AOW15S60/AOWF15S60
600V 15A α MOS TM Power Transistor
General Description
Product Summary
The AOW15S60 & AOWF15S60 have been fabricated
using the advanced αMOSTM high voltage process that is
designed to deliver high levels of performance and
robustness in switching applications.
By providing low RDS(on), Qg and EOSS along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply
designs.
VDS @ Tj,max
700V
IDM
63A
RDS(ON),max
0.29Ω
Qg,typ
16nC
Eoss @ 400V
3.6µJ
100% UIS Tested
100% Rg Tested
TO-262
Top View
TO-262F
Top View
Bottom View
G
D
S
S
D
D
Bottom View
G
G
S
D
G
AOWF15S60
AOW15S60
S
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
AOW15S60
Parameter
Symbol
Drain-Source Voltage
VDS
600
Gate-Source Voltage
Continuous Drain
Current
VGS
TC=25°C
TC=100°C
AOWF15S60
±30
15
ID
Units
V
V
15*
10
10*
A
Pulsed Drain Current C
IDM
63
Avalanche Current C
IAR
2.4
A
Repetitive avalanche energy C
EAR
86
mJ
Single pulsed avalanche energy G
TC=25°C
Power Dissipation B Derate above 25oC
MOSFET dv/dt ruggedness
Peak diode recovery dv/dt H
Junction and Storage Temperature Range
EAS
PD
173
27.8
W
1.67
0.22
W/ oC
100
20
-55 to 150
dv/dt
TJ, TSTG
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds J
TL
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A,D
Symbol
RθJA
V/ns
°C
300
°C
AOW15S60
AOWF15S60
65
65
°C/W
0.5
0.6
-4.5
°C/W
°C/W
RθCS
Maximum Case-to-sink A
Maximum Junction-to-Case
RθJC
* Drain current limited by maximum junction temperature.
Rev 0: Aug 2011
mJ
208
www.aosmd.com
Units
Page 1 of 6
AOW15S60/AOWF15S60
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
ID=250µA, VGS=0V, TJ=25°C
ID=250µA, VGS=0V, TJ=150°C
Units
600
-
-
650
700
-
V
µA
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VDS=600V, VGS=0V
-
-
1
VDS=480V, TJ=150°C
-
10
-
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
VGS(th)
Gate Threshold Voltage
VDS=5V,ID=250µA
RDS(ON)
Static Drain-Source On-Resistance
VSD
Diode Forward Voltage
IS
ISM
-
±100
3.2
3.8
nΑ
V
VGS=10V, ID=7.5A, TJ=25°C
-
0.254
0.29
Ω
VGS=10V, ID=7.5A, TJ=150°C
-
0.68
0.78
Ω
IS=7.5A,VGS=0V, TJ=25°C
-
0.83
-
V
Maximum Body-Diode Continuous Current
-
-
15
A
Maximum Body-Diode Pulsed CurrentC
-
-
63
A
-
717
-
pF
-
58
-
pF
-
41.2
-
pF
-
125.2
-
pF
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
Output Capacitance
Co(er)
Effective output capacitance, energy
related H
Crss
Effective output capacitance, time
related I
Reverse Transfer Capacitance
Rg
Gate resistance
Co(tr)
2.5
VGS=0V, VDS=100V, f=1MHz
VGS=0V, VDS=0 to 480V, f=1MHz
VGS=0V, VDS=100V, f=1MHz
-
1.3
-
pF
VGS=0V, VDS=0V, f=1MHz
-
13.4
-
Ω
-
15.6
-
nC
-
3.5
-
nC
nC
SWITCHING PARAMETERS
Total Gate Charge
Qg
VGS=10V, VDS=480V, ID=7.5A
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
-
6.0
-
tD(on)
Turn-On DelayTime
-
24.5
-
ns
tr
Turn-On Rise Time
-
22
-
ns
-
84
-
ns
-
24
-
ns
IF=7.5A,dI/dt=100A/µs,VDS=400V
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
VGS=10V, VDS=400V, ID=7.5A,
RG=25Ω
Body Diode Reverse Recovery Time
Peak Reverse Recovery Current
-
282
-
ns
Irm
IF=7.5A,dI/dt=100A/µs,VDS=400V
-
26
-
Qrr
Body Diode Reverse Recovery Charge IF=7.5A,dI/dt=100A/µs,VDS=400V
-
4.5
-
A
µC
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ
=25°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
