MOSFET dv/dt ruggedness
dv/dt
Peak diode recovery dv/dt
TC=25°C
PD
Power Dissipation B
Derate above 25oC
Junction and Storage Temperature Range
TJ, TSTG
Maximum lead temperature for soldering
TL
purpose, 1/8" from case for 5 seconds
Thermal Characteristics
Parameter
Symbol
RθJA
Maximum Junction-to-Ambient A,D
Maximum Junction-to-Case
RθJC
* Drain current limited by maximum junction temperature.
Rev.2.0 October 2013
V/ns
38
29
W
0.3
0.2
-55 to 150
W/ oC
°C
300
°C
AOTF7T60
AOTF7T60L
Units
65
3.3
65
4.3
°C/W
°C/W
www.aosmd.com
Page 1 of 6
AOTF7T60
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
ID=250µA, VGS=0V, TJ=25°C
600
Typ
Max
Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
BVDSS
/∆TJ
Breakdown Voltage Temperature
Coefficient
IDSS
Zero Gate Voltage Drain Current
ID=250µA, VGS=0V, TJ=150°C
700
V
ID=250µA, VGS=0V
0.58
V/ oC
VDS=600V, VGS=0V
1
VDS=480V, TJ=125°C
10
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
VGS(th)
Gate Threshold Voltage
VDS=5V, ID=250µA
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=3.5A
gFS
Forward Transconductance
VDS=40V, ID=3.5A
6.3
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.77
IS
ISM
4
5
nΑ
V
0.92
1.1
Ω
1
V
Maximum Body-Diode Continuous Current
7
A
Maximum Body-Diode Pulsed Current C
28
A
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
Output Capacitance
Co(er)
Effective output capacitance, energy
related H
Crss
Effective output capacitance, time
related I
Reverse Transfer Capacitance
Rg
Gate resistance
Co(tr)
±100
µA
3
S
962
pF
38
pF
30
pF
51
pF
VGS=0V, VDS=100V, f=1MHz
6.3
pF
f=1MHz
3.7
Ω
VGS=10V, VDS=480V, ID=7A
5.6
nC
VGS=0V, VDS=100V, f=1MHz
VGS=0V, VDS=0 to 480V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
Qg
16
24
nC
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
4
nC
tD(on)
Turn-On DelayTime
27
ns
tr
Turn-On Rise Time
40
ns
tD(off)
Turn-Off DelayTime
VGS=10V, VDS=300V, ID=7A,
RG=25Ω
38
ns
tf
trr
Turn-Off Fall Time
27
ns
IF=7A,dI/dt=100A/µs,VDS=100V
426
Qrr
Body Diode Reverse Recovery Charge IF=7A,dI/dt=100A/µs,VDS=100V
ns
µC
Body Diode Reverse Recovery Time
5
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial
TJ =25°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
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