AOTS32338C
30V N-Channel MOSFET
General Description
Product Summary
• Trench Power MOSFET technology
• Low RDS(ON)
• Low Gate Charge
• RoHS and Halogen-Free Compliant
ID (at VGS=10V)
30V
3.8A
RDS(ON) (at VGS=10V)
< 50mΩ
RDS(ON) (at VGS=4.5V)
< 57mΩ
RDS(ON) (at VGS=2.5V)
< 72mΩ
VDS
ESD protection
Applications
• Ideal for Load Switching
D
TSOP6
Top View
D
Bottom View
Top View
G1
1
6
D1
S2
2
5
S1
G2
3
4
D2
G
G
S
S
Pin1
Orderable Part Number
Package Type
Form
Minimum Order Quantity
AOTS32338C
TSOP-6
Tape & Reel
3000
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current
Pulsed Drain Current C
Power Dissipation
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Rev.1.0: January 2019
Steady-State
Steady-State
RqJA
RqJL
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A
1.2
W
0.8
TJ, TSTG
Symbol
t ≤ 10s
V
22
PD
TA=70°C
±12
2.9
IDM
TA=25°C
B
Units
V
3.8
ID
TA=70°C
Maximum
30
-55 to 150
Typ
82
111
56
°C
Max
100
140
70
Units
°C/W
°C/W
°C/W
Page 1 of 5
AOTS32338C
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=250μA, VGS=0V
Zero Gate Voltage Drain Current
IGSS
VGS(th)
Gate-Body leakage current
VDS=0V, VGS=±12V
Gate Threshold Voltage
VDS=VGS, ID=250mA
V
TJ=55°C
±10
μA
1
1.5
V
40
50
58
73
VGS=4.5V, ID=3.6A
42
57
mΩ
VGS=2.5V, ID=3.2A
50
72
mΩ
0.5
TJ=125°C
Forward Transconductance
VDS=5V, ID=3.8A
20
VSD
Diode Forward Voltage
IS=1A, VGS=0V
0.7
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
μA
5
gFS
Coss
Units
1
VGS=10V, ID=3.8A
Static Drain-Source On-Resistance
Max
30
VDS=30V, VGS=0V
IDSS
RDS(ON)
Typ
VGS=0V, VDS=15V, f=1MHz
mΩ
S
1
V
2
A
340
pF
30
pF
25
pF
8
12
Ω
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
8
16
nC
Qg(4.5V) Total Gate Charge
4
8
nC
f=1MHz
VGS=10V, VDS=15V, ID=3.8A
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
Body Diode Reverse Recovery Charge IF=3.8A, di/dt=500A/ms
Body Diode Reverse Recovery Time
VGS=10V, VDS=15V, RL=3.95W,
RGEN=3W
IF=3.8A, di/dt=500A/ms
4
1
nC
1.2
nC
2.5
ns
3
ns
30
ns
5
ns
5.5
ns
nC
4
A. The value of RqJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RqJA is the sum of the thermal impedance from junction to lead RqJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using or equal to 4.5V
Figure 9: Maximum Forward Biased
Safe Operating Area (Note F)
100
0.1
1E-05
0.001
0.1
10
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
ZqJA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZqJA.RqJA
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RqJA=140°C/W
0.1
PDM
0.01
Single Pulse
Ton
T
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Rev.1.0: January 2019
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Page 4 of 5
AOTS32338C
Figure
A: Charge
Gate Charge
Test Circuit
& Waveforms
Gate
Test Circuit
& Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
-
DUT
Vgs
Ig
Charge
Figure B:
ResistiveSwitching
Switching Test
Test Circuit
Resistive
Circuit &&Waveforms
Waveforms
RL
Vds
Vds
DUT
Vgs
90%
+ Vdd
VDC
-
Rg
10%
Vgs
Vgs
td(on)
tr
td(off)
ton
tf
toff
Figure C:
Unclamped
InductiveSwitching
Switching (UIS)
(UIS) Test
Unclamped
Inductive
Test Circuit
Circuit&&Waveforms
Waveforms
L
2
EAR= 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Figure
D:Recovery
Diode Recovery
Test Circuit
& Waveforms
Diode
Test Circuit
& Waveforms
Q rr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
Ig
Rev.1.0: January 2019
Vgs
L
Isd
+ Vdd
t rr
dI/dt
I RM
Vdd
VDC
-
IF
Vds
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Page 5 of 5
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