AOW25S65/AOWF25S65
650V 25A α MOS TM Power Transistor
General Description
Product Summary
The AOW25S65 & AOWF25S65 have been fabricated
using the advanced αMOSTM high voltage process that is
designed to deliver high levels of performance and
robustness in switching applications.
By providing low RDS(on), Qg and EOSS along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply
designs.
VDS @ Tj,max
750V
IDM
104A
RDS(ON),max
0.19Ω
Qg,typ
26.4nC
Eoss @ 400V
5.8µC
100% UIS Tested
100% Rg Tested
TO-262
TO-262F
D
Top View
Bottom View
Top View
Bottom View
G
G
D
S
S
D
G
S
G
AOW25S65
D
S
D
G
S
AOWF25S65
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
AOW25S65
Symbol
Drain-Source Voltage
VDS
650
Gate-Source Voltage
±30
Continuous Drain
Current
VGS
TC=25°C
TC=100°C
AOWF25S65
25
ID
IDM
V
25*
16
Pulsed Drain Current C
Units
V
16*
A
104
Avalanche Current C
IAR
7
A
Repetitive avalanche energy C
EAR
96
mJ
Single pulsed avalanche energy G
TC=25°C
Power Dissipation B Derate above 25oC
MOSFET dv/dt ruggedness
Peak diode recovery dv/dt H
Junction and Storage Temperature Range
EAS
750
PD
W
2.9
0.22
W/ oC
100
20
-55 to 150
TJ, TSTG
TL
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A,D
Symbol
RθJA
V/ns
°C
300
°C
AOW25S65
AOWF25S65
Units
65
65
°C/W
0.5
0.35
-4.5
°C/W
°C/W
RθCS
Maximum Case-to-sink A
Maximum Junction-to-Case
RθJC
* Drain current limited by maximum junction temperature.
Rev0: Dec 2011
28
dv/dt
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds J
mJ
357
www.aosmd.com
Page 1 of 6
AOW25S65/AOWF25S65
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
ID=250µA, VGS=0V, TJ=25°C
650
-
-
ID=250µA, VGS=0V, TJ=150°C
700
750
-
V
µA
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VDS=650V, VGS=0V
-
-
1
VDS=520V, TJ=150°C
-
10
-
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
-
-
±100
VGS(th)
Gate Threshold Voltage
VDS=5V,ID=250µA
2.6
3.3
4
nΑ
V
RDS(ON)
Static Drain-Source On-Resistance
VSD
Diode Forward Voltage
IS
ISM
VGS=10V, ID=12.5A, TJ=25°C
-
0.165
0.19
Ω
VGS=10V, ID=12.5A, TJ=150°C
-
0.47
0.53
Ω
IS=7.5A,VGS=0V, TJ=25°C
-
0.84
-
V
Maximum Body-Diode Continuous Current
-
-
25
A
Maximum Body-Diode Pulsed CurrentC
-
-
104
A
-
1278
-
pF
-
87
-
pF
-
64.5
-
pF
-
236.7
-
pF
VGS=0V, VDS=100V, f=1MHz
-
1.4
-
pF
VGS=0V, VDS=0V, f=1MHz
-
4.9
-
Ω
-
26.4
-
nC
-
6.2
-
nC
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
Output Capacitance
Co(er)
Effective output capacitance, energy
related H
Crss
Effective output capacitance, time
related I
Reverse Transfer Capacitance
Rg
Gate resistance
Co(tr)
VGS=0V, VDS=100V, f=1MHz
VGS=0V, VDS=0 to 480V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
Qg
VGS=10V, VDS=480V, ID=12.5A
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
-
9.5
-
nC
tD(on)
Turn-On DelayTime
-
29
-
ns
tr
Turn-On Rise Time
-
30
-
ns
tD(off)
Turn-Off DelayTime
-
112
-
ns
tf
trr
Turn-Off Fall Time
-
34
-
ns
IF=12.5A,dI/dt=100A/µs,VDS=400V
VGS=10V, VDS=400V, ID=12.5A,
RG=25Ω
Body Diode Reverse Recovery Time
Peak Reverse Recovery Current
-
408
-
ns
Irm
IF=12.5A,dI/dt=100A/µs,VDS=400V
-
33
-
Qrr
Body Diode Reverse Recovery Charge IF=12.5A,dI/dt=100A/µs,VDS=400V
-
8.27
-
A
µC
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ
=25°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
